J. Dechamp

650 citations

35 papers · 445 indexed · h-index 13

Impact in

Electrical and Electronic Engineering top 10%
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
Condensed Matter Physics
- GaN-based semiconductor devices and materials

Papers in ⓘ

Electrical and Electronic Engineering 30
- 3D IC and TSV technologies 22
- Electronic Packaging and Soldering Technologies 14
- Semiconductor materials and devices 8
- Advancements in Semiconductor Devices and Circuit Design 4
- Silicon and Solar Cell Technologies 4
Biomedical Engineering 15
- Advanced Surface Polishing Techniques 9
- Nanofabrication and Lithography Techniques 4

Co-authors: L. Di Cioccio (9 shared papers)L. Clavelier (12 shared papers)Marc Zussy (11 shared papers)F. Letertre (7 shared papers)A. Tauzin (6 shared papers)N. Kernevez (8 shared papers)T. Akatsu (4 shared papers)R. Taïbi (3 shared papers)
Journals: Electronics Letters (3 papers)Materials Science in Semiconductor Processing (2 papers)Microsystem Technologies (2 papers)Journal of the Society for Information Display (1 paper)Journal of The Electrochemical Society (1 paper)
Partner nations: France Belgium Japan

In The Last Decade

J. Dechamp

34 papers receiving 432 citations

Peers

Countries citing papers authored by J. Dechamp

Since Specialization

Citations

This map shows the geographic impact of J. Dechamp's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Dechamp with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Dechamp more than expected).

Fields of papers citing papers by J. Dechamp

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Dechamp. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Dechamp. The network helps show where J. Dechamp may publish in the future.

