M. A. Korhonen

2.3k total citations · 1 hit paper
85 papers, 1.8k citations indexed

About

M. A. Korhonen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, M. A. Korhonen has authored 85 papers receiving a total of 1.8k indexed citations (citations by other indexed papers that have themselves been cited), including 55 papers in Electrical and Electronic Engineering, 38 papers in Electronic, Optical and Magnetic Materials and 31 papers in Mechanical Engineering. Recurrent topics in M. A. Korhonen's work include Electronic Packaging and Soldering Technologies (46 papers), Copper Interconnects and Reliability (37 papers) and 3D IC and TSV technologies (17 papers). M. A. Korhonen is often cited by papers focused on Electronic Packaging and Soldering Technologies (46 papers), Copper Interconnects and Reliability (37 papers) and 3D IC and TSV technologies (17 papers). M. A. Korhonen collaborates with scholars based in United States, Australia and Germany. M. A. Korhonen's co-authors include P. Bo rgesen, Che‐Yu Li, K. N. Tu, C.-Y. Li, Tia‐Marje Korhonen, D. D. Brown, W. R. LaFontaine, Sven Rzepka, Peter Børgesen and L.P. Lehman and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A.

In The Last Decade

M. A. Korhonen

83 papers receiving 1.7k citations

Hit Papers

Stress evolution due to electromigration in confined meta... 1993 2026 2004 2015 1993 100 200 300 400 500
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Stress evolution due to electromigration in confined metal lines
    1993 583 citations M. A. Korhonen et al. Journal of Applied Physics profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
M. A. Korhonen United States 19 1.5k 1.1k 511 445 256 85 1.8k
D. R. Frear United States 36 3.9k 2.6× 537 0.5× 567 1.1× 2.7k 6.1× 458 1.8× 96 4.3k
M. Mayer Canada 21 1.2k 0.8× 130 0.1× 304 0.6× 771 1.7× 196 0.8× 110 1.5k
H. Walter Germany 21 970 0.6× 171 0.2× 262 0.5× 393 0.9× 150 0.6× 109 1.5k
Da‐Yuan Shih United States 28 2.5k 1.7× 320 0.3× 192 0.4× 1.5k 3.4× 203 0.8× 73 2.7k
C. C. Goldsmith United States 15 944 0.6× 225 0.2× 174 0.3× 524 1.2× 99 0.4× 36 1.0k
S. K. Kang United States 23 1.5k 1.0× 111 0.1× 119 0.2× 821 1.8× 181 0.7× 57 1.6k
Albert T. Wu Taiwan 22 998 0.7× 282 0.3× 83 0.2× 408 0.9× 538 2.1× 88 1.3k
David T. Read United States 24 649 0.4× 294 0.3× 795 1.6× 455 1.0× 502 2.0× 98 1.7k
Jin Onuki Japan 14 647 0.4× 284 0.3× 109 0.2× 240 0.5× 104 0.4× 119 789
Cheng–En Ho Taiwan 29 2.9k 1.9× 457 0.4× 140 0.3× 1.9k 4.4× 229 0.9× 115 3.1k

Countries citing papers authored by M. A. Korhonen

Since Specialization
Citations

This map shows the geographic impact of M. A. Korhonen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. A. Korhonen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. A. Korhonen more than expected).

Fields of papers citing papers by M. A. Korhonen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. A. Korhonen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. A. Korhonen. The network helps show where M. A. Korhonen may publish in the future.

Co-authorship network of co-authors of M. A. Korhonen

This figure shows the co-authorship network connecting the top 25 collaborators of M. A. Korhonen. A scholar is included among the top collaborators of M. A. Korhonen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. A. Korhonen. M. A. Korhonen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Korhonen, Tia‐Marje, L.P. Lehman, M. A. Korhonen, & Donald W. Henderson. (2007). Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C. Journal of Electronic Materials. 36(2). 173–178. 51 indexed citations
2.
Henderson, Donald W., Timothy Gosselin, David E. King, et al.. (2004). The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. Journal of materials research/Pratt's guide to venture capital sources. 19(6). 1608–1612. 169 indexed citations
3.
4.
Rzepka, Sven, et al.. (1999). 3-D finite element simulator for migration effects due to various driving forces in interconnect lines. AIP conference proceedings. 150–161. 17 indexed citations
5.
Su, Peng, et al.. (1999). The effects of underfill on the reliability of flip chip solder joints. Journal of Electronic Materials. 28(9). 1017–1022. 31 indexed citations
6.
Korhonen, M. A., et al.. (1998). Stress and electromigration modelling for confined chip level interconnect lines. 303–314. 1 indexed citations
7.
Rzepka, Sven, M. A. Korhonen, Eicke R. Weber, & Che‐Yu Li. (1997). Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines. MRS Proceedings. 473. 15 indexed citations
8.
Korhonen, M. A., et al.. (1996). Stress and alloying effects in electromigration. AIP conference proceedings. 373. 117–130. 5 indexed citations
9.
Korhonen, M. A., Tao Liu, D. D. Brown, & C.-Y. Li. (1995). Stress-Voiding and Electromigration in Multilevel Interconnects. MRS Proceedings. 391. 15 indexed citations
10.
Korhonen, M. A., et al.. (1994). Statistics of stress migration and electromigration failures of passivated interconnect lines. AIP conference proceedings. 305. 15–32. 3 indexed citations
11.
Brown, D. D., Paul R. Besser, John E. Sanchez, M. A. Korhonen, & Che‐Yu Li. (1994). Effect of CU and SI in Aluminum on Stress Change and on TiAl3 Formation in Al Alloy/TI Bilayer Films During Annealing. MRS Proceedings. 356. 5 indexed citations
12.
Børgesen, Peter, M. A. Korhonen, & Che‐Yu Li. (1993). <title>Statistical distributions of stress and electromigration-induced failure</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1805. 130–153. 1 indexed citations
13.
Børgesen, Peter, M. A. Korhonen, D. D. Brown, & C.-Y. Li. (1993). Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions. MRS Proceedings. 308. 1 indexed citations
14.
Korhonen, M. A., Peter Børgesen, D. D. Brown, & Che‐Yu Li. (1993). The Effect of Thermally Induced Stresses on Electromigration Lifetime Of Near-Bamboo Interconnects. MRS Proceedings. 309. 4 indexed citations
15.
Korhonen, M. A., et al.. (1991). Superplastic-like deformation in some solid solution alloys. Materials Science and Engineering A. 137. 27–33. 2 indexed citations
16.
Korhonen, M. A., et al.. (1991). Stress relaxation of passivated aluminum line metallizations on silicon substrates. Journal of Applied Physics. 69(3). 1748–1755. 74 indexed citations
17.
Børgesen, Peter, et al.. (1991). The Effect of Line Geometry on Void Growth in Thin, Narrow Aluminum Lines. MRS Proceedings. 226. 4 indexed citations
18.
Korhonen, M. A., et al.. (1990). The Formation and Morphology of Stress Induced Voids in Thin Narrow Aluminum Lines. MRS Proceedings. 203. 4 indexed citations
19.
Korhonen, M. A., et al.. (1989). X-ray determination of the residual stresses in thin aluminum films deposited on silicon substrates. Scripta Metallurgica. 23(8). 1449–1453. 28 indexed citations
20.
Korhonen, M. A., et al.. (1985). Workhardening correlations based on state variables in some FCC metals in monotonic loading. Metallurgical Transactions A. 16(3). 411–420. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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