Bahgat Sammakia
- Mechanical Engineering top 0.5%
- Heat Transfer and Optimization 185
- Heat Transfer and Boiling Studies 101
- Heat Transfer Mechanisms 41
- Computational Mechanics top 0.5%
- Hardware and Architecture top 5%
- Biomedical Engineering top 2%
- Nanofluid Flow and Heat Transfer 25
- Building and Construction top 2%
- Building Energy and Comfort Optimization 26
-
- Electronic Packaging and Soldering Technologies 44
- 3D IC and TSV technologies 38
-
- Thermal properties of materials 34
- Co-authors
- B. GebhartM. M. YovanovichYogesh JaluriaRoop L. MahajanRoger SchmidtBruce T. MurraySaurabh ShrivastavaSrikanth Rangarajan
- Journals
- Journal of Electronic Packaging (39 papers)International Journal of Heat and Mass Transfer (20 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (15 papers)
- Partner nations
- United StatesCanadaIndia
In The Last Decade
Bahgat Sammakia
303 papers receiving 5.1k citations
Hit Papers
Peers
Comparison fields: 5 of 109
- Mechanical Engineering 3.1k
- Computational Mechanics 1.4k
- Hardware and Architecture 209
- Biomedical Engineering 1.2k
- Building and Construction 334
Countries citing papers authored by Bahgat Sammakia
This map shows the geographic impact of Bahgat Sammakia's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bahgat Sammakia with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bahgat Sammakia more than expected).
Fields of papers citing papers by Bahgat Sammakia
This network shows the impact of papers produced by Bahgat Sammakia. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bahgat Sammakia. The network helps show where Bahgat Sammakia may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Bahgat Sammakia, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 4 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 1 | |
| 5 | 2024 | 5 | |
| 6 | 2023 | 41 | |
| 7 | 2023 | 1 | |
| 8 | 2023 | 1 | |
| 9 | 2023 | 37 | |
| 10 | 2022 | 6 | |
| 11 | 2022 | 7 | |
| 12 | 2021 | 6 | |
| 13 | 2021 | 23 | |
| 14 | 2021 | 6 | |
| 15 | 2021 | 39 | |
| 16 | 2012 | 12 | |
| 17 | Optimization study of Supercapacitor electrode material composition and thickness for enhanced performance of the Supercapacitor | 2011 | 0 |
| 18 | 2007 | 60 | |
| 19 | 2005 | 21 | |
| 20 | 1986 | 22 |
About Bahgat Sammakia
Bahgat Sammakia is a scholar working on Mechanical Engineering, Hardware and Architecture, Computational Mechanics, Building and Construction and Electrical and Electronic Engineering, having authored 319 papers that have together received 5.4k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (185 papers), Heat Transfer and Boiling Studies (101 papers), Electronic Packaging and Soldering Technologies (44 papers), Heat Transfer Mechanisms (41 papers), 3D IC and TSV technologies (38 papers), Thermal properties of materials (34 papers), Building Energy and Comfort Optimization (26 papers) and Nanofluid Flow and Heat Transfer (25 papers). The work is most often cited by research in Mechanical Engineering (3.1k citations), Computational Mechanics (1.4k citations), Hardware and Architecture (209 citations), Biomedical Engineering (1.2k citations) and Building and Construction (334 citations). Bahgat Sammakia has collaborated with scholars based in United States, Canada and India. Frequent co-authors include B. Gebhart, M. M. Yovanovich, Yogesh Jaluria, Roop L. Mahajan, Roger Schmidt, Bruce T. Murray, Saurabh Shrivastava, Srikanth Rangarajan, Susan Lu and Husam A. Alissa. Their work appears in journals such as Journal of Electronic Packaging, International Journal of Heat and Mass Transfer, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies and Applied Thermal Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.