Jang‐Hi Im
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
-
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- Copper Interconnects and Reliability 4
-
- Synthesis and properties of polymers 3
- Co-authors
- Paul S. HoRui HuangSuk-Kyu RyuKuan-Hsun LuXuefeng ZhangTengfei JiangEdward O. ShafferNobumichi Tamura
- Journals
- IEEE Transactions on Device and Materials Reliability (5 papers)IEEE Transactions on Advanced Packaging (2 papers)Macromolecular Symposia (1 paper)Journal of Applied Physics (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- United StatesBelgiumIndia
In The Last Decade
Jang‐Hi Im
15 papers receiving 439 citations
Peers
Comparison fields: 5 of 22
- Electrical and Electronic Engineering 419
- Automotive Engineering 49
- Electronic, Optical and Magnetic Materials 74
- Biomedical Engineering 106
- Polymers and Plastics 24
Countries citing papers authored by Jang‐Hi Im
This map shows the geographic impact of Jang‐Hi Im's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jang‐Hi Im with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jang‐Hi Im more than expected).
Fields of papers citing papers by Jang‐Hi Im
This network shows the impact of papers produced by Jang‐Hi Im. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jang‐Hi Im. The network helps show where Jang‐Hi Im may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Jang‐Hi Im, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 11 | |
| 2 | 2017 | 2 | |
| 3 | 2016 | 10 | |
| 4 | 2016 | 3 | |
| 5 | 2016 | 8 | |
| 6 | 2012 | 38 | |
| 7 | 2012 | 95 | |
| 8 | 2010 | 206 | |
| 9 | 2009 | 1 | |
| 10 | 2006 | 20 | |
| 11 | 2005 | 3 | |
| 12 | 2002 | 0 | |
| 13 | 2001 | 7 | |
| 14 | 2001 | 5 | |
| 15 | 2000 | 9 | |
| 16 | 1999 | 30 |
About Jang‐Hi Im
Jang‐Hi Im is a scholar working on Electronic, Optical and Magnetic Materials, Polymers and Plastics, Mechanics of Materials, Electrical and Electronic Engineering and Biomedical Engineering, having authored 16 papers that have together received 448 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (9 papers), Advanced Surface Polishing Techniques (5 papers), Copper Interconnects and Reliability (4 papers), Adhesion, Friction, and Surface Interactions (4 papers), Metal and Thin Film Mechanics (3 papers), Synthesis and properties of polymers (3 papers) and Force Microscopy Techniques and Applications (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (419 citations), Automotive Engineering (49 citations), Electronic, Optical and Magnetic Materials (74 citations), Biomedical Engineering (106 citations) and Polymers and Plastics (24 citations). Jang‐Hi Im has collaborated with scholars based in United States, Belgium and India. Frequent co-authors include Paul S. Ho, Rui Huang, Suk-Kyu Ryu, Kuan-Hsun Lu, Xuefeng Zhang, Tengfei Jiang, Edward O. Shaffer, Nobumichi Tamura, David D. Hawn and Philip E. Garrou. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Advanced Packaging, Macromolecular Symposia, Journal of Applied Physics and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.