P. McLaughlin

804 total citations
31 papers, 496 citations indexed

About

P. McLaughlin is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, P. McLaughlin has authored 31 papers receiving a total of 496 indexed citations (citations by other indexed papers that have themselves been cited), including 27 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 2 papers in Mechanics of Materials. Recurrent topics in P. McLaughlin's work include Copper Interconnects and Reliability (25 papers), Semiconductor materials and devices (25 papers) and Electronic Packaging and Soldering Technologies (12 papers). P. McLaughlin is often cited by papers focused on Copper Interconnects and Reliability (25 papers), Semiconductor materials and devices (25 papers) and Electronic Packaging and Soldering Technologies (12 papers). P. McLaughlin collaborates with scholars based in United States, Germany and India. P. McLaughlin's co-authors include Tarıq Samad, F. Chen, J. R. Lloyd, J. Gill, Kaushik Chanda, J. Aitken, T. Sullivan, O. Martı́nez, C E Doige and Bruce G. McLaughlin and has published in prestigious journals such as Applied Physics Letters, IEEE Electron Device Letters and Journal of Process Control.

In The Last Decade

P. McLaughlin

29 papers receiving 463 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
P. McLaughlin United States	13	391	295	46	43	33	31	496
Manfred Albach Germany	11	668 1.7×	237 0.8×	73 1.6×	34 0.8×	17 0.5×	60	716
Jia Tzer Hsu United States	8	270 0.7×	73 0.2×	66 1.4×	28 0.7×	17 0.5×	8	336
Themistoklis D. Kefalas Greece	13	431 1.1×	383 1.3×	143 3.1×	29 0.7×	30 0.9×	36	566
H. A. Owen United States	12	539 1.4×	191 0.6×	102 2.2×	42 1.0×	8 0.2×	48	592
A. Sharma United States	6	327 0.8×	29 0.1×	26 0.6×	33 0.8×	10 0.3×	8	362
Marie‐Ange Raulet France	9	166 0.4×	217 0.7×	41 0.9×	59 1.4×	15 0.5×	23	314
Emil Cazacu Romania	10	181 0.5×	150 0.5×	60 1.3×	24 0.6×	42 1.3×	77	280
H.C. Lovatt Australia	15	591 1.5×	249 0.8×	405 8.8×	22 0.5×	46 1.4×	44	698
C.K. Lim South Korea	9	289 0.7×	81 0.3×	13 0.3×	107 2.5×	77 2.3×	24	405

Countries citing papers authored by P. McLaughlin

Since Specialization

Citations

This map shows the geographic impact of P. McLaughlin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. McLaughlin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. McLaughlin more than expected).

Fields of papers citing papers by P. McLaughlin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by P. McLaughlin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. McLaughlin. The network helps show where P. McLaughlin may publish in the future.

Co-authorship network of co-authors of P. McLaughlin

This figure shows the co-authorship network connecting the top 25 collaborators of P. McLaughlin. A scholar is included among the top collaborators of P. McLaughlin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with P. McLaughlin. P. McLaughlin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Hawksworth, Stuart, et al.. (2019). Operation of UK gas appliances with hydrogen blended natural gas. 1 indexed citations

Li, Baozhen, et al.. (2018). Electromigration characteristics of power grid like structures. 4F.3–1. 5 indexed citations

Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Transactions. 80(4). 297–309. 2 indexed citations

Muralidhar, R., et al.. (2017). A stochastic model for impact of LER on BEOL TDDB. 11. DG–4.1. 5 indexed citations

Sun, Xiaoxuan, B. Peethala, Marinus Hopstaken, et al.. (2017). Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications. ECS Meeting Abstracts. MA2017-02(26). 1122–1122.

Yang, C.-C., T. Spooner, P. McLaughlin, et al.. (2016). Pre-liner dielectric nitridation for resistance reduction in copper interconnects. 89–91. 4 indexed citations

Huang, Huai, R. Patlolla, Wei Wang, et al.. (2016). Ruthenium interconnect resistivity and reliability at 48 nm pitch. 31–33. 38 indexed citations

Wu, Ernest Y., et al.. (2014). Analysis of applying time-dependent clustering model to BEOL TDDB. 219–222. 11 indexed citations

McLaughlin, P., et al.. (2011). A charge transport based acceleration model for interlevel dielectric breakdown. BD.2.1–BD.2.5. 2 indexed citations

10.

Chen, F., M. Shinosky, J. Aitken, et al.. (2011). Invasion percolation model for abnormal TDDB characteristic of ULK dielectrics with Cu interconnect at advanced technology nodes. 2F.2.1–2F.2.8. 5 indexed citations

11.

Li, Baozhen, et al.. (2010). Statistical Evaluation of Electromigration Reliability at Chip Level. IEEE Transactions on Device and Materials Reliability. 11(1). 86–91. 22 indexed citations

12.

Hu, Chao, L. Gignac, E. Liniger, et al.. (2009). Electromigration Challenges for Nanoscale Cu Wiring. AIP conference proceedings. 3–11. 12 indexed citations

13.

McLaughlin, P., Lynne Gignac, E. Liniger, et al.. (2008). Enhanced Electromigration in Cu Interconnects Using Upper Level Dummy Vias. ECS Meeting Abstracts. MA2008-02(28). 2071–2071. 1 indexed citations

14.

Chen, F., P. McLaughlin, J. Gambino, et al.. (2007). The Effect of Metal Area and Line Spacing on TDDB Characteristics of 45nm Low-k SiCOH Dielectrics. 47. 382–389. 26 indexed citations

15.

Chen, Fen, P. McLaughlin, & Kaushik Chanda. (2007). Nondestructive electrical characterization of integrated interconnect line-to-line spacing for advanced semiconductor chips. Applied Physics Letters. 91(19). 4 indexed citations

16.

McLaughlin, P., et al.. (2007). A Comparison of Voltage Ramp and Time Dependent Dielectric Breakdown Tests for Evaluation of 45nm Low-k SiCOH Reliability. 52. 120–122. 1 indexed citations

17.

Samad, Tarıq, et al.. (2006). SYSTEM ARCHITECTURE FOR PROCESS AUTOMATION: REVIEW AND TRENDS. IFAC Proceedings Volumes. 39(2). 1–11. 3 indexed citations

18.

Chen, F., O. Martı́nez, Kaushik Chanda, et al.. (2006). A Comprehensive Study of Low-k SiCOH TDDB Phenomena and Its Reliability Lifetime Model Development. 46–53. 119 indexed citations

19.

Li, Baozhen, J. Gill, C. Christiansen, Timothy D. Sullivan, & P. McLaughlin. (2005). Impact of via-line contact on CU interconnect electromigration performance. 24–30. 19 indexed citations

20.

McLaughlin, Bruce G., C E Doige, & P. McLaughlin. (1986). Thyroid hormone levels in foals with congenital musculoskeletal lesions.. PubMed. 27(7). 264–7. 30 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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