Suresh Ramalingam
- Hardware and Architecture top 10%
-
- 3D IC and TSV technologies 34
- Electronic Packaging and Soldering Technologies 23
- Electromagnetic Compatibility and Noise Suppression 5
- Semiconductor materials and devices 5
- VLSI and FPGA Design Techniques 4
- Advancements in Photolithography Techniques 3
- Electrical and Thermal Properties of Materials 3
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 5
- Co-authors
- K. V. NagarajanBahareh BanijamaliR. C. ArmstrongLiam MaddenNam‐Hoon KimGamal Refai-AhmedTom LeeEphrem Wu
- Journals
- IEEE Electron Device Letters (1 paper)Journal of Rheology (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)
- Partner nations
- United StatesUnited KingdomTaiwan
In The Last Decade
Suresh Ramalingam
37 papers receiving 527 citations
Peers
Comparison fields: 5 of 34
- Hardware and Architecture 60
- Electrical and Electronic Engineering 513
- Automotive Engineering 63
- Fluid Flow and Transfer Processes 18
- Electronic, Optical and Magnetic Materials 50
Countries citing papers authored by Suresh Ramalingam
This map shows the geographic impact of Suresh Ramalingam's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Suresh Ramalingam with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Suresh Ramalingam more than expected).
Fields of papers citing papers by Suresh Ramalingam
This network shows the impact of papers produced by Suresh Ramalingam. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Suresh Ramalingam. The network helps show where Suresh Ramalingam may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Suresh Ramalingam, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 1 | |
| 2 | 2022 | 1 | |
| 3 | 2020 | 1 | |
| 4 | 2018 | 25 | |
| 5 | 2018 | 1 | |
| 6 | 2018 | 1 | |
| 7 | 2018 | 2 | |
| 8 | 2017 | 3 | |
| 9 | 2016 | 10 | |
| 10 | 2016 | 15 | |
| 11 | 2015 | 3 | |
| 12 | 2015 | 2 | |
| 13 | 2015 | 12 | |
| 14 | 3D-ICs: Advances in the Industry | 2014 | 6 |
| 15 | 2013 | 15 | |
| 16 | 2013 | 9 | |
| 17 | 2012 | 18 | |
| 18 | 2011 | 128 | |
| 19 | 2011 | 24 | |
| 20 | 1993 | 23 |
About Suresh Ramalingam
Suresh Ramalingam is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Fluid Flow and Transfer Processes, having authored 38 papers that have together received 563 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (23 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Semiconductor materials and devices (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), VLSI and FPGA Design Techniques (4 papers), Advancements in Photolithography Techniques (3 papers) and Electrical and Thermal Properties of Materials (3 papers). The work is most often cited by research in Hardware and Architecture (60 citations), Electrical and Electronic Engineering (513 citations) and Automotive Engineering (63 citations). Suresh Ramalingam has collaborated with scholars based in United States, United Kingdom and Taiwan. Frequent co-authors include K. V. Nagarajan, Bahareh Banijamali, R. C. Armstrong, Liam Madden, Nam‐Hoon Kim, Gamal Refai-Ahmed, Tom Lee, Ephrem Wu, Scott McCann and Jonathan Chang. Their work appears in journals such as IEEE Electron Device Letters, Journal of Rheology and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.