Xiaopeng Xu
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Mechanical Engineering
- Electronic, Optical and Magnetic Materials
- Automotive Engineering
- Co-authors
- Aditya P. KarmarkarVictor MorozLee SmithA. NeedlemanEhrenfried ZschechP. AbsilStefaan Van HuylenbroeckF. Nouri
- Topics
- Electronic Packaging and Soldering Technologies (23 papers)3D IC and TSV technologies (19 papers)Integrated Circuits and Semiconductor Failure Analysis (11 papers)
- Journals
- International Journal of PlasticityIEEE Electron Device LettersMicroelectronics Reliability
- Partner nations
- United StatesSwitzerlandBelgium
In The Last Decade
Xiaopeng Xu
35 papers receiving 367 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 342
- Biomedical Engineering 111
- Mechanical Engineering 27
- Electronic, Optical and Magnetic Materials 27
- Automotive Engineering 25
Countries citing papers authored by Xiaopeng Xu
This map shows the geographic impact of Xiaopeng Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xiaopeng Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xiaopeng Xu more than expected).
Fields of papers citing papers by Xiaopeng Xu
This network shows the impact of papers produced by Xiaopeng Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xiaopeng Xu. The network helps show where Xiaopeng Xu may publish in the future.
Co-authorship network of co-authors of Xiaopeng Xu
This figure shows the co-authorship network connecting the top 25 collaborators of Xiaopeng Xu. A scholar is included among the top collaborators of Xiaopeng Xu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xiaopeng Xu. Xiaopeng Xu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 13 | |
| 3 | 3 | |
| 4 | 3 | |
| 5 | 8 | |
| 6 | 2 | |
| 7 | 6 | |
| 8 | 1 | |
| 9 | 4 | |
| 10 | 2 | |
| 11 | 5 | |
| 12 | 10 | |
| 13 | 14 | |
| 14 | 5 | |
| 15 | 0 | |
| 16 | 4 | |
| 17 | 58 | |
| 18 | 35 | |
| 19 | 2 | |
| 20 | 12 |
About Xiaopeng Xu
Xiaopeng Xu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 36 papers that have together received 373 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (19 papers) and Integrated Circuits and Semiconductor Failure Analysis (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (342 citations), Biomedical Engineering (111 citations) and Automotive Engineering (25 citations). Xiaopeng Xu has collaborated with scholars based in United States, Switzerland and Belgium. Frequent co-authors include Aditya P. Karmarkar, Victor Moroz, Lee Smith, A. Needleman, Ehrenfried Zschech, P. Absil, Stefaan Van Huylenbroeck, F. Nouri, Geert Eneman and Peter Verheyen. Their work appears in journals such as International Journal of Plasticity, IEEE Electron Device Letters and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.