Jean Charbonnier

2.9k total citations
93 papers, 1.9k citations indexed

About

Jean Charbonnier is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Mechanical Engineering. According to data from OpenAlex, Jean Charbonnier has authored 93 papers receiving a total of 1.9k indexed citations (citations by other indexed papers that have themselves been cited), including 51 papers in Electrical and Electronic Engineering, 20 papers in Materials Chemistry and 17 papers in Mechanical Engineering. Recurrent topics in Jean Charbonnier's work include 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (26 papers) and Semiconductor materials and devices (10 papers). Jean Charbonnier is often cited by papers focused on 3D IC and TSV technologies (34 papers), Electronic Packaging and Soldering Technologies (26 papers) and Semiconductor materials and devices (10 papers). Jean Charbonnier collaborates with scholars based in France, Switzerland and Austria. Jean Charbonnier's co-authors include J. Brion, D. Daumont, J. Malicet, A. Chakir, Sophie Rivoirard, D. Fruchart, N. Skryabina, Patricia de Rango, David Henry and N. Sillon and has published in prestigious journals such as SHILAP Revista de lepidopterología, Energy Conversion and Management and Corrosion Science.

In The Last Decade

Jean Charbonnier

85 papers receiving 1.8k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jean Charbonnier France 22 622 562 537 392 201 93 1.9k
H.B. Levinsky Netherlands 25 731 1.2× 136 0.2× 414 0.8× 54 0.1× 197 1.0× 82 2.4k
Øivind Wilhelmsen Norway 27 397 0.6× 248 0.4× 286 0.5× 83 0.2× 23 0.1× 105 2.2k
David E. Brown United States 17 421 0.7× 972 1.7× 296 0.6× 46 0.1× 55 0.3× 53 1.8k
Jihoon Lee South Korea 34 1.7k 2.7× 1.8k 3.1× 309 0.6× 65 0.2× 31 0.2× 226 3.7k
Jujia Zhang China 30 1.2k 1.9× 944 1.7× 76 0.1× 61 0.2× 42 0.2× 158 3.2k
Lars Zigan Germany 26 372 0.6× 394 0.7× 117 0.2× 84 0.2× 354 1.8× 104 1.9k
Hans Dieter Baehr Germany 20 663 1.1× 274 0.5× 94 0.2× 26 0.1× 61 0.3× 71 2.6k
Zhongli Liu China 27 1.3k 2.0× 730 1.3× 125 0.2× 46 0.1× 26 0.1× 196 2.5k
Runhai Ouyang China 22 2.4k 3.9× 1.2k 2.2× 165 0.3× 148 0.4× 18 0.1× 47 3.4k
Robert J. Cattolica United States 23 211 0.3× 244 0.4× 201 0.4× 72 0.2× 319 1.6× 71 1.6k

Countries citing papers authored by Jean Charbonnier

Since Specialization
Citations

This map shows the geographic impact of Jean Charbonnier's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jean Charbonnier with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jean Charbonnier more than expected).

Fields of papers citing papers by Jean Charbonnier

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jean Charbonnier. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jean Charbonnier. The network helps show where Jean Charbonnier may publish in the future.

Co-authorship network of co-authors of Jean Charbonnier

This figure shows the co-authorship network connecting the top 25 collaborators of Jean Charbonnier. A scholar is included among the top collaborators of Jean Charbonnier based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jean Charbonnier. Jean Charbonnier is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Charbonnier, Jean, Thierry Mourier, & Stéphane Bernabé. (2025). 3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(8). 1565–1580.
2.
Thomas, Candice, et al.. (2024). Process Development and Characterization of Ru-based UBM for In Bumps Integration for Quantum Computing Applications. SPIRE - Sciences Po Institutional REpository. 378–385. 1 indexed citations
3.
Bresson, N., et al.. (2024). Fine pitch Nb-Nb Direct Bonding for quantum applications. SPIRE - Sciences Po Institutional REpository. 441–446. 2 indexed citations
4.
Malhouitre, Stéphane, M. Assous, Léopold Virot, et al.. (2023). Process Integration of Photonic Interposer for Chiplet-based 3D Systems. HAL (Le Centre pour la Communication Scientifique Directe). 5–12. 2 indexed citations
5.
Derakhshandeh, Jaber, et al.. (2023). Developing TSV wet cleaning chemistry for quantum computing application. Microelectronic Engineering. 276. 112010–112010. 1 indexed citations
6.
Dechamp, J., et al.. (2020). Through Mold Interconnection assessment for advanced Fan Out Wafer Level Packaging applications. SPIRE - Sciences Po Institutional REpository. 1–4. 1 indexed citations
7.
Dutoit, Denis, P. Coudrain, Pascal Vivet, et al.. (2020). How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?. HAL (Le Centre pour la Communication Scientifique Directe). 52. 15.3.1–15.3.4. 2 indexed citations
8.
Borel, S., Jean Charbonnier, Jessy Clédière, et al.. (2018). A Novel Structure for Backside Protection Against Physical Attacks on Secure Chips or SiP. HAL (Le Centre pour la Communication Scientifique Directe). 515–520. 18 indexed citations
9.
Charbonnier, Jean, M. Assous, Thierry Mourier, et al.. (2016). 3D integration for power MOS H bridge power application. 1–7. 1 indexed citations
10.
11.
Charbonnier, Jean, et al.. (2013). Bow management with temperature for thin chips integration. European Microelectronics and Packaging Conference. 1–4. 1 indexed citations
12.
Coudrain, P., et al.. (2011). A silicon platform with Through-silicon vias for heterogeneous RF 3D modules. 1173–1176. 8 indexed citations
13.
Marty, Philippe, Jean-François Fourmigué, P. de Rango, D. Fruchart, & Jean Charbonnier. (2006). Numerical simulation of heat and mass transfer during the absorption of hydrogen in a magnesium hydride. Energy Conversion and Management. 47(20). 3632–3643. 62 indexed citations
14.
Charbonnier, Jean, et al.. (2004). L'Église catholique et la société des Missions étrangères au Vietnam : vicariat apostolique de Cochinchine, XVIIe et XVIIIe siècles. L'Harmattan eBooks. 3 indexed citations
15.
Charbonnier, Jean. (1992). Histoire des chrétiens de Chine. 2 indexed citations
16.
Ooij, W.J. van, et al.. (1989). Paint delamination from electrocoated automotive steels during atmospheric corrosion. Part I. Hot-dip galvanized and electrogalvanized steel. Journal of Adhesion Science and Technology. 3(1). 1–27. 25 indexed citations
17.
Netter, P., et al.. (1987). Influence des paramètres du recuit sur les quantités enrichies et les phases formées en surface des tôles d'acier extra-doux. Revue de Métallurgie. 84(5). 393–408. 1 indexed citations
18.
Charbonnier, Jean, et al.. (1983). An electrochemical study of intergranular corrosion related to the chromium depletion mechanism in the case of 18-10 austenitic stainless steels. Corrosion Science. 23(11). 1191–1206. 14 indexed citations
19.
Bellot, Jean‐Pierre, et al.. (1979). STUDY OF THE TENACITY AND RESISTANCE TO STRESS CORROSION OF STEEL WITH STRENGTH BETWEEN 1200 AND 1400 N/MM2. 1 indexed citations
20.
Charbonnier, Jean. (1976). The Gospel in China. Philippine Studies Historical and Ethnographic Viewpoints. 24(2). 184–209. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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