C. Bermond

534 total citations
44 papers, 222 citations indexed

About

C. Bermond is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, C. Bermond has authored 44 papers receiving a total of 222 indexed citations (citations by other indexed papers that have themselves been cited), including 40 papers in Electrical and Electronic Engineering, 21 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. Recurrent topics in C. Bermond's work include Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (20 papers) and 3D IC and TSV technologies (18 papers). C. Bermond is often cited by papers focused on Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (20 papers) and 3D IC and TSV technologies (18 papers). C. Bermond collaborates with scholars based in France, Switzerland and United States. C. Bermond's co-authors include B. Fléchet, T. Lacrevaz, A. Farcy, M. Gros‐Jean, T. Bertaud, C. Vallée, S. Blonkowski, J. Torrès, P. Gonon and Emmanuel Defaÿ and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Construction and Building Materials.

In The Last Decade

C. Bermond

40 papers receiving 213 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C. Bermond France 8 191 62 53 36 15 44 222
B. Fléchet France 10 251 1.3× 56 0.9× 60 1.1× 32 0.9× 14 0.9× 43 270
T. Lacrevaz France 7 145 0.8× 36 0.6× 37 0.7× 33 0.9× 7 0.5× 37 172
C. Perrot France 8 159 0.8× 45 0.7× 18 0.3× 38 1.1× 9 0.6× 15 188
Zitao Shi China 10 282 1.5× 126 2.0× 29 0.5× 27 0.8× 9 0.6× 47 332
I. Kim South Korea 6 291 1.5× 112 1.8× 18 0.3× 35 1.0× 15 1.0× 10 329
Jong‐Min Yook South Korea 13 387 2.0× 27 0.4× 20 0.4× 43 1.2× 33 2.2× 53 410
Xiangjin Wu United States 8 134 0.7× 127 2.0× 36 0.7× 25 0.7× 19 1.3× 17 195
J. Li United States 10 218 1.1× 42 0.7× 30 0.6× 42 1.2× 14 0.9× 29 245
Jianghua Xu China 9 142 0.7× 113 1.8× 50 0.9× 38 1.1× 21 1.4× 17 209
Véronique Sousa France 8 181 0.9× 196 3.2× 22 0.4× 37 1.0× 16 1.1× 12 224

Countries citing papers authored by C. Bermond

Since Specialization
Citations

This map shows the geographic impact of C. Bermond's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Bermond with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Bermond more than expected).

Fields of papers citing papers by C. Bermond

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Bermond. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Bermond. The network helps show where C. Bermond may publish in the future.

Co-authorship network of co-authors of C. Bermond

This figure shows the co-authorship network connecting the top 25 collaborators of C. Bermond. A scholar is included among the top collaborators of C. Bermond based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Bermond. C. Bermond is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Bermond, C., et al.. (2017). Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(4). 477–484. 5 indexed citations
2.
Quéffélec, Patrick, Alexis Chevalier, Jean-Michel Le Floch, et al.. (2014). Intercomparison of permittivity measurement techniques for ferroelectric thin layers. Journal of Applied Physics. 115(2). 17 indexed citations
3.
Lacrevaz, T., et al.. (2014). Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(9). 1515–1522. 3 indexed citations
4.
Reinhardt, Alexandre, C. Billard, Emmanuel Defaÿ, et al.. (2011). Lateral Field Excitation of membrane-based Aluminum Nitride resonators. 6. 1–5. 5 indexed citations
5.
Lacrevaz, T., Jean Charbonnier, C. Fuchs, et al.. (2011). Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology. 19. 61–64. 6 indexed citations
6.
Defaÿ, Emmanuel, T. Lacrevaz, Trinh Vo, et al.. (2009). Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz. Applied Physics Letters. 94(5). 19 indexed citations
7.
Blampey, B., A. Farcy, T. Lacrevaz, et al.. (2009). Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32nm node. Microelectronic Engineering. 87(3). 329–332. 1 indexed citations
8.
Rivaz, S. de, T. Lacrevaz, A. Farcy, et al.. (2008). Dielectric Loss Effects on the Modeling of Interconnect Responses for the 45 nm Node. 1–4. 1 indexed citations
9.
Farcy, A., V. Arnal, B. Blampey, et al.. (2007). Impact of process parameters on circuit performance for the 32nm technology node. Microelectronic Engineering. 84(11). 2738–2743. 4 indexed citations
10.
Lacrevaz, T., B. Fléchet, A. Farcy, et al.. (2006). Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives. Microelectronic Engineering. 83(11-12). 2184–2188. 11 indexed citations
11.
Lacrevaz, T., B. Fléchet, A. Farcy, et al.. (2006). Wide Band Frequency Characterization of High Permittivity Dielectrics (High-K) for RF MIM Capacitors Integrated in BEOL. 78–80. 1 indexed citations
12.
Bermond, C., B. Fléchet, A. Farcy, et al.. (2006). High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits. Microelectronic Engineering. 83(11-12). 2341–2345. 1 indexed citations
13.
14.
Farcy, A., C. Bermond, J. Torrès, et al.. (2005). Characterization and optimization of a new Cu/SiN/TaN/Cu damascene architecture for metal–insulator–metal capacitors. Microelectronic Engineering. 82(3-4). 521–528. 9 indexed citations
15.
Bermond, C., A. Farcy, T. Lacrevaz, et al.. (2005). Impact of Design on High Frequency Performances of Advanced MIM Capacitors Using SiN Dielectric Layers. IEEE MTT-S International Microwave Symposium Digest, 2005.. 24. 291–294. 2 indexed citations
16.
Blampey, B., et al.. (2004). Impact of copper dummies on interconnect propagation performance in advanced integrated circuits. Microelectronic Engineering. 76(1-4). 119–125. 1 indexed citations
17.
18.
Bermond, C.. (2001). Banche e sviluppo economico nel Piemonte meridionale in epoca contemporanea. Dallo Statuto albertino alla caduta del fascismo, 1848 - 1943. 1–509.
19.
Bermond, C., et al.. (2000). Performance Characterization of Advanced Interconnects on High Speed VLSI Circuits. 216–219. 1 indexed citations
20.
Bermond, C.. (1987). Recensione del volume: Fiat, Progetto Archivio storico, I primi quindici anni della Fiat. Verbali dei Consigli di amministrazione 1899-1915, F. Angeli, Milano 1987, voll. 2. 493–495. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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