R. Augur
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Copper Interconnects and Reliability 22
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- Semiconductor materials and devices 14
- Electronic Packaging and Soldering Technologies 6
- 3D IC and TSV technologies 4
- Advancements in Semiconductor Devices and Circuit Design 2
- Co-authors
- Marilyn A. Rasco (3 shared papers)A.G. Dirks (6 shared papers)Paul Gillespie (3 shared papers)Choong-Un Kim (2 shared papers)Jian‐Qiang Lu (2 shared papers)Yongchai Kwon (2 shared papers)R.J. Gutmann (2 shared papers)R.A.M. Wolters (5 shared papers)
- Journals
- Journal of Electronic Materials (2 papers)Applied Physics Letters (2 papers)Applied Surface Science (1 paper)Microelectronic Engineering (1 paper)Review of Scientific Instruments (1 paper)
- Partner nations
- NetherlandsUnited StatesGermany
In The Last Decade
R. Augur
23 papers receiving 254 citations
Peers
Comparison fields: 5 of 22
- Electronic, Optical and Magnetic Materials 171
- Electrical and Electronic Engineering 233
- Mechanics of Materials 51
- Materials Chemistry 49
- Biomedical Engineering 42
Countries citing papers authored by R. Augur
This map shows the geographic impact of R. Augur's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Augur with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Augur more than expected).
Fields of papers citing papers by R. Augur
This network shows the impact of papers produced by R. Augur. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Augur. The network helps show where R. Augur may publish in the future.
Co-authors
The 25 scholars most cited alongside R. Augur, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 72 | |
| 2 | 2004 | 27 | |
| 3 | 2003 | 24 | |
| 4 | 2002 | 18 | |
| 5 | 2008 | 18 | |
| 6 | 2003 | 14 | |
| 7 | 2002 | 14 | |
| 8 | 1994 | 12 | |
| 9 | 1995 | 9 | |
| 10 | 2001 | 8 | |
| 11 | 1996 | 7 | |
| 12 | 2001 | 6 | |
| 13 | 1992 | 6 | |
| 14 | 1994 | 6 | |
| 15 | 1994 | 5 | |
| 16 | 1996 | 5 | |
| 17 | 2003 | 4 | |
| 18 | 2001 | 3 | |
| 19 | 2003 | 3 | |
| 20 | 2017 | 2 |
About R. Augur
R. Augur is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Materials Chemistry and Aerospace Engineering, having authored 27 papers that have together received 269 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (22 papers), Semiconductor materials and devices (14 papers), Semiconductor materials and interfaces (8 papers), Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers), Aluminum Alloy Microstructure Properties (3 papers), Nanoporous metals and alloys (3 papers) and Advancements in Semiconductor Devices and Circuit Design (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (171 citations), Electrical and Electronic Engineering (233 citations), Mechanics of Materials (51 citations), Materials Chemistry (49 citations) and Biomedical Engineering (42 citations). R. Augur has collaborated with scholars based in Netherlands, United States and Germany. Frequent co-authors include Marilyn A. Rasco, A.G. Dirks, Paul Gillespie, Choong-Un Kim, Jian‐Qiang Lu, Yongchai Kwon, R.J. Gutmann, R.A.M. Wolters, Robert Havemann and T.S. Cale. Their work appears in journals such as Journal of Electronic Materials, Applied Physics Letters, Applied Surface Science, Microelectronic Engineering and Review of Scientific Instruments.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.