Xiaopeng Xu

463 citations

36 papers · 373 indexed · h-index 10

Electrical and Electronic Engineering top 10%
- Electronic Packaging and Soldering Technologies 23
- 3D IC and TSV technologies 19
- Integrated Circuits and Semiconductor Failure Analysis 11
- Semiconductor materials and devices 10
- Advancements in Semiconductor Devices and Circuit Design 6
Biomedical Engineering
- Advanced Surface Polishing Techniques 10
Automotive Engineering
Hardware and Architecture
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability 6
Materials Chemistry
- High-Velocity Impact and Material Behavior 2

Co-authors: Aditya P. Karmarkar Victor Moroz Lee Smith A. Needleman Ehrenfried Zschech P. Absil Stefaan Van Huylenbroeck F. Nouri
Cited by: Electrical and Electronic Engineering Biomedical Engineering Automotive Engineering
Journals: International Journal of Plasticity (1 paper)IEEE Electron Device Letters (1 paper)Microelectronics Reliability (2 papers)
Partner nations: United States Switzerland Belgium

In The Last Decade

Xiaopeng Xu

35 papers receiving 367 citations

Peers

Countries citing papers authored by Xiaopeng Xu

Since Specialization

Citations

This map shows the geographic impact of Xiaopeng Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xiaopeng Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xiaopeng Xu more than expected).

Fields of papers citing papers by Xiaopeng Xu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xiaopeng Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xiaopeng Xu. The network helps show where Xiaopeng Xu may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Xiaopeng Xu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Xiaopeng Xu Line = papers co-authored together Xiaopeng Xu links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	3DIC System-Technology Co-Optimization with a Focus on the Interplay of Thermal, Power, Timing, and Stress Effects Victor Moroz,Xiaopeng Xu,A. Svizhenko,Xi–Wei Lin,С. В. Попов,Henry Sheng,Kenneth Larsen	2024	3
2	Modeling Copper Plastic Deformation and Liner Viscoelastic Flow Effects on Performance and Reliability in Through Silicon Via (TSV) Fabrication Processes IEEE Transactions on Device and Materials Reliability ·Aditya P. Karmarkar,Xiaopeng Xu,Karim El Sayed,Wei Guo,Geert Van der Plas,Stefaan Van Huylenbroeck,Mario González,P. Absil,Eric Beyne	2019	13
3	Modeling Performance and Thermal Induced Reliability Issues of a 3nm FinFET Logic Chip Operation in a Fan-Out and a Flip-Chip Packages Munkang Choi,Xiaopeng Xu,Victor Moroz	2019	3
4	Modeling Wafer Bending Effects on RDL Layer Reliability in a Multiple Die Package Tzu Chen Wang,Chih Chieh Yeh,Xiaopeng Xu,Karim EI Sayed,Chun-Hung Lin	2018	3
5	TCAD modeling for reliability Microelectronics Reliability ·Pirkko Pfäffli,Hiu Yung Wong,Xiaopeng Xu,Luca Silvestri,Xi–Wei Lin,Thomas Yang,Ravi Tiwari,Souvik Mahapatra,Steve Motzny,Victor Moroz,Tingting Ma	2018	8
6	RDL layout pattern reliability analysis and optimization with TCAD stress modeling Tzu Chen Wang,Chih Chieh Yeh,Xiaopeng Xu,Karim El Sayed,Chun-Hung Lin	2017	2
7	Performance and Reliability Impact of Copper Plasticity in Backside TSV-Last Fabrication Process IEEE Transactions on Device and Materials Reliability ·Aditya P. Karmarkar,Wei Guo,Xiaopeng Xu,Geert Van der Plas,Stefaan Van Huylenbroeck,Mario González,P. Absil,Karim El Sayed,Eric Beyne	2016	6
8	Design for reliability with a new modeling methodology for Chip to Package Interaction Shiguo Rao,Dongkai Shangguan,Xiaopeng Xu,Lin Li,Bei Deng,Ricardo Borges	2015	1
9	Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes Wei Guo,Aditya P. Karmarkar,Xiaopeng Xu,Geert Van der Plas,Stefaan Van Huylenbroeck,Mario González,P. Absil,Karim El Sayed,Eric Beyne	2015	4
10	Effects of various assembly and reliability stresses on chip to package interaction Shiguo Rao,Lin Li,Xiaopeng Xu,Bei Deng,Ricardo Borges	2014	2
11	Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling MRS Proceedings ·Chan-Su Yun,Xiaopeng Xu,Arsen Terterian,Tommaso Cilento	2013	5
12	Modeling of interconnect stress evolution during BEOL process and packaging Chirag Shah,Aditya P. Karmarkar,Xiaopeng Xu	2013	10
13	3D TCAD Modeling For Stress Management In Through Silicon Via (TSV) Stacks AIP conference proceedings ·Xiaopeng Xu,Aditya P. Karmarkar	2011	14
14	Viscoelastic Modeling and Reliability Assessment of Microelectronics Packages MRS Proceedings ·Aditya P. Karmarkar,Charlie Jun Zhai,Xiaopeng Xu,Xiao Lin,Greg Rollins,Victor Moroz	2009	5
15	Impact of Fabrication Process, Layout Variation and Packaging Process on Cu/Low-k Interconnect Reliability MRS Proceedings ·Aditya P. Karmarkar,Xiaopeng Xu,Dipu Pramanik,Xi–Wei Lin,Greg Rollins,Xiao Lin	2007	0
16	Modeling Process Impact on Cu/Low k Interconnect Performance and Reliability Xiaopeng Xu,Greg Rollins,Xiao Lin,Dipankar Pramanik	2006	4
17	pMOSFET with 200% mobility enhancement induced by multiple stressors IEEE Electron Device Letters ·L. Washington,F. Nouri,S. Thirupapuliyur,Geert Eneman,Peter Verheyen,Victor Moroz,Lee Smith,Xiaopeng Xu,Mayuka F. Kawaguchi,Tzu-Wei Huang,Khaled Ahmed,Mihaela Balseanu,Li-Qun Xia,Meihua Shen,Yihwan Kim,R. Rooyackers,K. De Meyer,R. Schreutelkamp	2006	58
18	Modeling the impact of stress on silicon processes and devices Materials Science in Semiconductor Processing ·Victor Moroz,N. Strecker,Xiaopeng Xu,Lee Smith,Ingo Bork	2003	35
19	Dynamic Fracture via Molecular Dynamics and Cohesive Finite Element Method Xiaopeng Xu	1996	2
20	The influence of nucleation criterion on shear localization in rate-sensitive porous plastic solids International Journal of Plasticity ·Xiaopeng Xu,A. Needleman	1992	12

About Xiaopeng Xu

Xiaopeng Xu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 36 papers that have together received 373 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (19 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers), Advanced Surface Polishing Techniques (10 papers), Semiconductor materials and devices (10 papers), Copper Interconnects and Reliability (6 papers), Advancements in Semiconductor Devices and Circuit Design (6 papers) and High-Velocity Impact and Material Behavior (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (342 citations), Biomedical Engineering (111 citations) and Automotive Engineering (25 citations). Xiaopeng Xu has collaborated with scholars based in United States, Switzerland and Belgium. Frequent co-authors include Aditya P. Karmarkar, Victor Moroz, Lee Smith, A. Needleman, Ehrenfried Zschech, P. Absil, Stefaan Van Huylenbroeck, F. Nouri, Geert Eneman and Peter Verheyen. Their work appears in journals such as International Journal of Plasticity, IEEE Electron Device Letters and Microelectronics Reliability.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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