Patrick Justison

673 total citations
45 papers, 454 citations indexed

About

Patrick Justison is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Patrick Justison has authored 45 papers receiving a total of 454 indexed citations (citations by other indexed papers that have themselves been cited), including 44 papers in Electrical and Electronic Engineering, 29 papers in Electronic, Optical and Magnetic Materials and 4 papers in Materials Chemistry. Recurrent topics in Patrick Justison's work include Copper Interconnects and Reliability (29 papers), Semiconductor materials and devices (28 papers) and Electronic Packaging and Soldering Technologies (27 papers). Patrick Justison is often cited by papers focused on Copper Interconnects and Reliability (29 papers), Semiconductor materials and devices (28 papers) and Electronic Packaging and Soldering Technologies (27 papers). Patrick Justison collaborates with scholars based in United States, Germany and Canada. Patrick Justison's co-authors include Paul S. Ho, V. Blaschke, Ennis T. Ogawa, Meike Hauschildt, Tian Shen, M. Gall, H. Kawasaki, Robert Havemann, Haojun Zhang and Kong Boon Yeap and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.

In The Last Decade

Patrick Justison

40 papers receiving 429 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Patrick Justison United States 13 439 305 43 27 24 45 454
F. Chen United States 12 429 1.0× 264 0.9× 23 0.5× 32 1.2× 35 1.5× 21 446
Oliver Aubel Germany 11 315 0.7× 270 0.9× 47 1.1× 29 1.1× 32 1.3× 45 357
M. Gall United States 11 311 0.7× 228 0.7× 32 0.7× 11 0.4× 30 1.3× 43 331
M. Assous France 14 401 0.9× 146 0.5× 60 1.4× 31 1.1× 21 0.9× 45 433
R. Schulz United States 7 296 0.7× 124 0.4× 30 0.7× 29 1.1× 29 1.2× 14 326
R. G. Filippi United States 11 413 0.9× 345 1.1× 52 1.2× 45 1.7× 46 1.9× 42 447
L.L. Chapelon France 11 257 0.6× 128 0.4× 64 1.5× 43 1.6× 19 0.8× 25 291
D. Bouchu France 11 267 0.6× 105 0.3× 18 0.4× 33 1.2× 18 0.8× 33 294
B. Eyckens Belgium 6 346 0.8× 112 0.4× 47 1.1× 39 1.4× 22 0.9× 9 384
Melina Lofrano Belgium 11 332 0.8× 107 0.4× 33 0.8× 24 0.9× 32 1.3× 55 359

Countries citing papers authored by Patrick Justison

Since Specialization
Citations

This map shows the geographic impact of Patrick Justison's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Justison with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Justison more than expected).

Fields of papers citing papers by Patrick Justison

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Patrick Justison. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Justison. The network helps show where Patrick Justison may publish in the future.

Co-authorship network of co-authors of Patrick Justison

This figure shows the co-authorship network connecting the top 25 collaborators of Patrick Justison. A scholar is included among the top collaborators of Patrick Justison based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Patrick Justison. Patrick Justison is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Justison, Patrick, Martin Gall, Yusheng Bian, et al.. (2023). Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. Th1A.5–Th1A.5.
2.
Ahn, Woojin, Haojun Zhang, Tian Shen, Patrick Justison, & Muhammad A. Alam. (2019). A Closed-Form Transient Joule Heating Model for an Interconnect in an Integrated Circuit. IEEE Electron Device Letters. 41(2). 288–291. 1 indexed citations
3.
Zhang, Haojun, et al.. (2019). Thermal-Electric Transient analysis for Metal Line under High Frequency Pulse Direct Current. 761–765. 1 indexed citations
4.
5.
Premachandran, C.S., et al.. (2018). Reliability challenges for 2.5D/3D integration: An overview. 5B.4–1. 7 indexed citations
6.
Hunt, Doug, et al.. (2018). Chip-Package Interaction Challenges for Large Die Applications. 656–662. 8 indexed citations
7.
Xu, Tingge, et al.. (2018). Die Edge Crack Propagation Modeling for Risk Assessment of Advanced Technology Nodes. 2260–2266. 7 indexed citations
8.
Shen, Tian, Kong Boon Yeap, C. Christiansen, & Patrick Justison. (2017). Field acceleration factor extraction in MOL and BEOL TDDB. DG–2.1. 5 indexed citations
9.
Kannan, Sukeshwar, C.S. Premachandran, Daniel M. Smith, et al.. (2017). Impact of TSV process on 14nm FEOL and BEOL reliability. 4A–2.1. 6 indexed citations
10.
Yeap, Kong Boon, et al.. (2016). Method to Determine the Root Cause of Low- $\kappa$ SiCOH Dielectric Failure Distributions. IEEE Electron Device Letters. 38(1). 119–122. 1 indexed citations
11.
Premachandran, C.S., Sukeshwar Kannan, Rakesh Ranjan, et al.. (2016). Impact of 3D Via Middle TSV Process on 20nm Wafer Level FEOL and BEOL Reliability. 1593–1598. 6 indexed citations
12.
Yeap, Kong Boon, et al.. (2016). A Realistic Method for Time-Dependent Dielectric Breakdown Reliability Analysis for Advanced Technology Node. IEEE Transactions on Electron Devices. 63(2). 755–759. 12 indexed citations
13.
Shen, Tian, et al.. (2015). An investigation of dielectric thickness scaling on BEOL TDDB. 3A.2.1–3A.2.6.
14.
Selvam, Ammaiyappan, et al.. (2015). An investigation of process dependence of porous IMD TDDB. PI.1.1–PI.1.4.
15.
Yeap, Kong Boon, et al.. (2015). Impact of electrode surface modulation on time-dependent dielectric breakdown. 2A.1.1–2A.1.5. 1 indexed citations
16.
Ho, Paul S., et al.. (2013). Electromigration reliability of Mn-doped Cu interconnects for the 28 nm technology. 44. EM.5.1–EM.5.4. 5 indexed citations
17.
Yao, Heng, et al.. (2013). Stress-induced-voiding risk factor and stress migration model for Cu interconnect reliability. 110. 2C.5.1–2C.5.8. 6 indexed citations
18.
Pozder, Scott, Ankur Jain, Robert Jones, et al.. (2009). Reliability Considerations in 3D Stacked Strata Systems. AIP conference proceedings. 213–223. 1 indexed citations
19.
Hauschildt, Meike, et al.. (2008). The influence of process parameters on electromigration lifetime statistics. Journal of Applied Physics. 104(4). 5 indexed citations
20.
Justison, Patrick, E.T. Ogawa, Paul S. Ho, et al.. (2001). Electromigration in multilevel interconnects with polymeric low-k interlevel dielectrics. Applied Physics Letters. 79(26). 4414–4416. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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