Didier Lattard

956 total citations
49 papers, 395 citations indexed

About

Didier Lattard is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications and Hardware and Architecture. According to data from OpenAlex, Didier Lattard has authored 49 papers receiving a total of 395 indexed citations (citations by other indexed papers that have themselves been cited), including 39 papers in Electrical and Electronic Engineering, 20 papers in Computer Networks and Communications and 12 papers in Hardware and Architecture. Recurrent topics in Didier Lattard's work include 3D IC and TSV technologies (17 papers), Interconnection Networks and Systems (16 papers) and Semiconductor materials and devices (9 papers). Didier Lattard is often cited by papers focused on 3D IC and TSV technologies (17 papers), Interconnection Networks and Systems (16 papers) and Semiconductor materials and devices (9 papers). Didier Lattard collaborates with scholars based in France, Switzerland and India. Didier Lattard's co-authors include Pascal Vivet, Édith Beigné, Fabien Clermidy, Ahmed Jerraya, Yves Durand, Friedbert Berens, Pascal Benoit, Lionel Torres, Gilles Sassatelli and Romain Lemaire and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment and Solid-State Electronics.

In The Last Decade

Didier Lattard

42 papers receiving 370 citations

Peers

Countries citing papers authored by Didier Lattard

Since Specialization

Citations

This map shows the geographic impact of Didier Lattard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Didier Lattard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Didier Lattard more than expected).

Fields of papers citing papers by Didier Lattard

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Didier Lattard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Didier Lattard. The network helps show where Didier Lattard may publish in the future.

Co-authorship network of co-authors of Didier Lattard

This figure shows the co-authorship network connecting the top 25 collaborators of Didier Lattard. A scholar is included among the top collaborators of Didier Lattard based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Didier Lattard. Didier Lattard is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	First Radio-Frequency Circuits Fabricated in Top-Tier of a Full 3D Sequential Integration Process at mmW for 5G Applications 2024 ·SPIRE - Sciences Po Institutional REpository ·(unknown), (unknown), Alexandre Siligaris, Vincent Puyal, (unknown), (unknown), V. Lapras, C. Fenouillet-Béranger, Laurent Brunet, Pierre Vincent, Didier Lattard, X. Garros, (unknown), P. Batude	0
2	M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC 2020 ·HAL (Le Centre pour la Communication Scientifique Directe) ·Sébastien Thuries, Olivier Billoint, (unknown), R. Lemaire, Pascal Vivet, P. Batude, Didier Lattard	8
3	How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing? 2020 ·HAL (Le Centre pour la Communication Scientifique Directe) ·Denis Dutoit, P. Coudrain, (unknown), Pascal Vivet, Jean Charbonnier, Arnaud Garnier, Didier Lattard, S. Chéramy, (unknown), (unknown), Yvain Thonnart, F. Clermidy	2
4	Novel fine-grain back-bias assist techniques for 3D-monolithic 14 nm FDSOI top-tier SRAMs 2019 ·Solid-State Electronics ·Delphine Bosch, X. Garros, Adam Makosiej, L. Ciampolini, O. Weber, J. Lacord, J. Cluzel, Bastien Giraud, (unknown), G. Cibrario, Laurent Brunet, P. Batude, C. Fenouillet-Béranger, Didier Lattard, J.P. Colinge, F. Balestra, F. Andrieu	1
5	Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning 2019 ·SPIRE - Sciences Po Institutional REpository ·(unknown), Didier Lattard, Pascal Vivet, Jean Durupt, Sébastien Thuries, Édith Beigné	4
6	BISTs for post-bond test and electrical analysis of high density 3D interconnect defects 2018 ·(unknown), Didier Lattard, Pascal Vivet, (unknown), Édith Beigné	5
7	Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC 2017 ·(unknown), Didier Lattard, Pascal Vivet, Édith Beigné	6
8	A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links 2016 ·IEEE Journal of Solid-State Circuits ·Pascal Vivet, Yvain Thonnart, R. Lemaire, (unknown), Édith Beigné, Christian Bernard, (unknown), Didier Lattard, Ivan Miro-Panades, Denis Dutoit, Fabien Clermidy, S. Chéramy, (unknown), Frédéric Pétrot, Éric Flamand, J. Michailos, (unknown), (unknown), Juergen Schloeffel	25
9	Development of fine pitch interconnections for 3D integrated circuits 2016 ·(unknown), Arnaud Garnier, N. Bresson, F. Ponthenier, (unknown), F. Casset, A. Jouve, Didier Lattard, S. Chéramy	5
10	An energy-efficient IEEE 802.15.4 tunable digital baseband targeting self-adaptive WPANs 2015 ·(unknown), Didier Lattard, Ahmed Jerraya	2
11	Computational load reduction by downsampling for energy-efficient digital baseband 2014 ·(unknown), Didier Lattard, François Dehmas, Dominique Morche, Ahmed Jerraya	1
12	Algorithm architecture co-design for ultra low-power image sensor 2012 ·Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·(unknown), Antoine Dupret, (unknown), Didier Lattard, (unknown)	0
13	A Stackable LTE Chip for Cost-effective 3D Systems 2012 ·(unknown), Didier Lattard, Ahmed Jerraya	4
14	Heterogeneous vs homogeneous MPSoC approaches for a mobile LTE modem 2010 ·Design, Automation, and Test in Europe ·(unknown), Didier Lattard, Ahmed Jerraya, Gilles Sassatelli, Pascal Benoit, Lionel Torres	25
15	An efficient hierarchical router for large 3D NoCs 2010 ·(unknown), Didier Lattard, Ahmed Jerraya	10
16	Flexible and distributed real-time control on a 4G telecom MPSoC 2010 ·(unknown), Didier Lattard, Gilles Sassatelli, Pascal Benoit, Lionel Torres	3
17	A semi-distributed control system for application management in a NoC-based architecture 2006 ·(unknown), Yves Durand, Didier Lattard, Ahmed Jerraya	1
18	A novel ASIC for readout electronics in semiconductor γ-ray detection 1996 ·Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment ·(unknown), Didier Lattard, F. Mathy, Jean‐Luc Martin, (unknown), Jean-Pierre Rostaing, (unknown), (unknown)	5
19	A VLSI implementation of parallel image reconstruction 1991 ·Didier Lattard, (unknown)	0
20	An Integrated Asynchronous Cellular Array to Do Parallel Image Reconstruction. 1988 ·Machine Vision and Applications ·Didier Lattard, (unknown)	0

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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