Alain Phommahaxay

1.9k total citations
93 papers, 1.1k citations indexed

About

Alain Phommahaxay is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Alain Phommahaxay has authored 93 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 89 papers in Electrical and Electronic Engineering, 33 papers in Biomedical Engineering and 15 papers in Automotive Engineering. Recurrent topics in Alain Phommahaxay's work include 3D IC and TSV technologies (77 papers), Electronic Packaging and Soldering Technologies (56 papers) and Advanced Surface Polishing Techniques (19 papers). Alain Phommahaxay is often cited by papers focused on 3D IC and TSV technologies (77 papers), Electronic Packaging and Soldering Technologies (56 papers) and Advanced Surface Polishing Techniques (19 papers). Alain Phommahaxay collaborates with scholars based in Belgium, United States and Austria. Alain Phommahaxay's co-authors include Eric Beyne, Gerald Beyer, Andy Miller, Lan Peng, Fumihiro Inoue, Serena Iacovo, Erik Sleeckx, Anne Jourdain, Pieter Bex and Kenneth June Rebibis and has published in prestigious journals such as Applied Surface Science, The International Journal of Advanced Manufacturing Technology and Journal of Manufacturing Processes.

In The Last Decade

Alain Phommahaxay

86 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Alain Phommahaxay Belgium 18 988 309 199 146 97 93 1.1k
Joeri De Vos Belgium 17 797 0.8× 176 0.6× 107 0.5× 109 0.7× 75 0.8× 98 861
Serena Iacovo Belgium 15 517 0.5× 116 0.4× 88 0.4× 99 0.7× 54 0.6× 43 590
Markus Wimplinger Austria 11 806 0.8× 270 0.9× 106 0.5× 57 0.4× 52 0.5× 75 895
Sarah Eunkyung Kim South Korea 16 645 0.7× 110 0.4× 116 0.6× 186 1.3× 93 1.0× 84 769
M. Murugesan Japan 17 914 0.9× 252 0.8× 164 0.8× 114 0.8× 203 2.1× 121 1.0k
Seung Wook Yoon Singapore 23 1.4k 1.4× 176 0.6× 137 0.7× 172 1.2× 405 4.2× 100 1.5k
V. Kripesh Singapore 23 1.6k 1.6× 272 0.9× 234 1.2× 178 1.2× 388 4.0× 104 1.7k
Tengfei Jiang United States 14 583 0.6× 132 0.4× 76 0.4× 98 0.7× 137 1.4× 45 723
Joke De Messemaeker Belgium 16 587 0.6× 171 0.6× 66 0.3× 140 1.0× 203 2.1× 46 775
Christophe Morales France 13 529 0.5× 152 0.5× 88 0.4× 46 0.3× 39 0.4× 66 647

Countries citing papers authored by Alain Phommahaxay

Since Specialization
Citations

This map shows the geographic impact of Alain Phommahaxay's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Alain Phommahaxay with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Alain Phommahaxay more than expected).

Fields of papers citing papers by Alain Phommahaxay

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Alain Phommahaxay. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Alain Phommahaxay. The network helps show where Alain Phommahaxay may publish in the future.

Co-authorship network of co-authors of Alain Phommahaxay

This figure shows the co-authorship network connecting the top 25 collaborators of Alain Phommahaxay. A scholar is included among the top collaborators of Alain Phommahaxay based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Alain Phommahaxay. Alain Phommahaxay is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kennes, Koen, Dieter Cuypers, B. Ralph Chou, et al.. (2025). Evaluation of warpage tolerance of 100 μm dies to achieve void-free bond and 100% assembly yield. 1–3.
2.
Kennes, Koen, Samuel Suhard, Jaber Derakhshandeh, et al.. (2023). Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers. 1584–1589. 2 indexed citations
3.
Derakhshandeh, Jaber, Eric Beyne, Gerald Beyer, et al.. (2022). Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1108–1113. 7 indexed citations
4.
Inoue, Fumihiro, et al.. (2022). Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging. The International Journal of Advanced Manufacturing Technology. 119(5-6). 3427–3435. 1 indexed citations
5.
Iacovo, Serena, Alain Phommahaxay, Fumihiro Inoue, et al.. (2022). Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding. ECS Journal of Solid State Science and Technology. 11(6). 63012–63012. 18 indexed citations
6.
Iacovo, Serena, Soon-Wook Kim, Lan Peng, et al.. (2021). The unique properties of SiCN as bonding material for hybrid bonding. 38–38. 13 indexed citations
7.
Inoue, Fumihiro, Lan Peng, Alain Phommahaxay, et al.. (2020). Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer. Journal of Manufacturing Processes. 58. 811–818. 11 indexed citations
8.
Iacovo, Serena, Alain Phommahaxay, Fumihiro Inoue, et al.. (2020). Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding. ECS Transactions. 98(4). 21–31. 3 indexed citations
9.
Suhard, Samuel, Alain Phommahaxay, Koen Kennes, et al.. (2020). Demonstration of a collective hybrid die-to-wafer integration. 1315–1321. 12 indexed citations
10.
Inoue, Fumihiro, Lan Peng, Serena Iacovo, et al.. (2019). Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding. ECS Journal of Solid State Science and Technology. 8(6). P346–P350. 54 indexed citations
11.
Iacovo, Serena, Lan Peng, Alain Phommahaxay, et al.. (2019). Direct Bonding of low Temperature Heterogeneous Dielectrics. 2206–2212. 11 indexed citations
12.
Inoue, Fumihiro, Lan Peng, Serena Iacovo, et al.. (2018). Influence of Composition of SiCN Film for Surface Activated Bonding. ECS Transactions. 86(5). 159–168. 3 indexed citations
13.
Phommahaxay, Alain, Anne Jourdain, Goedele Potoms, et al.. (2017). Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer. 740–745. 6 indexed citations
14.
Inoue, Fumihiro, Anne Jourdain, Lan Peng, et al.. (2016). Edge trimming for surface activated dielectric bonded wafers. Microelectronic Engineering. 167. 10–16. 12 indexed citations
15.
16.
Velenis, Dimitrios, Stefaan Van Huylenbroeck, Anne Jourdain, et al.. (2014). Cost components for 3D system integration. 1–5. 6 indexed citations
17.
Manna, Antonio, Wei Guo, Stefaan Van Huylenbroeck, et al.. (2013). Study of 3D process impact on advanced CMOS devices. European Microelectronics and Packaging Conference. 1–7. 4 indexed citations
18.
Phommahaxay, Alain, Anne Jourdain, W. Spieß, et al.. (2012). Process characterization of thin wafer debonding with thermoplastic materials. 1–4. 9 indexed citations
19.
Phommahaxay, Alain, Anne Jourdain, Pieter Bex, et al.. (2012). Evolution of temporary wafer (de)bonding technology towards low temperature processes for enhanced 3D integration. 229–233. 5 indexed citations
20.
Agarwal, Rahul, Wenqi Zhang, Paresh Limaye, et al.. (2010). Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1254–1281. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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