Co-authors

The 25 scholars most cited alongside J. Dechamp, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. Dechamp Line = papers co-authored together J. Dechamp links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Transfers of 2-inch GaN films onto sapphire substrates using Smart Cut ^TM technology Electronics Letters ·A. Tauzin, T. Akatsu, Marc Rabarot, J. Dechamp, Marc Zussy, H. Moriceau, Jean-François Michaud, Anne‐Marie Charvet, L. Di Cioccio, Frank Fournel, J. Garrione, B. Faure, F. Letertre, N. Kernevez	2005	56
2	Fabrication and characterisation of 200 mm germanium-on-insulator (GeOI) substrates made from bulk germanium Electronics Letters ·C. Deguet, L. Sanchez, T. Akatsu, F. Allibert, J. Dechamp, F. Madeira, F. Mazen, A. Tauzin, V. Loup, C. Richtarch, David Mercier, Thomas Signamarcheix, F. Letertre, Ben Depuydt, N. Kernevez	2006	51
3	Single-mode high frequency LiNbO₃Film Bulk Acoustic Resonator SPIRE - Sciences Po Institutional REpository ·Marie Bousquet, Grégory Enyedi, J. Dechamp, Marc Zussy, Pauline Sylvia Pokam Kuisseu, Frédéric Mazen, Christophe Billard, Alexandre Reinhardt, Michael Bertucchi, P. Perreau, G. Castellan, C. Maeder-Pachurka, Denis Mercier, Julien Delprato, Aurelio Borzì, Selsabil Sejil	2019	39
4	Full characterization of Cu/Cu direct bonding for 3D integration R. Taïbi, L. Di Cioccio, Cédrick Chappaz, L.L. Chapelon, Pierric Gueguen, J. Dechamp, Roland Fortunier, L. Clavelier	2010	33
5	Germanium-On-Insulator (GeOI) structure realized by the Smart Cut™ technology MRS Proceedings ·F. Letertre, C. Deguet, C. Richtarch, B. Faure, J-M. Hartmann, F. Chieu, Arnaud Beaumont, J. Dechamp, Christophe Morales, F. Allibert, P. Perreau, S. Pocas, S. Personnic, C. Lagahe-Blanchard, B. Ghyselen, Y-M. Le Vaillant, Jalaguier, N. Kernevez, C. Mazuré	2004	29
6	Investigation of stress induced voiding and electromigration phenomena on direct copper bonding interconnects for 3D integration R. Taïbi, L. Di Cioccio, C. Chappaz, Mireille Francou, J. Dechamp, Pierre-Élie Larré, S. Moreau, L-L. Chapelon, Roland Fortunier	2011	24
7	Silicon-On-Diamond layer integration by wafer bonding technology Diamond and Related Materials ·Marc Rabarot, J. Widiez, S. Saada, Jean-Paul Mazellier, Christophe Lecouvey, J.C. Roussin, J. Dechamp, P. Bergonzo, F. Andrieu, O. Faynot, S. Deleonibus, L. Clavelier, J.P. Roger	2010	22
8	3-inch single-crystal LiTaO ₃ films onto metallic electrode using Smart Cut ^TM technology Electronics Letters ·A. Tauzin, J. Dechamp, F. Madeira, F. Mazen, Marc Zussy, C. Deguet, L. Clavelier, J.S. Moulet, C. Richtarch, T. Akatsu, M. Yoshimi, Arnaud Rigny	2008	17
9	Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking Ionut Radu, Didier Landru, G. Gaudin, G. Riou, Catherine Tempesta, F. Letertre, L. Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, J. Dechamp, L. Clavelier, Mariam Sadaka	2010	17
10	Fabrication of Silicon on Diamond (SOD) substrates by either the Bonded and Etched-back SOI (BESOI) or the Smart-Cut™ technology Solid-State Electronics ·J. Widiez, Marc Rabarot, S. Saada, Jean-Paul Mazellier, J. Dechamp, V. Delaye, J.C. Roussin, F. Andrieu, O. Faynot, S. Deleonibus, P. Bergonzo, L. Clavelier	2009	16
11	High piezoelectric properties in LiNbO<inf>3</inf> transferred layer by the Smart Cut™ technology for ultra wide band BAW filter applications J.S. Moulet, M. Pijolat, J. Dechamp, F. Mazen, A. Tauzin, F. Rieutord, Alexandre Reinhardt, Emmanuel Defaÿ, C. Deguet, B. Ghyselen, L. Clavelier, M. Aïd, Sylvain Ballandras, C. Mazuré	2008	16
12	An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling L. Di Cioccio, Pierric Gueguen, R. Taïbi, Thomas Signamarcheix, Laurent Bally, L. Vandroux, Marc Zussy, S. Verrun, J. Dechamp, Patrick Leduc, M. Assous, D. Bouchu, F. de Crécy, L.L. Chapelon, L. Clavelier	2009	16
13	Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration Microelectronic Engineering ·Barbara Charlet, L. Di Cioccio, J. Dechamp, Marc Zussy, T. Enot, R. Canegallo, A. Fazzi, R. Guerrieri, L. Magagni	2006	12
14	First demonstration of heat dissipation improvement in CMOS technology using Silicon-On-Diamond (SOD) substrates HAL (Le Centre pour la Communication Scientifique Directe) ·Jean-Paul Mazellier, J. Widiez, F. Andrieu, Mathieu Lions, S. Saada, Masataka Hasegawa, Kazuo Tsugawa, L. Brévard, J. Dechamp, Marc Rabarot, V. Delaye, S. Cristoloveanu, L. Clavelier, S. Deleonibus, P. Bergonzo, O. Faynot	2009	10
15	Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology Microsystem Technologies ·Pierre Montméat, T. Enot, M. Pellat, Frank Fournel, Laurent Bally, L. Baud, J. Dechamp, R. Eleouet, Lionel Vignoud, Marc Zussy	2015	10
16	Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development SPIRE - Sciences Po Institutional REpository ·Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, Daniel Scevola, V. Balan, J. Dechamp, Marc Zussy, Gaëlle Mauguen, C. Castan, L. Sanchez, A. Jouve, Frank Fournel, S. Chéramy	2019	9
17	Curved OLED microdisplays Journal of the Society for Information Display ·Tony Maindron, Bertrand Chambion, Marion Provost, A. Vandeneynde, Patrick Peray, Marc Zussy, J. Dechamp, C. Rossat, Stéphanie Gonnin	2019	8
18	Germanium-on-insulator (GeOI) structures realized by the Smart Cut/spl trade/ technology C. Deguet, Christophe Morales, J. Dechamp, Jean‐Michel Hartmann, Anne‐Marie Charvet, H. Moriceau, F. Chieux, Arnaud Beaumont, L. Clavelier, V. Loup, N. Kernevez, G. Raskin, C. Richtarch, F. Allibert, F. Letertre, C. Mazuré	2005	8
19	3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications SPIRE - Sciences Po Institutional REpository ·Stéphane Nicolas, Jerzy-Javier Suarez-Berru, N. Bresson, C. Socquet-Clerc, M. Assous, S. Borel, Rémi Vélard, J. Dechamp, Renan Bouis, Antonio Roman, Karine Abadie, Damien Hebras	2024	7
20	200 mm Silicon On Porous Layer Substrates Made by the Smart Cut Technology for Double Layer-Transfer Applications Journal of The Electrochemical Society ·Anne-Sophie Stragier, Thomas Signamarcheix, T. Salvetat, E. Nolot, J. Dechamp, David Mercier, Patrice Gergaud, A. Tauzin, L. Clavelier, M. Lemiti	2011	6

About J. Dechamp

J. Dechamp is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Automotive Engineering and Mechanics of Materials, having authored 35 papers that have together received 445 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (14 papers), Advanced Surface Polishing Techniques (9 papers), Semiconductor materials and devices (8 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Nanofabrication and Lithography Techniques (4 papers) and Silicon and Solar Cell Technologies (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (373 citations), Condensed Matter Physics (41 citations), Automotive Engineering (42 citations), Biomedical Engineering (155 citations) and Atomic and Molecular Physics, and Optics (81 citations). J. Dechamp has collaborated with scholars based in France, Belgium and Japan. Frequent co-authors include L. Di Cioccio, L. Clavelier, Marc Zussy, F. Letertre, A. Tauzin, N. Kernevez, T. Akatsu, R. Taïbi, C. Deguet and Frank Fournel. Their work appears in journals such as Electronics Letters, Materials Science in Semiconductor Processing, Microsystem Technologies, Journal of the Society for Information Display and Journal of The Electrochemical Society.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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