E.B. Liao

765 total citations
35 papers, 530 citations indexed

About

E.B. Liao is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, E.B. Liao has authored 35 papers receiving a total of 530 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 5 papers in Mechanical Engineering. Recurrent topics in E.B. Liao's work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (9 papers). E.B. Liao is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (9 papers). E.B. Liao collaborates with scholars based in Singapore, United States and Taiwan. E.B. Liao's co-authors include R. Nagarajan, V. Kripesh, John H. Lau, Xiaowu Zhang, T.C. Chai, H.Y. Li, Navas Khan, Wee‐Liat Ong, Levent Yobaş and Ajay Agarwal and has published in prestigious journals such as Chemical Engineering Journal, IEEE Transactions on Electron Devices and Thin Solid Films.

In The Last Decade

E.B. Liao

33 papers receiving 499 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
E.B. Liao Singapore 14 465 157 80 47 41 35 530
M. J. Wolf Germany 13 540 1.2× 126 0.8× 82 1.0× 34 0.7× 59 1.4× 41 606
Aibin Yu Singapore 14 429 0.9× 95 0.6× 82 1.0× 81 1.7× 40 1.0× 27 479
Kripesh Vaidyanathan Singapore 13 611 1.3× 162 1.0× 135 1.7× 123 2.6× 54 1.3× 33 718
Akitsu Shigetou Japan 13 562 1.2× 172 1.1× 120 1.5× 44 0.9× 45 1.1× 54 638
Kenneth June Rebibis Belgium 14 513 1.1× 167 1.1× 102 1.3× 65 1.4× 42 1.0× 76 554
Viorel Drăgoi Austria 13 630 1.4× 179 1.1× 104 1.3× 52 1.1× 49 1.2× 107 707
Cong Li China 17 834 1.8× 175 1.1× 80 1.0× 46 1.0× 59 1.4× 81 887
Sung-Hwan Hwang United States 11 367 0.8× 107 0.7× 31 0.4× 74 1.6× 81 2.0× 28 498
Jang‐Hi Im United States 9 419 0.9× 106 0.7× 49 0.6× 32 0.7× 25 0.6× 16 448
Dapeng Chen China 12 304 0.7× 75 0.5× 67 0.8× 30 0.6× 71 1.7× 50 380

Countries citing papers authored by E.B. Liao

Since Specialization
Citations

This map shows the geographic impact of E.B. Liao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E.B. Liao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E.B. Liao more than expected).

Fields of papers citing papers by E.B. Liao

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E.B. Liao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E.B. Liao. The network helps show where E.B. Liao may publish in the future.

Co-authorship network of co-authors of E.B. Liao

This figure shows the co-authorship network connecting the top 25 collaborators of E.B. Liao. A scholar is included among the top collaborators of E.B. Liao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E.B. Liao. E.B. Liao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zheng, Ye, E.B. Liao, Kyungsoo Shin, et al.. (2024). A review of the advances and prospects of aqueous Dual-Ion batteries. Chemical Engineering Journal. 493. 152864–152864. 15 indexed citations
2.
Liao, E.B., et al.. (2020). SoIC for Low-Temperature, Multi-Layer 3D Memory Integration. 855–860. 33 indexed citations
3.
Chai, Tai Chong, Xiaowu Zhang, John H. Lau, et al.. (2011). Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(5). 660–672. 35 indexed citations
4.
Liao, E.B., et al.. (2010). Fast electroplating TSV process development for the via-last approach. 777–780. 22 indexed citations
5.
Ho, Soon Wee, et al.. (2010). 3D interconnection process development and integration with low stress TSV. 798–802. 17 indexed citations
6.
7.
Zhang, Xiaowu, T.C. Chai, John H. Lau, et al.. (2009). Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 305–312. 90 indexed citations
8.
Yu, Aibing, Rong Yang, H.Y. Li, et al.. (2008). Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer. IEEE Transactions on Electron Devices. 55(9). 2484–2491. 7 indexed citations
9.
Tang, Min, H.Y. Li, E.B. Liao, et al.. (2008). High-Q on-chip inductors using extremely thick silicon dioxide and copper-damascene technology. Electronics Letters. 44(3). 241–242. 7 indexed citations
10.
Li, H.Y., et al.. (2008). High performance embedded RF passive device process integration. 40. 1709–1713. 5 indexed citations
11.
12.
Liao, E.B., et al.. (2006). Shape matching-assisted self-assembly of microchips on a silicon substrate. 1045. 6–9. 2 indexed citations
13.
Li, H.Y., Guo Li, W.Y. Loh, et al.. (2006). Bendability of single-crystal Si MOSFETs investigated on flexible substrate. IEEE Electron Device Letters. 27(7). 538–541. 17 indexed citations
14.
Yu, Aibing, Rui Yang, H.Y. Li, et al.. (2006). Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System. 1–4. 13 indexed citations
15.
Liao, E.B., et al.. (2006). Numerical Analysis on Compliance and Electrical Behavior of Multi-Copper-Column Flip-Chip Interconnects for Wafer-Level Packaging. IEEE Transactions on Advanced Packaging. 29(2). 343–353. 4 indexed citations
16.
Liao, E.B., A.A.O. Tay, Simon S. Ang, et al.. (2006). A MEMS-Based Compliant Interconnect for Ultra-Fine-Pitch Wafer Level Packaging. National University of Singapore. 1246–1250. 2 indexed citations
17.
18.
Liao, E.B., Guo Li, Rakesh Kumar, et al.. (2005). High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates. IEEE Electron Device Letters. 26(12). 885–887. 4 indexed citations
19.
Liao, E.B., et al.. (2005). Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks. Thin Solid Films. 504(1-2). 252–256. 15 indexed citations
20.
Liao, E.B., et al.. (2004). Fabrication and parametric study of wafer-level multiple-copper-column interconnect. 1251–1255. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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