D. D. Brown

525 total citations
31 papers, 436 citations indexed

About

D. D. Brown is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, D. D. Brown has authored 31 papers receiving a total of 436 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 22 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanics of Materials. Recurrent topics in D. D. Brown's work include Copper Interconnects and Reliability (22 papers), Electronic Packaging and Soldering Technologies (19 papers) and Semiconductor materials and devices (14 papers). D. D. Brown is often cited by papers focused on Copper Interconnects and Reliability (22 papers), Electronic Packaging and Soldering Technologies (19 papers) and Semiconductor materials and devices (14 papers). D. D. Brown collaborates with scholars based in United States, Canada and Australia. D. D. Brown's co-authors include Randall Olsen, M. A. Korhonen, Che‐Yu Li, P. Bo rgesen, C.-Y. Li, Peter Børgesen, N. Thaulow, Ulla Jakobsen, S. K. Sahu and Claus Pade and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Cement and Concrete Research.

In The Last Decade

D. D. Brown

29 papers receiving 403 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
D. D. Brown United States	9	251	224	117	110	81	31	436
Xiang Lu China	13	30 0.1×	255 1.1×	164 1.4×	340 3.1×	18 0.2×	35	421
Yuzhou Ran China	11	56 0.2×	250 1.1×	16 0.1×	17 0.2×	52 0.6×	22	376
Liangliang Zhou China	11	61 0.2×	15 0.1×	86 0.7×	43 0.4×	106 1.3×	21	326
Yi Yuan China	12	98 0.4×	77 0.3×	161 1.4×	148 1.3×	16 0.2×	33	321
F. Thièry France	12	97 0.4×	39 0.2×	275 2.4×	147 1.3×	17 0.2×	21	408
M. Iwasa Japan	8	32 0.1×	21 0.1×	121 1.0×	90 0.8×	32 0.4×	20	290
Adrian Lis Japan	12	189 0.8×	22 0.1×	132 1.1×	320 2.9×	51 0.6×	24	426
Yihai Yang China	9	25 0.1×	42 0.2×	125 1.1×	138 1.3×	97 1.2×	13	318
Endian Fan China	14	29 0.1×	59 0.3×	442 3.8×	343 3.1×	128 1.6×	27	626

Countries citing papers authored by D. D. Brown

Since Specialization

Citations

This map shows the geographic impact of D. D. Brown's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. D. Brown with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. D. Brown more than expected).

Fields of papers citing papers by D. D. Brown

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. D. Brown. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. D. Brown. The network helps show where D. D. Brown may publish in the future.

Co-authorship network of co-authors of D. D. Brown

This figure shows the co-authorship network connecting the top 25 collaborators of D. D. Brown. A scholar is included among the top collaborators of D. D. Brown based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. D. Brown. D. D. Brown is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Jakobsen, Ulla, Claus Pade, N. Thaulow, et al.. (2006). Automated air void analysis of hardened concrete — a Round Robin study. Cement and Concrete Research. 36(8). 1444–1452. 78 indexed citations

Jakobsen, Ulla, Claus Pade, N. Thaulow, et al.. (2005). The rapidair system for air void analysis of hardened concrete - A round robin study. Ghent University Academic Bibliography (Ghent University). 5 indexed citations

Brown, D. D., et al.. (2003). An adaptable, high performance LGA connector technology. 1770–1775. 2 indexed citations

Korhonen, M. A., et al.. (2003). Simulation of electromigration damage in chip level interconnect lines: a grain structure based statistical approach. 227–232. 1 indexed citations

Nogami, T., et al.. (2002). Characterization of the Cu/barrier metal interface for copper interconnects. 298–300. 5 indexed citations

Foley, J. C., et al.. (2000). Analysis of ring and plug shear strengths for comparison of lead-free solders. Journal of Electronic Materials. 29(10). 1258–1263. 34 indexed citations

Korhonen, Tia‐Marje, D. D. Brown, & M. A. Korhonen. (2000). A grain structure based statistical simulation of electromigration damage in chip level interconnect lines. Microelectronics Reliability. 40(12). 2053–2060. 4 indexed citations

Brown, D. D.. (1998). Modelling Electromigration and Stress Migration Damage in Advanced Interconnect Structures. MRS Proceedings. 516. 2 indexed citations

Korhonen, M. A., et al.. (1996). Stress and alloying effects in electromigration. AIP conference proceedings. 373. 117–130. 5 indexed citations

10.

Korhonen, M. A., Tao Liu, D. D. Brown, & C.-Y. Li. (1995). Stress-Voiding and Electromigration in Multilevel Interconnects. MRS Proceedings. 391. 15 indexed citations

11.

Brown, D. D., John E. Sanchez, M. A. Korhonen, & Che‐Yu Li. (1995). Cluster interactions and stress evolution during electromigration in confined metal interconnects. Applied Physics Letters. 67(3). 439–441. 18 indexed citations

12.

Korhonen, M. A., et al.. (1994). Statistics of stress migration and electromigration failures of passivated interconnect lines. AIP conference proceedings. 305. 15–32. 3 indexed citations

13.

Brown, D. D., Paul R. Besser, John E. Sanchez, M. A. Korhonen, & Che‐Yu Li. (1994). Effect of CU and SI in Aluminum on Stress Change and on TiAl₃ Formation in Al Alloy/TI Bilayer Films During Annealing. MRS Proceedings. 356. 5 indexed citations

14.

Brown, D. D., et al.. (1994). Effect of Mechanical Stress on Electromigration Failure Mode During Accelerated Electromigration Tests. MRS Proceedings. 356. 1 indexed citations

15.

Børgesen, Peter, M. A. Korhonen, D. D. Brown, & C.-Y. Li. (1993). Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions. MRS Proceedings. 308. 1 indexed citations

16.

Korhonen, M. A., Peter Børgesen, D. D. Brown, & Che‐Yu Li. (1993). The Effect of Thermally Induced Stresses on Electromigration Lifetime Of Near-Bamboo Interconnects. MRS Proceedings. 309. 4 indexed citations

17.

Brown, D. D., M. A. Korhonen, Peter Børgesen, & C.-Y. Li. (1993). Analysis of Thermal Stress Induced Void Growth During Thermal Cycling. MRS Proceedings. 308. 1 indexed citations

18.

Korhonen, M. A., P. Bo rgesen, D. D. Brown, & Che‐Yu Li. (1993). Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses. Journal of Applied Physics. 74(8). 4995–5004. 90 indexed citations

19.

Børgesen, Peter, M. A. Korhonen, D. D. Brown, & C.-Y. Li. (1992). Stress-induced voiding and electromigration. AIP conference proceedings. 263. 219–235. 12 indexed citations

20.

Børgesen, Peter, M. A. Korhonen, Timothy D. Sullivan, D. D. Brown, & C.-Y. Li. (1991). Electromigration Damage by Current Induced Coalescence of Thermal Stress Voids. MRS Proceedings. 239. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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