E. Deloffre
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Ferroelectric and Negative Capacitance Devices
- Integrated Circuits and Semiconductor Failure Analysis
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 8
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- 3D IC and TSV technologies 16
- Semiconductor materials and devices 10
- Electronic Packaging and Soldering Technologies 9
- Ferroelectric and Negative Capacitance Devices 5
- Advancements in Photolithography Techniques 3
E. Deloffre
26 papers receiving 200 citations
Peers
Comparison fields: 5 of 20
- Electrical and Electronic Engineering 196
- Electronic, Optical and Magnetic Materials 58
- Automotive Engineering 25
- Hardware and Architecture 6
- Ceramics and Composites 5
Countries citing papers authored by E. Deloffre
This map shows the geographic impact of E. Deloffre's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Deloffre with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Deloffre more than expected).
Fields of papers citing papers by E. Deloffre
This network shows the impact of papers produced by E. Deloffre. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Deloffre. The network helps show where E. Deloffre may publish in the future.
Co-authorship network
The 25 scholars most cited alongside E. Deloffre, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2024 | 1 | |
| 3 | 2023 | 1 | |
| 4 | 2023 | 4 | |
| 5 | 2023 | 4 | |
| 6 | 2022 | 12 | |
| 7 | 2022 | 12 | |
| 8 | 2019 | 17 | |
| 9 | 2018 | 16 | |
| 10 | 2016 | 18 | |
| 11 | 2015 | 16 | |
| 12 | 2013 | 6 | |
| 13 | 2010 | 2 | |
| 14 | 2007 | 11 | |
| 15 | 2007 | 5 | |
| 16 | 2007 | 1 | |
| 17 | 2006 | 11 | |
| 18 | 2006 | 2 | |
| 19 | 2005 | 23 | |
| 20 | 2003 | 1 |
About E. Deloffre
E. Deloffre is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Ceramics and Composites, Automotive Engineering and Hardware and Architecture, having authored 26 papers that have together received 208 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (16 papers), Semiconductor materials and devices (10 papers), Electronic Packaging and Soldering Technologies (9 papers), Copper Interconnects and Reliability (8 papers), Ferroelectric and Negative Capacitance Devices (5 papers), Advancements in Photolithography Techniques (3 papers), Semiconductor materials and interfaces (2 papers) and Aluminum Alloys Composites Properties (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (196 citations), Electronic, Optical and Magnetic Materials (58 citations), Automotive Engineering (25 citations), Hardware and Architecture (6 citations) and Ceramics and Composites (5 citations). E. Deloffre has collaborated with scholars based in France, Switzerland and Czechia. Frequent co-authors include S. Lhostis, S. Bruyère, S. Crémer, S. Moreau, A. Farcy, M. Gros‐Jean, Stéphane Bécu, L. Sanchez, G. Ghibaudo and V. Balan. Their work appears in journals such as Microelectronic Engineering, Journal of Electronic Materials, IEEE Transactions on Nanotechnology, Microelectronics Reliability and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.