Bernhard Rebhan
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Automotive Engineering
- Mechanical Engineering
- Biomedical Engineering
- Co-authors
- Kurt HingerlViorel DrăgoiGünter HesserMarkus WimplingerSajjad TollabimazraehnoJiri DuchoslavS. LhostisAndreas Hinterreiter
- Topics
- 3D IC and TSV technologies (25 papers)Electronic Packaging and Soldering Technologies (20 papers)Additive Manufacturing and 3D Printing Technologies (7 papers)
- Cited by
- Automotive EngineeringElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
In The Last Decade
Bernhard Rebhan
25 papers receiving 224 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 209
- Electronic, Optical and Magnetic Materials 64
- Automotive Engineering 51
- Mechanical Engineering 35
- Biomedical Engineering 34
Countries citing papers authored by Bernhard Rebhan
This map shows the geographic impact of Bernhard Rebhan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bernhard Rebhan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bernhard Rebhan more than expected).
Fields of papers citing papers by Bernhard Rebhan
This network shows the impact of papers produced by Bernhard Rebhan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bernhard Rebhan. The network helps show where Bernhard Rebhan may publish in the future.
Co-authorship network of co-authors of Bernhard Rebhan
This figure shows the co-authorship network connecting the top 25 collaborators of Bernhard Rebhan. A scholar is included among the top collaborators of Bernhard Rebhan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bernhard Rebhan. Bernhard Rebhan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 2 | |
| 3 | 2 | |
| 4 | 2 | |
| 5 | 8 | |
| 6 | 1 | |
| 7 | 6 | |
| 8 | 1 | |
| 9 | 18 | |
| 10 | 4 | |
| 11 | 12 | |
| 12 | 16 | |
| 13 | 3 | |
| 14 | 62 | |
| 15 | 17 | |
| 16 | 6 | |
| 17 | 12 | |
| 18 | 29 | |
| 19 | 1 | |
| 20 | 2 |
About Bernhard Rebhan
Bernhard Rebhan is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 26 papers that have together received 237 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (25 papers), Electronic Packaging and Soldering Technologies (20 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers). The work is most often cited by research in Automotive Engineering (51 citations), Electrical and Electronic Engineering (209 citations) and Electronic, Optical and Magnetic Materials (64 citations). Bernhard Rebhan has collaborated with scholars based in Austria, Germany and France. Frequent co-authors include Kurt Hingerl, Viorel Drăgoi, Günter Hesser, Markus Wimplinger, Sajjad Tollabimazraehno, Jiri Duchoslav, S. Lhostis, Andreas Hinterreiter, Jiří Svoboda and Kari Schjølberg‐Henriksen. Their work appears in journals such as Journal of Applied Physics, Microelectronics Reliability and ECS Journal of Solid State Science and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.