Lieve Bogaerts
- Electrical and Electronic Engineering
- Automotive Engineering
- Biomedical Engineering
- Atomic and Molecular Physics, and Optics
- Electronic, Optical and Magnetic Materials
- Co-authors
- Eric BeynePiet De MoorKoen De MunckBart SwinnenDeniz Sabuncuoglu TezcanJan VaesZs. TôkeiSerguei Stoukatch
- Topics
- 3D IC and TSV technologies (15 papers)Electronic Packaging and Soldering Technologies (10 papers)Advanced Surface Polishing Techniques (6 papers)
- Journals
- Optics ExpressLirias (KU Leuven)Procedia Engineering
- Partner nations
- BelgiumNetherlandsUnited States
In The Last Decade
Lieve Bogaerts
20 papers receiving 298 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 291
- Automotive Engineering 50
- Biomedical Engineering 46
- Atomic and Molecular Physics, and Optics 33
- Electronic, Optical and Magnetic Materials 28
Countries citing papers authored by Lieve Bogaerts
This map shows the geographic impact of Lieve Bogaerts's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lieve Bogaerts with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lieve Bogaerts more than expected).
Fields of papers citing papers by Lieve Bogaerts
This network shows the impact of papers produced by Lieve Bogaerts. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lieve Bogaerts. The network helps show where Lieve Bogaerts may publish in the future.
Co-authorship network of co-authors of Lieve Bogaerts
This figure shows the co-authorship network connecting the top 25 collaborators of Lieve Bogaerts. A scholar is included among the top collaborators of Lieve Bogaerts based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Lieve Bogaerts. Lieve Bogaerts is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 24 | |
| 4 | 23 | |
| 5 | 29 | |
| 6 | 2 | |
| 7 | 16 | |
| 8 | 1 | |
| 9 | 1 | |
| 10 | 5 | |
| 11 | 1 | |
| 12 | 1 | |
| 13 | 11 | |
| 14 | 161 | |
| 15 | Temporary bonding and debonding for 3D applications | 2 |
| 16 | 7 | |
| 17 | Wafer level temporary bonding/debonding for thin wafer handling applications | 11 |
| 18 | The Minipackage: a flexible wafer-level packaging solution for MEMS | 2 |
| 19 | Deepdrawing of composite sheet materials | 4 |
| 20 | Scaling of sol-gel PZT ferroelectric capacitors for low-voltage operation | 1 |
About Lieve Bogaerts
Lieve Bogaerts is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 21 papers that have together received 306 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Surface Polishing Techniques (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (291 citations), Automotive Engineering (50 citations) and Hardware and Architecture (27 citations). Lieve Bogaerts has collaborated with scholars based in Belgium, Netherlands and United States. Frequent co-authors include Eric Beyne, Piet De Moor, Koen De Munck, Bart Swinnen, Deniz Sabuncuoglu Tezcan, Jan Vaes, Zs. Tôkei, Serguei Stoukatch, J. Van Aelst and L. Carbonell. Their work appears in journals such as Optics Express, Lirias (KU Leuven) and Procedia Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.