John Dukovic
- Electrochemistry top 2%
- Electrochemical Analysis and Applications 4
-
- Copper Interconnects and Reliability 5
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- Electrodeposition and Electroless Coatings 11
- Electronic Packaging and Soldering Technologies 8
- 3D IC and TSV technologies 6
- Integrated Circuits and Semiconductor Failure Analysis 5
- Semiconductor materials and devices 3
- Metals and Alloys top 10%
- Materials Chemistry top 10%
- Anodic Oxide Films and Nanostructures 5
- Co-authors
- P. C. AndricacosCyprian UzohJean HorkansHariklia DeligianniCharles W. TobiasL. T. RomankiwS. MehdizadehH. Y. Cheh
- Cited by
- ElectrochemistryElectronic, Optical and Magnetic MaterialsElectrical and Electronic Engineering
- Journals
- Journal of The Electrochemical Society (7 papers)IBM Journal of Research and Development (3 papers)The Electrochemical Society Interface (2 papers)
- Partner nations
- United StatesIsraelGermany
In The Last Decade
John Dukovic
22 papers receiving 1.8k citations
Hit Papers
Peers
Comparison fields: 5 of 62
- Electrochemistry 288
- Electronic, Optical and Magnetic Materials 621
- Electrical and Electronic Engineering 1.6k
- Metals and Alloys 40
- Materials Chemistry 684
Countries citing papers authored by John Dukovic
This map shows the geographic impact of John Dukovic's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Dukovic with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Dukovic more than expected).
Fields of papers citing papers by John Dukovic
This network shows the impact of papers produced by John Dukovic. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Dukovic. The network helps show where John Dukovic may publish in the future.
Co-authorship network
The 25 scholars most cited alongside John Dukovic, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2012 | 21 | |
| 2 | 2009 | 53 | |
| 3 | 2008 | 2 | |
| 4 | 2004 | 3 | |
| 5 | 2002 | 196 | |
| 6 | 2002 | 3 | |
| 7 | 1998 | 3 | |
| 8 | Damascene copper electroplating for chip interconnectionsbreakdown → | 1998 | 1011 |
| 9 | 1993 | 40 | |
| 10 | 1993 | 48 | |
| 11 | Proceedings of the Second International Symposium on Electrochemical Microfabrication | 1992 | 1 |
| 12 | 1992 | 59 | |
| 13 | 1992 | 30 | |
| 14 | Electrochemical Microfabrication II | 1992 | 8 |
| 15 | 1991 | 3 | |
| 16 | 1990 | 36 | |
| 17 | 1990 | 32 | |
| 18 | 1989 | 95 | |
| 19 | 1987 | 191 | |
| 20 | STUDIES ON CURRENT DISTRIBUTION IN ELECTROCHEMICAL CELLS | 1986 | 1 |
About John Dukovic
John Dukovic is a scholar working on Electrochemistry, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 22 papers that have together received 1.9k indexed citations. Recurring topics across this work include Electrodeposition and Electroless Coatings (11 papers), Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers), Copper Interconnects and Reliability (5 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Anodic Oxide Films and Nanostructures (5 papers), Electrochemical Analysis and Applications (4 papers) and Semiconductor materials and devices (3 papers). The work is most often cited by research in Electrochemistry (288 citations), Electronic, Optical and Magnetic Materials (621 citations) and Electrical and Electronic Engineering (1.6k citations). John Dukovic has collaborated with scholars based in United States, Israel and Germany. Frequent co-authors include P. C. Andricacos, Cyprian Uzoh, Jean Horkans, Hariklia Deligianni, Charles W. Tobias, L. T. Romankiw, S. Mehdizadeh, H. Y. Cheh, N. Lustig and R. Wachnik. Their work appears in journals such as Journal of The Electrochemical Society, IBM Journal of Research and Development, The Electrochemical Society Interface, IEEE Transactions on Device and Materials Reliability and ECS Transactions.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.