Chukwudi Okoro

1.4k total citations
55 papers, 1.0k citations indexed

About

Chukwudi Okoro is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering. According to data from OpenAlex, Chukwudi Okoro has authored 55 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 52 papers in Electrical and Electronic Engineering, 18 papers in Electronic, Optical and Magnetic Materials and 9 papers in Automotive Engineering. Recurrent topics in Chukwudi Okoro's work include 3D IC and TSV technologies (45 papers), Electronic Packaging and Soldering Technologies (40 papers) and Copper Interconnects and Reliability (18 papers). Chukwudi Okoro is often cited by papers focused on 3D IC and TSV technologies (45 papers), Electronic Packaging and Soldering Technologies (40 papers) and Copper Interconnects and Reliability (18 papers). Chukwudi Okoro collaborates with scholars based in United States, Belgium and Egypt. Chukwudi Okoro's co-authors include Yaw S. Obeng, Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Scott Pollard, Riet Labie, Kris Vanstreels, Bert Verlinden, Lyle E. Levine and Ruqing Xu and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Chukwudi Okoro

53 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chukwudi Okoro United States 18 942 212 210 131 121 55 1.0k
Riet Labie Belgium 18 1.1k 1.2× 165 0.8× 189 0.9× 79 0.6× 273 2.3× 58 1.2k
M. Murugesan Japan 17 914 1.0× 252 1.2× 114 0.5× 164 1.3× 203 1.7× 121 1.0k
T.C. Chai Singapore 13 821 0.9× 143 0.7× 96 0.5× 143 1.1× 68 0.6× 48 868
Alain Phommahaxay Belgium 18 988 1.0× 309 1.5× 146 0.7× 199 1.5× 97 0.8× 93 1.1k
L.W. Schaper United States 15 563 0.6× 117 0.6× 108 0.5× 43 0.3× 62 0.5× 64 669
Olalla Varela Pedreira Belgium 17 859 0.9× 131 0.6× 408 1.9× 33 0.3× 62 0.5× 61 934
Akitsu Shigetou Japan 13 562 0.6× 172 0.8× 141 0.7× 120 0.9× 44 0.4× 54 638
Kripesh Vaidyanathan Singapore 13 611 0.6× 162 0.8× 56 0.3× 135 1.0× 123 1.0× 33 718
Viorel Drăgoi Austria 13 630 0.7× 179 0.8× 64 0.3× 104 0.8× 52 0.4× 107 707
Erik Sleeckx Belgium 19 967 1.0× 230 1.1× 165 0.8× 51 0.4× 47 0.4× 74 1.1k

Countries citing papers authored by Chukwudi Okoro

Since Specialization
Citations

This map shows the geographic impact of Chukwudi Okoro's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chukwudi Okoro with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chukwudi Okoro more than expected).

Fields of papers citing papers by Chukwudi Okoro

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chukwudi Okoro. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chukwudi Okoro. The network helps show where Chukwudi Okoro may publish in the future.

Co-authorship network of co-authors of Chukwudi Okoro

This figure shows the co-authorship network connecting the top 25 collaborators of Chukwudi Okoro. A scholar is included among the top collaborators of Chukwudi Okoro based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chukwudi Okoro. Chukwudi Okoro is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Oladele, Isiaka Oluwole, et al.. (2024). Sustainable composites reinforced with glass fiber and bio-derived calcium carbonate in recycled polypropylene. SHILAP Revista de lepidopterología. 8. 100357–100357. 4 indexed citations
2.
Pan, Ke, et al.. (2023). High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(11). 1861–1867. 4 indexed citations
3.
Okoro, Chukwudi, Shrisudersan Jayaraman, & Scott Pollard. (2021). Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates. Microelectronics Reliability. 120. 114092–114092. 23 indexed citations
4.
Okoro, Chukwudi, et al.. (2021). Elimination of Thermo-Mechanically Driven Circumferential Crack Formation in Copper Through-Glass via Substrate. IEEE Transactions on Device and Materials Reliability. 21(3). 354–360. 14 indexed citations
5.
6.
Okoro, Chukwudi, et al.. (2020). The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study. Multidiscipline Modeling in Materials and Structures. 17(2). 451–464. 13 indexed citations
7.
Okoro, Chukwudi, et al.. (2017). The Impact of Organic Additives on Copper Trench Microstructure. Journal of The Electrochemical Society. 164(9). D543–D550. 18 indexed citations
8.
Darroudi, Taghi, et al.. (2016). The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films. Thin Solid Films. 621. 91–97. 30 indexed citations
9.
Obeng, Yaw S., et al.. (2016). Towards Understanding Early Failures Behavior during Device Burn-In: Broadband RF Monitoring of Atomistic Changes in Materials. ECS Journal of Solid State Science and Technology. 5(9). N61–N66. 7 indexed citations
10.
Okoro, Chukwudi, Lyle E. Levine, Ruqing Xu, & Yaw S. Obeng. (2015). Experimental measurement of the effect of copper through-silicon via diameter on stress buildup using synchrotron-based X-ray source. Journal of Materials Science. 50(18). 6236–6244. 16 indexed citations
11.
Levine, Lyle E., Chukwudi Okoro, & Ruqing Xu. (2015). Full elastic strain and stress tensor measurements from individual dislocation cells in copper through-Si vias. IUCrJ. 2(6). 635–642. 19 indexed citations
12.
Okoro, Chukwudi, et al.. (2013). Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals. IEEE Transactions on Electron Devices. 60(6). 2015–2021. 16 indexed citations
13.
Okoro, Chukwudi, Lyle E. Levine, Ruqing Xu, et al.. (2013). X-ray micro-beam diffraction determination of full stress tensors in Cu TSVs. 5. 648–652. 7 indexed citations
14.
Okoro, Chukwudi, et al.. (2013). Use of RF-based technique as a metrology tool for TSV reliability analysis. 612. 186–191. 3 indexed citations
15.
16.
Minas, Nikolaos, Geert Van der Plas, Herman Oprins, et al.. (2012). Design of Test Structures for the Characterization of Thermal–Mechanical Stress in 3D-Stacked IC. IEEE Transactions on Semiconductor Manufacturing. 25(3). 365–371. 6 indexed citations
17.
Okoro, Chukwudi, Riet Labie, Kris Vanstreels, et al.. (2011). Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu. Journal of Materials Science. 46(11). 3868–3882. 69 indexed citations
18.
Okoro, Chukwudi, Cedric Huyghebaert, J. Van Olmen, et al.. (2010). Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration. AIP conference proceedings. 40 indexed citations
19.
Okoro, Chukwudi, Kris Vanstreels, Riet Labie, et al.. (2010). Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV. Journal of Micromechanics and Microengineering. 20(4). 45032–45032. 89 indexed citations
20.
Okoro, Chukwudi, Mario González, Bart Vandevelde, et al.. (2007). Prediction of the Influence of Induced Stresses in Silicon on CMOS Performance in a Cu-Through-Via Interconnect Technology. Lirias (KU Leuven). 19 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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