Peter Børgesen

3.8k total citations
208 papers, 3.2k citations indexed

About

Peter Børgesen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Peter Børgesen has authored 208 papers receiving a total of 3.2k indexed citations (citations by other indexed papers that have themselves been cited), including 142 papers in Electrical and Electronic Engineering, 65 papers in Mechanical Engineering and 48 papers in Mechanics of Materials. Recurrent topics in Peter Børgesen's work include Electronic Packaging and Soldering Technologies (117 papers), 3D IC and TSV technologies (41 papers) and Aluminum Alloy Microstructure Properties (22 papers). Peter Børgesen is often cited by papers focused on Electronic Packaging and Soldering Technologies (117 papers), 3D IC and TSV technologies (41 papers) and Aluminum Alloy Microstructure Properties (22 papers). Peter Børgesen collaborates with scholars based in United States, Germany and Denmark. Peter Børgesen's co-authors include Liang Yin, E. J. Cotts, Sa’d Hamasha, Luke Wentlent, Awni Qasaimeh, B.M.U. Scherzer, Nikolay Dimitrov, W. Möller, L. Zavalij and Babak Arfaei and has published in prestigious journals such as Journal of Geophysical Research Atmospheres, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Peter Børgesen

202 papers receiving 3.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Peter Børgesen United States	31	2.4k	1.3k	627	575	469	208	3.2k
Ragnar Holm Germany	17	1.3k 0.5×	1.5k 1.2×	776 1.2×	1.1k 1.8×	452 1.0×	62	3.2k
I. C. Noyan United States	24	1.4k 0.6×	2.2k 1.8×	1.9k 3.0×	2.0k 3.5×	271 0.6×	140	4.9k
David E.J. Armstrong United Kingdom	37	666 0.3×	2.3k 1.8×	2.6k 4.2×	1.3k 2.2×	846 1.8×	114	4.5k
Chad M. Parish United States	38	624 0.3×	2.3k 1.8×	3.1k 5.0×	506 0.9×	1.6k 3.3×	143	5.0k
Lance L. Snead United States	47	2.0k 0.8×	3.4k 2.7×	5.7k 9.1×	960 1.7×	1.4k 3.0×	128	8.8k
Е. М. Oks Russia	33	2.0k 0.9×	624 0.5×	1.2k 2.0×	2.7k 4.7×	326 0.7×	428	4.4k
Danny J. Edwards United States	30	330 0.1×	945 0.7×	2.2k 3.4×	252 0.4×	304 0.6×	116	2.8k
Guangjun Gao China	27	2.0k 0.8×	578 0.5×	1.1k 1.7×	608 1.1×	793 1.7×	149	4.6k
David J. Rowenhorst United States	24	250 0.1×	967 0.8×	851 1.4×	356 0.6×	306 0.7×	56	1.8k

Countries citing papers authored by Peter Børgesen

Since Specialization

Citations

This map shows the geographic impact of Peter Børgesen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Børgesen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Børgesen more than expected).

Fields of papers citing papers by Peter Børgesen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Peter Børgesen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Børgesen. The network helps show where Peter Børgesen may publish in the future.

Co-authorship network of co-authors of Peter Børgesen

This figure shows the co-authorship network connecting the top 25 collaborators of Peter Børgesen. A scholar is included among the top collaborators of Peter Børgesen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Peter Børgesen. Peter Børgesen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Gharaibeh, Mohammad A., et al.. (2025). Superior reliability of SAC305-SnBi solder joints formed in a 150 °C reflow. Materials Science and Engineering A. 941. 148598–148598.

