G. Parès

489 total citations
33 papers, 278 citations indexed

About

G. Parès is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, G. Parès has authored 33 papers receiving a total of 278 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 3 papers in Automotive Engineering. Recurrent topics in G. Parès's work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (14 papers) and Photonic and Optical Devices (6 papers). G. Parès is often cited by papers focused on 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (14 papers) and Photonic and Optical Devices (6 papers). G. Parès collaborates with scholars based in France, Switzerland and Austria. G. Parès's co-authors include Sylvie Menezo, Azita Emami, N. Sillon, V. Lapras, J. Torres, T. Skotnicki, F. Leverd, B. Tavel, C. Julien and M. Rivoire and has published in prestigious journals such as Journal of Lightwave Technology, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment and Journal of Electronic Materials.

In The Last Decade

G. Parès

32 papers receiving 267 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G. Parès France 10 263 41 33 15 12 33 278
Randy Giles United States 8 252 1.0× 58 1.4× 37 1.1× 25 1.7× 28 2.3× 21 287
Tzu-Jin Yeh Taiwan 10 309 1.2× 18 0.4× 24 0.7× 10 0.7× 8 0.7× 26 315
G.-K. Chang United States 9 421 1.6× 56 1.4× 15 0.5× 26 1.7× 7 0.6× 26 446
N. Corrao France 11 283 1.1× 46 1.1× 19 0.6× 7 0.5× 8 0.7× 25 304
Reza Molavi Canada 12 389 1.5× 15 0.4× 90 2.7× 14 0.9× 15 1.3× 31 411
Yuefeng Qi China 11 309 1.2× 96 2.3× 39 1.2× 3 0.2× 23 1.9× 59 357
Manuel Sierra Castañer Spain 10 299 1.1× 27 0.7× 25 0.8× 5 0.3× 9 0.8× 58 337
Teck Guan Lim Singapore 11 390 1.5× 29 0.7× 42 1.3× 6 0.4× 8 0.7× 47 401
John Golz United States 9 225 0.9× 18 0.4× 19 0.6× 69 4.6× 10 0.8× 23 277
H. Abiko Japan 10 272 1.0× 54 1.3× 74 2.2× 8 0.5× 13 1.1× 26 287

Countries citing papers authored by G. Parès

Since Specialization
Citations

This map shows the geographic impact of G. Parès's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Parès with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Parès more than expected).

Fields of papers citing papers by G. Parès

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Parès. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Parès. The network helps show where G. Parès may publish in the future.

Co-authorship network of co-authors of G. Parès

This figure shows the co-authorship network connecting the top 25 collaborators of G. Parès. A scholar is included among the top collaborators of G. Parès based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. Parès. G. Parès is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Parmar, Vivek, Sandeep Kaur Kingra, Deepak Verma, et al.. (2023). Demonstration of SMT-reflow Immune and SCA-resilient PUF on 28nm RRAM device array. SPIRE - Sciences Po Institutional REpository. 1–4.
2.
Manzillo, Francesco Foglia, Antonio Clemente, B. Blampey, et al.. (2019). Transmitarray Antenna with Integrated Frequency Multiplier for High-speed D-band Communications in Low-cost PCB Technology. European Conference on Antennas and Propagation. 5 indexed citations
3.
Parès, G., et al.. (2019). Highly Compact RF Transceiver Module Using High Resistive Silicon Interposer with Embedded Inductors and Heterogeneous Dies Integration. SPIRE - Sciences Po Institutional REpository. 1279–1286. 9 indexed citations
4.
Marnat, Loïc, et al.. (2019). Thermal and Mechanical Simulations for Fan-Out Wafer-Level Packaging Technology: Introduction of a "Solder Heatsink". SPIRE - Sciences Po Institutional REpository. 1535–1542. 3 indexed citations
5.
Thonnart, Yvain, José Luis González, Robert Polster, et al.. (2018). A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm2 Die-to-Die Optical Networks. HAL (Le Centre pour la Communication Scientifique Directe). 350–352. 15 indexed citations
6.
Parès, G., et al.. (2017). Flip chip reliability and design rules for SIP module. IMAPSource Proceedings. 2017(1). 754–760. 2 indexed citations
7.
Calmon, Françis, Patrick Pittet, G. Parès, et al.. (2017). 3D Silicon Coincidence Avalanche Detector (3D-SiCAD) for charged particle detection. Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment. 881. 53–59. 3 indexed citations
8.
Parès, G., et al.. (2017). INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIES. IMAPSource Proceedings. 2017(1). 72–77. 1 indexed citations
9.
Blampey, B., Enrico Temporiti, Benoı̂t Charbonnier, et al.. (2016). Packaging of high speed 100 Gbps silicon photonic photoreceiver module using 50 µm pitch microbump flip-chip and chip-on-board approach. 1–3. 2 indexed citations
10.
Bates, R. L., C. M. Buttar, T. McMullen, et al.. (2016). Thin hybrid pixel assembly fabrication development with backside compensation layer. Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment. 845. 24–28. 1 indexed citations
11.
Bernabé, Stéphane, G. Parès, Daivid Fowler, et al.. (2016). On-Board Silicon Photonics-Based Transceivers With 1-Tb/s Capacity. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(7). 1018–1025. 12 indexed citations
12.
Menezo, Sylvie, et al.. (2015). A 25 Gb/s 3D-Integrated CMOS/Silicon-Photonic Receiver for Low-Power High-Sensitivity Optical Communication. Journal of Lightwave Technology. 34(12). 2924–2933. 64 indexed citations
13.
14.
Parès, G., et al.. (2012). ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY. IMAPSource Proceedings. 2012(1). 710–719. 5 indexed citations
15.
Parès, G., N. Bresson, S. Minoret, et al.. (2011). Through Silicon Via technology using tungsten metallization. 1–4. 23 indexed citations
16.
Parès, G., F. de Crécy, S. Moreau, et al.. (2011). ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY. IMAPSource Proceedings. 2011(1). 388–399. 2 indexed citations
17.
18.
Pérez-Romero, J., O. Sallent, R. Agustı́, & G. Parès. (2003). A downlink admission control algorithm for UTRA-FDD. 18–22. 5 indexed citations
19.
Tavel, B., T. Skotnicki, G. Parès, et al.. (2002). Totally silicided (CoSi/sub 2/) polysilicon: a novel approach to very low-resistive gate (∼2Ω/□) without metal CMP nor etching. 37.5.1–37.5.4. 44 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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