C.‐K. Hu

3.2k total citations
49 papers, 2.5k citations indexed

About

C.‐K. Hu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, C.‐K. Hu has authored 49 papers receiving a total of 2.5k indexed citations (citations by other indexed papers that have themselves been cited), including 40 papers in Electrical and Electronic Engineering, 37 papers in Electronic, Optical and Magnetic Materials and 8 papers in Mechanics of Materials. Recurrent topics in C.‐K. Hu's work include Copper Interconnects and Reliability (37 papers), Semiconductor materials and devices (26 papers) and Electronic Packaging and Soldering Technologies (19 papers). C.‐K. Hu is often cited by papers focused on Copper Interconnects and Reliability (37 papers), Semiconductor materials and devices (26 papers) and Electronic Packaging and Soldering Technologies (19 papers). C.‐K. Hu collaborates with scholars based in United States, China and Italy. C.‐K. Hu's co-authors include R. Rosenberg, J. M. E. Harper, D. Edelstein, Lynne Gignac, K. P. Rodbell, I. C. Noyan, E. Liniger, Kenneth P. Rodbell, C. Cabral and P. C. Andricacos and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

C.‐K. Hu

49 papers receiving 2.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C.‐K. Hu United States 20 2.2k 2.0k 526 358 344 49 2.5k
D. Edelstein United States 21 1.9k 0.9× 1.0k 0.5× 271 0.5× 291 0.8× 260 0.8× 86 2.2k
M.A. Khan United States 28 2.3k 1.1× 1.2k 0.6× 287 0.5× 772 2.2× 875 2.5× 91 3.5k
M. Shatzkes United States 14 2.4k 1.1× 1.7k 0.9× 590 1.1× 751 2.1× 932 2.7× 31 3.0k
P. M. Fryer United States 13 886 0.4× 559 0.3× 297 0.6× 219 0.6× 430 1.3× 20 1.1k
A. F. Mayadas United States 12 1.9k 0.9× 1.7k 0.9× 592 1.1× 610 1.7× 1.1k 3.3× 28 2.7k
Olof Kordina Sweden 31 3.0k 1.4× 865 0.4× 125 0.2× 696 1.9× 690 2.0× 124 3.3k
J. O. Olowolafe United States 21 1.1k 0.5× 419 0.2× 357 0.7× 547 1.5× 820 2.4× 44 1.7k
Joachim Würfl Germany 31 2.7k 1.3× 1.3k 0.7× 142 0.3× 734 2.1× 703 2.0× 195 3.5k
James W. Pomeroy United Kingdom 33 1.9k 0.9× 626 0.3× 534 1.0× 2.0k 5.7× 371 1.1× 138 3.3k
Andrei Vescan Germany 30 2.2k 1.0× 1.0k 0.5× 506 1.0× 1.6k 4.4× 606 1.8× 211 3.4k

Countries citing papers authored by C.‐K. Hu

Since Specialization
Citations

This map shows the geographic impact of C.‐K. Hu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.‐K. Hu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.‐K. Hu more than expected).

Fields of papers citing papers by C.‐K. Hu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.‐K. Hu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.‐K. Hu. The network helps show where C.‐K. Hu may publish in the future.

Co-authorship network of co-authors of C.‐K. Hu

This figure shows the co-authorship network connecting the top 25 collaborators of C.‐K. Hu. A scholar is included among the top collaborators of C.‐K. Hu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.‐K. Hu. C.‐K. Hu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Guan, Shuwei, Tiejun Zhang, Rui Ma, et al.. (2025). Hierarchical Janus sponge evaporator functionalized with liquid-like PDMS molecular brushes for efficient and sustainable solar evaporation and electricity generation. Chemical Engineering Journal. 524. 169479–169479. 1 indexed citations
2.
Kelly, James J., Huai Huang, C.‐K. Hu, et al.. (2016). Experimental study of nanoscale Co damascene BEOL interconnect structures. 40–42. 43 indexed citations
3.
Witt, C., et al.. (2016). Electromigration: Void Dynamics. IEEE Transactions on Device and Materials Reliability. 16(4). 446–451. 10 indexed citations
4.
Hu, C.‐K., E. Liniger, L. Gignac, Griselda Bonilla, & D. Edelstein. (2013). Materials and scaling effects on on-chip interconnect reliability. MRS Proceedings. 1559. 11 indexed citations
5.
Ercius, Peter, Lynne Gignac, C.‐K. Hu, & David A. Muller. (2009). Three-Dimensional Measurement of Line Edge Roughness in Copper Wires Using Electron Tomography. Microscopy and Microanalysis. 15(3). 244–250. 16 indexed citations
6.
Lloyd, J. R., Michael Lane, E. Liniger, et al.. (2005). Electromigration and adhesion. IEEE Transactions on Device and Materials Reliability. 5(1). 113–118. 64 indexed citations
7.
Hu, C.‐K., Lynne Gignac, R. Rosenberg, et al.. (2004). Atom motion of Cu and Co in Cu damascene lines with a CoWP cap. Applied Physics Letters. 84(24). 4986–4988. 35 indexed citations
8.
Hu, C.‐K., et al.. (2003). Scaling effect on electromigration in on-chip Cu wiring. 267–269. 32 indexed citations
9.
Hu, C.‐K., L. Gignac, E. Liniger, & R. Rosenberg. (2002). Electromigration in On-Chip Single/Dual Damascene Cu Interconnections. Journal of The Electrochemical Society. 149(7). G408–G408. 19 indexed citations
10.
Filippi, R. G., M. Gribelyuk, T. Sullivan, et al.. (2001). Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching. Thin Solid Films. 388(1-2). 303–314. 5 indexed citations
11.
Cargill, G. S., et al.. (2001). Electromigration of copper in Al(0.25 at. % Cu) conductor lines. Journal of Applied Physics. 89(5). 2588–2597. 9 indexed citations
12.
Rosenberg, R., D. Edelstein, C.‐K. Hu, & K. P. Rodbell. (2000). Copper Metallization for High Performance Silicon Technology. Annual Review of Materials Science. 30(1). 229–262. 346 indexed citations
13.
Harper, J. M. E., C. Cabral, P. C. Andricacos, et al.. (1999). Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films. MRS Proceedings. 564. 5 indexed citations
14.
Cargill, G. S., et al.. (1998). Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction. Applied Physics Letters. 72(11). 1296–1298. 103 indexed citations
15.
Hu, C.‐K., et al.. (1995). In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects. Journal of Applied Physics. 78(7). 4428–4437. 117 indexed citations
16.
Hu, C.‐K., B. M. Luther, F. B. Kaufman, et al.. (1995). Copper interconnection integration and reliability. Thin Solid Films. 262(1-2). 84–92. 189 indexed citations
17.
Hu, C.‐K., et al.. (1991). Reactive ion etching of Nb/A1Ox/Nb for Josephson technology. Thin Solid Films. 206(1-2). 151–155. 4 indexed citations
18.
Wetzel, J. T., Marko Jošt, S. A. Rishton, et al.. (1989). On the preparation of cross-sectional TEM samples using lithographic processing and reactive ion-etching. Ultramicroscopy. 29(1-4). 110–114. 3 indexed citations
19.
Hu, C.‐K., et al.. (1989). A process for improved Al(Cu) reactive ion etching. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 7(3). 682–685. 11 indexed citations
20.
Davari, B., C. Y. Ting, K. Y. Ahn, et al.. (1987). Submicron Tungsten Gate MOSFET with 10 nm Gate Oxide. Symposium on VLSI Technology. 61–62. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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