R. Yu
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advanced MEMS and NEMS Technologies
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 4
- Semiconductor materials and devices 4
- Electronic Packaging and Soldering Technologies 3
- Advanced MEMS and NEMS Technologies 2
- Electric Vehicles and Infrastructure 2
- Electrowetting and Microfluidic Technologies 2
- Advancements in Photolithography Techniques 1
- Co-authors
- S. PurushothamanUte DrechslerM. DespontKuan‐Neng ChenP. VettigerDouglas Charles La TulipeSteven J. KoesterAnthony Young
- Journals
- Journal of Microelectromechanical Systems (1 paper)IBM Journal of Research and Development (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (1 paper)Processes (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)
- Partner nations
- United StatesSwitzerlandChina
In The Last Decade
R. Yu
10 papers receiving 381 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 370
- Automotive Engineering 47
- Hardware and Architecture 24
- Electronic, Optical and Magnetic Materials 59
- Biomedical Engineering 88
Countries citing papers authored by R. Yu
This map shows the geographic impact of R. Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Yu more than expected).
Fields of papers citing papers by R. Yu
This network shows the impact of papers produced by R. Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Yu. The network helps show where R. Yu may publish in the future.
Co-authors
The 25 scholars most cited alongside R. Yu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2013 | 5 | |
| 3 | 2008 | 139 | |
| 4 | 2007 | 49 | |
| 5 | Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding | 2006 | 5 |
| 6 | 2005 | 10 | |
| 7 | 2004 | 19 | |
| 8 | 2004 | 68 | |
| 9 | 2003 | 103 | |
| 10 | 1998 | 4 |
About R. Yu
R. Yu is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Surfaces, Coatings and Films, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials, having authored 10 papers that have together received 403 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (4 papers), Semiconductor materials and devices (4 papers), Electronic Packaging and Soldering Technologies (3 papers), Advanced MEMS and NEMS Technologies (2 papers), Electric Vehicles and Infrastructure (2 papers), Electrowetting and Microfluidic Technologies (2 papers), Force Microscopy Techniques and Applications (1 paper) and Advancements in Photolithography Techniques (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (370 citations), Automotive Engineering (47 citations), Hardware and Architecture (24 citations), Electronic, Optical and Magnetic Materials (59 citations) and Biomedical Engineering (88 citations). R. Yu has collaborated with scholars based in United States, Switzerland and China. Frequent co-authors include S. Purushothaman, Ute Drechsler, M. Despont, Kuan‐Neng Chen, P. Vettiger, Douglas Charles La Tulipe, Steven J. Koester, Anthony Young, E. Sprogis and L. Shi. Their work appears in journals such as Journal of Microelectromechanical Systems, IBM Journal of Research and Development, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Processes and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.