J. Heck
About
In The Last Decade
J. Heck
16 papers receiving 374 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 353
- Atomic and Molecular Physics, and Optics 131
- Biomedical Engineering 122
- Radiation 34
- Materials Chemistry 25
Countries citing papers authored by J. Heck
This map shows the geographic impact of J. Heck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Heck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Heck more than expected).
Fields of papers citing papers by J. Heck
This network shows the impact of papers produced by J. Heck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Heck. The network helps show where J. Heck may publish in the future.
Co-authorship network of co-authors of J. Heck
This figure shows the co-authorship network connecting the top 25 collaborators of J. Heck. A scholar is included among the top collaborators of J. Heck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Heck. J. Heck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Title | Journal | Authors | Indexed citations |
|---|---|---|---|---|
| 1 | Hybrid III–V/Si Distributed-Feedback Laser Based on Adhesive Bonding | IEEE Photonics Technology Letters | S. Stanković, Richard Jones et al. | 74 |
| 2 | 1310 nm Evanescent Hybrid III-V/Si Laser Based on DVS-BCB Bonding | S. Stanković, Günther Roelkens et al. | 5 | |
| 3 | Die-to-Die Adhesive Bonding Procedure for Evanescently-Coupled Photonic Devices | Electrochemical and Solid-State Letters | S. Stanković, Richard Jones et al. | 20 |
| 4 | Pressure indicating film characterization of pressure distribution in eutectic Au/Sn wafer‐to‐wafer bonding | Microelectronics International | K. Kornelsen, J. Heck et al. | 0 |
| 5 | Nanochip - Ultra-High Data Density MEMS Memory Device | TechConnect Briefs | J. Heck, G. Knight et al. | 2 |
| 6 | Thin-layer Au-Sn solder bonding process for wafer-level packaging, electrical interconnections and MEMS applications | J. Heck, K. Kornelsen et al. | 29 | |
| 7 | CMOS Compatible Poly-SiGe Cantilevers With Read/Write System For Probe Storage Device | S. Severi, J. Heck et al. | 1 | |
| 8 | CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device | TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference | S. Severi, J. Heck et al. | 14 |
| 9 | A 100 MHz 2.5 GHz Direct Conversion CMOS Transceiver for SDR Applications | J. Heck et al. | 25 | |
| 10 | BILLION-CYCLE ULV ELECTROSTATIC RF MEMS SWITCH | J. Heck, Qing Ma et al. | 5 | |
| 11 | An analog turbo decoder for an (8,4) product code | N.S. Correal, J. Heck et al. | 1 | |
| 12 | Polycrystalline silicon-germanium films for integrated microsystems | Journal of Microelectromechanical Systems | Alexander Franke, J. Heck et al. | 114 |
| 13 | A quadrature down converter for direct conversion receivers with high 2nd and 3rd order intercept points | J. Heck et al. | 3 | |
| 14 | Improved mixer IIP2 through dynamic matching | J. Heck et al. | 7 | |
| 15 | Electrical isolation process for molded, high-aspect-ratio polysilicon microstructures | Luciano Müller, J. Heck et al. | 7 | |
| 16 | A high IIP2 downconversion mixer using dynamic matching | IEEE Journal of Solid-State Circuits | J. Heck et al. | 54 |
| 17 | Resolution determination in X-ray microscopy: an analysis of the effects of partial coherence and illumination spectrum. | PubMed | J. Heck, David Attwood et al. | 39 |
| 18 | An automatic laser small-obstacle detection system for high-speed train roadbeds | IEEE Journal of Quantum Electronics | J. Heck et al. | 1 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.