Daniel Scevola
Impact in
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- Copper Interconnects and Reliability
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 8
- Electronic Packaging and Soldering Technologies 6
- Semiconductor Lasers and Optical Devices 1
- Electrical and Thermal Properties of Materials 1
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- Additive Manufacturing and 3D Printing Technologies 3
- Co-authors
- M. Rivoire (6 shared papers)Marc Zussy (6 shared papers)D. Lafond (5 shared papers)Pierric Gueguen (5 shared papers)L. Di Cioccio (5 shared papers)L. Clavelier (5 shared papers)Patrice Gergaud (4 shared papers)S. Maı̂trejean (1 shared paper)
- Journals
- Journal of The Electrochemical Society (1 paper)ECS Transactions (1 paper)HAL (Le Centre pour la Communication Scientifique Directe) (1 paper)ECS Meeting Abstracts (1 paper)
- Partner nations
- FranceCzechiaNetherlands
In The Last Decade
Daniel Scevola
9 papers receiving 134 citations
Peers
Comparison fields: 5 of 15
- Electronic, Optical and Magnetic Materials 49
- Automotive Engineering 30
- Electrical and Electronic Engineering 130
- Hardware and Architecture 5
- Biomedical Engineering 18
Countries citing papers authored by Daniel Scevola
This map shows the geographic impact of Daniel Scevola's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Scevola with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Scevola more than expected).
Fields of papers citing papers by Daniel Scevola
This network shows the impact of papers produced by Daniel Scevola. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Scevola. The network helps show where Daniel Scevola may publish in the future.
Co-authors
The 25 scholars most cited alongside Daniel Scevola, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 48 | |
| 2 | 2008 | 30 | |
| 3 | 2005 | 16 | |
| 4 | 2016 | 12 | |
| 5 | 2008 | 10 | |
| 6 | 2019 | 9 | |
| 7 | 2008 | 6 | |
| 8 | CMP Process Optimization for Bonding Applications | 2012 | 4 |
| 9 | 2008 | 2 |
About Daniel Scevola
Daniel Scevola is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering, having authored 9 papers that have together received 137 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers), Additive Manufacturing and 3D Printing Technologies (3 papers), Advanced Surface Polishing Techniques (3 papers), Copper Interconnects and Reliability (2 papers), Semiconductor Lasers and Optical Devices (1 paper), Electrical and Thermal Properties of Materials (1 paper) and Manufacturing Process and Optimization (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (49 citations), Automotive Engineering (30 citations), Electrical and Electronic Engineering (130 citations), Hardware and Architecture (5 citations) and Biomedical Engineering (18 citations). Daniel Scevola has collaborated with scholars based in France, Czechia and Netherlands. Frequent co-authors include M. Rivoire, Marc Zussy, D. Lafond, Pierric Gueguen, L. Di Cioccio, L. Clavelier, Patrice Gergaud, S. Maı̂trejean, V. Jousseaume and Philip R. LeDuc. Their work appears in journals such as Journal of The Electrochemical Society, ECS Transactions, HAL (Le Centre pour la Communication Scientifique Directe) and ECS Meeting Abstracts.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.