T.L. McDevitt
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- Copper Interconnects and Reliability 2
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- Integrated Circuits and Semiconductor Failure Analysis 4
- Semiconductor materials and devices 4
- 3D IC and TSV technologies 3
- Advancements in Photolithography Techniques 2
- Electronic Packaging and Soldering Technologies 2
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- nanoparticles nucleation surface interactions 3
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- Manufacturing Process and Optimization 1
- Co-authors
- S. MahajanWilliam A. BonnerV. G. KeramidasDavid E. LaughlinS. LuceR. WachnikN. LustigCyprian Uzoh
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringHardware and Architecture
- Journals
- Physical review. B, Condensed matter (1 paper)ECS Transactions (1 paper)Scripta Metallurgica (1 paper)
- Partner nations
- United States
In The Last Decade
T.L. McDevitt
11 papers receiving 318 citations
Peers
Comparison fields: 5 of 35
- Electronic, Optical and Magnetic Materials 128
- Electrical and Electronic Engineering 270
- Hardware and Architecture 28
- Atomic and Molecular Physics, and Optics 97
- Materials Chemistry 76
Countries citing papers authored by T.L. McDevitt
This map shows the geographic impact of T.L. McDevitt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.L. McDevitt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.L. McDevitt more than expected).
Fields of papers citing papers by T.L. McDevitt
This network shows the impact of papers produced by T.L. McDevitt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.L. McDevitt. The network helps show where T.L. McDevitt may publish in the future.
Co-authorship network
The 25 scholars most cited alongside T.L. McDevitt, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 1 | |
| 2 | 2008 | 7 | |
| 3 | 2007 | 4 | |
| 4 | 2003 | 2 | |
| 5 | 2003 | 7 | |
| 6 | 2002 | 33 | |
| 7 | 2002 | 196 | |
| 8 | 2002 | 3 | |
| 9 | 1992 | 79 | |
| 10 | 1990 | 3 | |
| 11 | 1986 | 4 |
About T.L. McDevitt
T.L. McDevitt is a scholar working on Structural Biology, Atmospheric Science and Electrical and Electronic Engineering, having authored 11 papers that have together received 339 indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (4 papers), Semiconductor materials and devices (4 papers), nanoparticles nucleation surface interactions (3 papers), 3D IC and TSV technologies (3 papers), Advancements in Photolithography Techniques (2 papers), Copper Interconnects and Reliability (2 papers), Electronic Packaging and Soldering Technologies (2 papers) and Manufacturing Process and Optimization (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (128 citations), Electrical and Electronic Engineering (270 citations) and Hardware and Architecture (28 citations). T.L. McDevitt has collaborated with scholars based in United States. Frequent co-authors include S. Mahajan, William A. Bonner, V. G. Keramidas, David E. Laughlin, S. Luce, R. Wachnik, N. Lustig, Cyprian Uzoh, H. Rathore and R. Goldblatt. Their work appears in journals such as Physical review. B, Condensed matter, ECS Transactions, Scripta Metallurgica and MRS Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.