Guruprasad Katti
- Electrical and Electronic Engineering top 5%
- Biomedical Engineering
- Atomic and Molecular Physics, and Optics
- Computer Networks and Communications top 10%
- Automotive Engineering top 10%
- Co-authors
- Wim DehaeneMichele StucchiK. De MeyerJ. Van OlmenEric BeyneYoussef TravalyRoshan WeerasekeraDimitrios Velenis
- Topics
- 3D IC and TSV technologies (25 papers)Semiconductor materials and devices (12 papers)Electronic Packaging and Soldering Technologies (9 papers)
- Partner nations
- BelgiumSingaporeUnited States
In The Last Decade
Guruprasad Katti
26 papers receiving 1.0k citations
Hit Papers
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 1.0k
- Biomedical Engineering 140
- Atomic and Molecular Physics, and Optics 105
- Computer Networks and Communications 95
- Automotive Engineering 90
Countries citing papers authored by Guruprasad Katti
This map shows the geographic impact of Guruprasad Katti's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guruprasad Katti with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guruprasad Katti more than expected).
Fields of papers citing papers by Guruprasad Katti
This network shows the impact of papers produced by Guruprasad Katti. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guruprasad Katti. The network helps show where Guruprasad Katti may publish in the future.
Co-authorship network of co-authors of Guruprasad Katti
This figure shows the co-authorship network connecting the top 25 collaborators of Guruprasad Katti. A scholar is included among the top collaborators of Guruprasad Katti based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guruprasad Katti. Guruprasad Katti is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 9 | |
| 2 | 10 | |
| 3 | 6 | |
| 4 | 1 | |
| 5 | 7 | |
| 6 | 20 | |
| 7 | 8 | |
| 8 | 6 | |
| 9 | 8 | |
| 10 | 35 | |
| 11 | 26 | |
| 12 | 21 | |
| 13 | 12 | |
| 14 | 73 | |
| 15 | 17 | |
| 16 | 57 | |
| 17 | 4 | |
| 18 | 36 | |
| 19 | 56 | |
| 20 | Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICsbreakdown → | 477 |
About Guruprasad Katti
Guruprasad Katti is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Automotive Engineering, having authored 27 papers that have together received 1.1k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (25 papers), Semiconductor materials and devices (12 papers) and Electronic Packaging and Soldering Technologies (9 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.0k citations), Hardware and Architecture (80 citations) and Automotive Engineering (90 citations). Guruprasad Katti has collaborated with scholars based in Belgium, Singapore and United States. Frequent co-authors include Wim Dehaene, Michele Stucchi, K. De Meyer, J. Van Olmen, Eric Beyne, Youssef Travaly, Roshan Weerasekera, Dimitrios Velenis, Cedric Huyghebaert and Bart Swinnen. Their work appears in journals such as Proceedings of the IEEE, IEEE Transactions on Electron Devices and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.