J. R. Lloyd

3.9k total citations
122 papers, 3.0k citations indexed

About

J. R. Lloyd is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, J. R. Lloyd has authored 122 papers receiving a total of 3.0k indexed citations (citations by other indexed papers that have themselves been cited), including 108 papers in Electrical and Electronic Engineering, 106 papers in Electronic, Optical and Magnetic Materials and 23 papers in Mechanics of Materials. Recurrent topics in J. R. Lloyd's work include Copper Interconnects and Reliability (105 papers), Electronic Packaging and Soldering Technologies (70 papers) and Semiconductor materials and devices (61 papers). J. R. Lloyd is often cited by papers focused on Copper Interconnects and Reliability (105 papers), Electronic Packaging and Soldering Technologies (70 papers) and Semiconductor materials and devices (61 papers). J. R. Lloyd collaborates with scholars based in United States, Germany and Taiwan. J. R. Lloyd's co-authors include E. Liniger, J. J. Clement, M. Shatzkes, Michael Lane, Carl V. Thompson, T. M. Shaw, S. Nakahara, R. H. Koch, P. McLaughlin and Kaushik Chanda and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

J. R. Lloyd

120 papers receiving 2.9k citations

Peers

J. R. Lloyd
Kristof Croes Belgium
Zsolt Tökei Belgium
Zs. Tôkei Belgium
E. Kolawa United States
Gerald Beyer Belgium
M. A. Korhonen United States
E. G. Colgan United States
T. Nakamura Japan
T. Paul Chow United States
Wouter Ruythooren Belgium
Kristof Croes Belgium
J. R. Lloyd
Citations per year, relative to J. R. Lloyd J. R. Lloyd (= 1×) peers Kristof Croes

Countries citing papers authored by J. R. Lloyd

Since Specialization
Citations

This map shows the geographic impact of J. R. Lloyd's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. R. Lloyd with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. R. Lloyd more than expected).

Fields of papers citing papers by J. R. Lloyd

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. R. Lloyd. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. R. Lloyd. The network helps show where J. R. Lloyd may publish in the future.

Co-authorship network of co-authors of J. R. Lloyd

This figure shows the co-authorship network connecting the top 25 collaborators of J. R. Lloyd. A scholar is included among the top collaborators of J. R. Lloyd based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. R. Lloyd. J. R. Lloyd is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hauschildt, Meike, et al.. (2024). A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 47. 10A.4–1. 1 indexed citations
2.
3.
Lloyd, J. R., et al.. (2019). Stress Migration Followed by Electromigration Reliability Testing. 1–5. 3 indexed citations
4.
Shen, Mingyue, et al.. (2017). Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects. SHILAP Revista de lepidopterología. 3(1). 21 indexed citations
5.
Lloyd, J. R., et al.. (2017). Effect of Microstructure and Anisotropy of Copper on Reliability in Nanoscale Interconnects. IEEE Transactions on Device and Materials Reliability. 17(1). 69–79. 17 indexed citations
6.
Zhang, Zhenjun, et al.. (2016). Reverse degradation of nickel graphene junction by hydrogen annealing. AIP Advances. 6(2). 4 indexed citations
7.
Lloyd, J. R., et al.. (2015). Effects of electrical bias and temperature stress on the negative magnetoresistance of a low-k dielectric. Journal of Applied Physics. 118(22). 2 indexed citations
8.
Zhang, Zhenjun, et al.. (2015). Characterization of magnetic Ni clusters on graphene scaffold after high vacuum annealing. Materials Chemistry and Physics. 170. 175–179. 16 indexed citations
9.
Lloyd, J. R., et al.. (2013). TSV and Cu-Cu direct bond wafer and package-level reliability. 41–48. 10 indexed citations
10.
Lloyd, J. R., et al.. (2013). Thermally induced void growth in through-silicon vias. Journal of Micro/Nanolithography MEMS and MOEMS. 12(2). 23010–23010. 3 indexed citations
11.
Lloyd, J. R., Kong Boon Yeap, Ehrenfried Zschech, et al.. (2011). Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias. Journal of Applied Physics. 110(5). 31 indexed citations
12.
Ohring, Milton & J. R. Lloyd. (2009). Reliability and Failure of Electronic Materials and Devices, Second Edition. 2 indexed citations
13.
Edelstein, D., Kaushik Chanda, E. Liniger, et al.. (2009). Integration and reliability of CVD Ru cap for Cu/Low-k development. 255–257. 3 indexed citations
14.
Wu, Albert T., J. R. Lloyd, Nobumichi Tamura, & K. N. Tu. (2005). Microstructure evolution of tin under electromigration studied by synchrotron X-Ray \nmicro-diffraction. eScholarship (California Digital Library). 1 indexed citations
15.
Wu, Albert T., Nobumichi Tamura, J. R. Lloyd, C. R. Kao, & K. N. Tu. (2005). Synchrotron X-ray Micro-diffraction Analysis on Microstructure Evolution in Sn under Electromigration. MRS Proceedings. 863. 2 indexed citations
16.
Lloyd, J. R., et al.. (1999). Copper metallization reliability. Microelectronics Reliability. 39(11). 1595–1602. 136 indexed citations
17.
Clement, J. J., et al.. (1992). Electromigration Reliability of VLSI Interconnect.. 4. 114–125. 5 indexed citations
18.
Lloyd, J. R.. (1991). Electromigration failure. Journal of Applied Physics. 69(11). 7601–7604. 90 indexed citations
19.
Lloyd, J. R., et al.. (1983). Electromigration Failure in Thin Film Silicides and Polysilicon/Silicide (Polycide) Structures. Reliability physics. 198–202. 1 indexed citations
20.
Lloyd, J. R., M.R. Polcari, & Gordon A. Mackenzie. (1980). Observation of electromigration in heavily doped polycrystalline silicon thin films. Applied Physics Letters. 36(6). 428–430. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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