Daniel Scevola

481 total citations
9 papers, 136 citations indexed

About

Daniel Scevola is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Daniel Scevola has authored 9 papers receiving a total of 136 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 3 papers in Automotive Engineering and 3 papers in Biomedical Engineering. Recurrent topics in Daniel Scevola's work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers) and Advanced Surface Polishing Techniques (3 papers). Daniel Scevola is often cited by papers focused on 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers) and Advanced Surface Polishing Techniques (3 papers). Daniel Scevola collaborates with scholars based in France, Czechia and Netherlands. Daniel Scevola's co-authors include M. Rivoire, D. Lafond, L. Di Cioccio, Pierric Gueguen, L. Clavelier, Marc Zussy, Patrice Gergaud, Philip R. LeDuc, V. Jousseaume and G. Passemard and has published in prestigious journals such as Journal of The Electrochemical Society, ECS Transactions and SPIRE - Sciences Po Institutional REpository.

In The Last Decade

Daniel Scevola

9 papers receiving 133 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Daniel Scevola France	7	129	49	29	18	8	9	136
V. Balan France	8	141 1.1×	35 0.7×	19 0.7×	36 2.0×	7 0.9×	21	156
E. Deloffre France	11	196 1.5×	58 1.2×	25 0.9×	25 1.4×	21 2.6×	26	208
A. Jouve France	11	289 2.2×	44 0.9×	80 2.8×	62 3.4×	12 1.5×	30	294
T. Lacrevaz France	7	145 1.1×	37 0.8×	8 0.3×	33 1.8×	5 0.6×	37	172
Zhongyu Zhang China	4	61 0.5×	30 0.6×	25 0.9×	9 0.5×	5 0.6×	11	77
Hidekazu Kikuchi Japan	8	237 1.8×	11 0.2×	61 2.1×	39 2.2×	19 2.4×	21	258
Ting-Yen Chiang United States	8	292 2.3×	52 1.1×	29 1.0×	21 1.2×	13 1.6×	11	317
C. Pelto United States	6	110 0.9×	36 0.7×	5 0.2×	9 0.5×	13 1.6×	10	125
Nelson Fan United States	6	138 1.1×	16 0.3×	8 0.3×	60 3.3×	22 2.8×	10	156
Arnaud Garnier France	7	102 0.8×	12 0.2×	9 0.3×	19 1.1×	15 1.9×	27	123

Countries citing papers authored by Daniel Scevola

Since Specialization

Citations

This map shows the geographic impact of Daniel Scevola's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Scevola with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Scevola more than expected).

Fields of papers citing papers by Daniel Scevola

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daniel Scevola. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Scevola. The network helps show where Daniel Scevola may publish in the future.

Co-authorship network of co-authors of Daniel Scevola

This figure shows the co-authorship network connecting the top 25 collaborators of Daniel Scevola. A scholar is included among the top collaborators of Daniel Scevola based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daniel Scevola. Daniel Scevola is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

1.

Stewart, Paul, N. Bresson, G. Romano, et al.. (2019). Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. SPIRE - Sciences Po Institutional REpository. 1–5. 9 indexed citations

2.

Moreau, S., D. Bouchu, V. Balan, et al.. (2016). Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications. 1940–1945. 11 indexed citations

3.

Balan, V., et al.. (2012). CMP Process Optimization for Bonding Applications. 1–7. 4 indexed citations

4.

Gueguen, Pierric, L. Di Cioccio, Patrice Gergaud, et al.. (2009). Copper Direct-Bonding Characterization and Its Interests for 3D Integration. Journal of The Electrochemical Society. 156(10). H772–H772. 48 indexed citations

5.

Gueguen, Pierric, Patrice Gergaud, Marc Zussy, et al.. (2008). 3D Vertical interconnects by Copper Direct Bonding. 6 indexed citations

6.

Gueguen, Pierric, L. Di Cioccio, M. Rivoire, et al.. (2008). Copper direct bonding for 3D integration. 61–63. 30 indexed citations

7.

Gueguen, Pierric, L. Di Cioccio, Patrice Gergaud, et al.. (2008). Copper Direct Bonding Characterization and its Interests for 3D Integration Circuits. ECS Transactions. 16(8). 31–37. 10 indexed citations

8.

Gueguen, Pierric, L. Di Cioccio, F. Rieutord, et al.. (2008). Copper Direct Bonding Characterization and its Interests for 3D Integration Circuits. ECS Meeting Abstracts. MA2008-02(33). 2167–2167. 2 indexed citations

9.

LeDuc, Philip R., et al.. (2005). Understanding CMP-induced delamination in ultra low-k/Cu integration. 209–211. 16 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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