Gharaibeh, Mohammad A., et al.. (2025). Post-annealing of hybrid SAC305-SnBi solder joints formed with a 150 °C reflow to improve fatigue resistance. Journal of Materials Science Materials in Electronics. 36(5). 1 indexed citations

Jiang, Dayue, Yue Zhou, Mark D. Poliks, Peter Børgesen, & Fuda Ning. (2025). Mechanistic understanding of microstructure evolution in extrusion-based additive manufacturing of stainless steel using modeling, simulation, and experimental analysis. Journal of Manufacturing Processes. 137. 68–81. 2 indexed citations

Børgesen, Peter, et al.. (2024). All-electrochemical synthesis of SnBi/SnAgCu structures for low-temperature formation of high-reliability solder microjoints. Journal of Alloys and Compounds. 995. 174699–174699. 5 indexed citations

Lei, Zhen, Peter Børgesen, & Nikolay Dimitrov. (2024). Electrodeposition Complexity and the Root Cause of Interfacial Voiding in Solder Joints with Plated Nickel. ACS Applied Electronic Materials. 6(1). 457–464. 1 indexed citations

Alhendi, Mohammed, et al.. (2022). Fatigue behaviour of inkjet-printed silver interconnects on silica-coated mesoporous flexible PET substrate. Flexible and Printed Electronics. 7(1). 15011–15011. 3 indexed citations

Børgesen, Peter, et al.. (2017). Assessing the Reliability of High Temperature Solder Alternatives. 2. 1987–1995. 5 indexed citations

Børgesen, Peter, E. J. Cotts, & I. Dutta. (2014). Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder. 16(1). 14 indexed citations

Børgesen, Peter. (2014). Assessment of microelectronics interconnect reliability - current practice and trends. 1–5. 1 indexed citations

10.

Yin, Liang & Peter Børgesen. (2011). On the root cause of Kirkendall voiding in Cu₃Sn. Journal of materials research/Pratt's guide to venture capital sources. 26(3). 455–466. 94 indexed citations

11.

Børgesen, Peter, et al.. (2011). Acceleration of the growth of Cu3Sn voids in solder joints. Microelectronics Reliability. 52(6). 1121–1127. 21 indexed citations

12.

Wentlent, Luke, et al.. (2011). Damage Mechanisms And Acceleration Factors For No-Pb LGA, TSOP, And QFN Type Assemblies In Thermal Cycling. 13(1). 101–110.

13.

Børgesen, Peter, et al.. (2003). ASSEMBLY AND RELIABILITY ISSUES ASSOCIATED WITH LEADLESS CHIP SCALE PACKAGES. IMAPSource Proceedings. 900–905. 1 indexed citations

14.

Zribi, A., Peter Børgesen, L. Zavalij, & E. J. Cotts. (2000). Growth of Cu-Ni-Sn Alloys in Pb Free CuSnAg Solder/Au-Ni Metallization Reactions. MRS Proceedings. 652. 2 indexed citations

15.

Børgesen, Peter, M. A. Korhonen, D. D. Brown, & C.-Y. Li. (1993). Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions. MRS Proceedings. 308. 1 indexed citations

16.

Børgesen, Peter, M. A. Korhonen, & Che‐Yu Li. (1993). <title>Statistical distributions of stress and electromigration-induced failure</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1805. 130–153. 1 indexed citations

17.

Knapp, J. A., Peter Børgesen, & R. A. Zuhr. (1990). Beam-solid interactions : physical phenomena : symposium held November 27-December 1, 1989, Boston, Massachusetts, U.S.A.. 1 indexed citations

18.

Børgesen, Peter, et al.. (1989). Room temperature ion beam mixing of aluminum with titanium hydride. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms. 43(2). 165–169. 6 indexed citations

19.

Schou, Jørgen, H. Sørensen, & Peter Børgesen. (1984). The measurement of electron-induced erosion of condensed gases: Experimental methods. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms. 5(1). 44–57. 29 indexed citations

20.

Scherzer, B.M.U., H.L. Bay, R. Behrisch, Peter Børgesen, & J. Roth. (1978). Depth profiling of helium in Ni and Nb; comparison of different methods. Nuclear Instruments and Methods. 157(1). 75–81. 41 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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