E.B. Liao

765 citations

35 papers · 530 indexed · h-index 14

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies 17
- Electronic Packaging and Soldering Technologies 14
- Semiconductor materials and devices 9
- Advanced MEMS and NEMS Technologies 6
- Electromagnetic Compatibility and Noise Suppression 3
- Photonic and Optical Devices 3
Automotive Engineering top 10%
Biomedical Engineering
Electronic, Optical and Magnetic Materials
Hardware and Architecture
Mechanical Engineering
- Modular Robots and Swarm Intelligence 3
Bioengineering
- Analytical Chemistry and Sensors 3

Co-authors: R. Nagarajan V. Kripesh John H. Lau Xiaowu Zhang T.C. Chai H.Y. Li Navas Khan Wee‐Liat Ong
Cited by: Electrical and Electronic Engineering Automotive Engineering Biomedical Engineering
Journals: IEEE Electron Device Letters (3 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)IEEE Transactions on Advanced Packaging (2 papers)
Partner nations: Singapore United States Taiwan

In The Last Decade

E.B. Liao

33 papers receiving 499 citations

Peers

Countries citing papers authored by E.B. Liao

Since Specialization

Citations

This map shows the geographic impact of E.B. Liao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E.B. Liao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E.B. Liao more than expected).

Fields of papers citing papers by E.B. Liao

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E.B. Liao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E.B. Liao. The network helps show where E.B. Liao may publish in the future.

Co-authorship network

The 25 scholars most cited alongside E.B. Liao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with E.B. Liao Line = papers co-authored together E.B. Liao links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	A review of the advances and prospects of aqueous Dual-Ion batteries Chemical Engineering Journal ·Željko Valpotić,Zhu Teng‐Gao,石川県立金沢伏見高等学校,Ye Zheng,E.B. Liao,Pellikka,Kyungsoo Shin,Botian Liu,麦岚,Caineng Zou,Yongbing Tang	2024	15
2	SoIC for Low-Temperature, Multi-Layer 3D Memory Integration Гладышев Юрий Владимирович,Doriscelda Ponce Amador,E.B. Liao,W.C. Chiou,Mario Agio,ジョエリベイタヤキ,Chung-Hsien Tsai,C. T. Wang,Douglas Yu	2020	33
3	Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer IEEE Transactions on Components Packaging and Manufacturing Technology ·Tai Chong Chai,Xiaowu Zhang,John H. Lau,Cheryl Selvanayagam,(unknown),Brenda Mix,유병구,Vatcharin Hamratanaphon,晃亘内田,Hong Yu Li,E.B. Liao,N. Ranganathan,Kripesh Vaidyanathan,Shiguo Liu,C. B. White,Keilea Bullard,Charles J. Vath,Gexin Zhou	2011	35
4	Fast electroplating TSV process development for the via-last approach Andi Muh Fikram Aditama Wildam,E.B. Liao,Fatemeh Arab BaniAsad,董蓁,Jean‐Jacques Salzmann,Jiadong Sun	2010	22
5	3D interconnection process development and integration with low stress TSV Aslihan Çelik Çoban,Soon Wee Ho,Shereen A. Murugayah,A.B. Dowlatabadi,E.B. Liao,Prakash Pralhad Sarwade,Kazuyoshi Onishi,A. V. Chikinev,Fatemeh Arab BaniAsad,Gaoning Zhang,Samantha Elizabeth Vargas Cárdenas,Erika A. Harrell,С.Л. Серебряков	2010	17
6	Characterization and management of wafer stress for various pattern densities in 3D integration technology Fatemeh Arab BaniAsad,Aslihan Çelik Çoban,上田隆穂,E.B. Liao,Kazuyoshi Onishi,Fa Xing	2010	17
7	Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package Rare & Special e-Zone (The Hong Kong University of Science and Technology) ·Xiaowu Zhang,T.C. Chai,John H. Lau,Cheryl Selvanayagam,Kalyan Biswas,Shiguo Liu,D. Pinjala,Gongyue Tang,유병구,Srinivasa Rao Vempati,晃亘内田,H.Y. Li,E.B. Liao,N. Ranganathan,V. Kripesh,C. B. White,Bingwen Zhou,Charles J. Vath	2009	90
8	Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer IEEE Transactions on Electron Devices ·E. Raymond Wilson,Aibing Yu,Rong Yang,H.Y. Li,Guo Li,E.B. Liao,Min Tang,G. Q. Lo,N. Balasubramanian,Dim Lee Kwong	2008	7
9	High-Q on-chip inductors using extremely thick silicon dioxide and copper-damascene technology Electronics Letters ·Min Tang,H.Y. Li,Brittany McHale,E.B. Liao,Aibing Yu,G. Q. Lo,N. Balasubramanian,D. L. Kwong	2008	7
10	High performance embedded RF passive device process integration H.Y. Li,Gilberto Hishinuma,Navas Khan,B. YIAN,Vempati Srinivasa Rao,Mirtha Alida Albornoz Cajas,E.B. Liao,Judith J.E,V. Kripesh,D. Scotti	2008	5
11	Novel Integration of Metal–Insulator–Metal (MIM) Capacitors Comprising Perovskite-type Dielectric and Cu Bottom Electrode on Low-Temperature Packaging Substrates IEEE Electron Device Letters ·E.B. Liao,С. М. Дронов,Weiguang Zhu,B. YIAN,Poh Chong Lim,G. Q. Lo,D. L. Kwong	2008	3
12	Shape matching-assisted self-assembly of microchips on a silicon substrate Zulkili Zulkifli,А. О. Дубровник-Рохова,유병구,E.B. Liao,V. Kripesh	2006	2
13	Bendability of single-crystal Si MOSFETs investigated on flexible substrate IEEE Electron Device Letters ·H.Y. Li,Guo Li,W.Y. Loh,L. K. Bera,E. Raymond Wilson,Dubae Jeong,E.B. Liao,B. YIAN,G. Tsivgoulis,Zexiang Shen,Changqing Cheng,G. Q. Lo,N. Balasubramanian,Dim‐Lee Kwong	2006	17
14	Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System E. Raymond Wilson,Aibing Yu,Rui Yang,H.Y. Li,Guo Li,E.B. Liao,Min Tang,Rakesh Kumar,A. Q. Liu,G. Q. Lo,N. Balasubramanian,Dim‐Lee Kwong	2006	13
15	Numerical Analysis on Compliance and Electrical Behavior of Multi-Copper-Column Flip-Chip Interconnects for Wafer-Level Packaging IEEE Transactions on Advanced Packaging ·E.B. Liao,A.A.O. Tay,Simon S. Ang,Cross Gf,R. Nagarajan,V. Kripesh	2006	4
16	A MEMS-Based Compliant Interconnect for Ultra-Fine-Pitch Wafer Level Packaging National University of Singapore ·E.B. Liao,A.A.O. Tay,Simon S. Ang,Cross Gf,R. Nagarajan,V. Kripesh,Rakesh Kumar,M.K. Iyer	2006	2
17	Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects E.B. Liao,A.A.O. Tay,Simon S. Ang,Cross Gf,R. Nagarajan,V. Kripesh	2005	0
18	High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates IEEE Electron Device Letters ·E.B. Liao,Guo Li,Rakesh Kumar,G. Q. Lo,N. Balasubramanian,D. L. Kwong	2005	4
19	Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks Thin Solid Films ·E.B. Liao,W. H. Teh,B. YIAN,A.A.O. Tay,Cross Gf,Rakesh Kumar	2005	15
20	Fabrication and parametric study of wafer-level multiple-copper-column interconnect E.B. Liao,Simon S. Ang,A.A.O. Tay,Cross Gf,R. Nagarajan,V. Kripesh	2004	3

About E.B. Liao

E.B. Liao is a scholar working on Electrical and Electronic Engineering, Bioengineering, Electrochemistry, Human-Computer Interaction and Automotive Engineering, having authored 35 papers that have together received 530 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (14 papers), Semiconductor materials and devices (9 papers), Advanced MEMS and NEMS Technologies (6 papers), Modular Robots and Swarm Intelligence (3 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Photonic and Optical Devices (3 papers) and Analytical Chemistry and Sensors (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (465 citations), Automotive Engineering (80 citations), Biomedical Engineering (157 citations), Electronic, Optical and Magnetic Materials (38 citations) and Hardware and Architecture (9 citations). E.B. Liao has collaborated with scholars based in Singapore, United States and Taiwan. Frequent co-authors include R. Nagarajan, V. Kripesh, John H. Lau, Xiaowu Zhang, T.C. Chai, H.Y. Li, Navas Khan, Wee‐Liat Ong, Levent Yobaş and Ajay Agarwal. Their work appears in journals such as IEEE Electron Device Letters, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Advanced Packaging, IEEE Transactions on Electron Devices and IEEE Transactions on Components Packaging and Manufacturing Technology.

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