Andrew J. McKerrow

841 total citations
39 papers, 657 citations indexed

About

Andrew J. McKerrow is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Andrew J. McKerrow has authored 39 papers receiving a total of 657 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 24 papers in Electronic, Optical and Magnetic Materials and 11 papers in Mechanics of Materials. Recurrent topics in Andrew J. McKerrow's work include Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (9 papers). Andrew J. McKerrow is often cited by papers focused on Copper Interconnects and Reliability (23 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (9 papers). Andrew J. McKerrow collaborates with scholars based in United States, Canada and Spain. Andrew J. McKerrow's co-authors include Paul S. Ho, Erwin Buncel, Peter M. Kazmaier, Ting Y. Tsui, Joost J. Vlassak, Jie-Hua Zhao, Marye Anne Fox, James K. Whitesell, Jihperng Leu and Jie-Hua Zhao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Langmuir.

In The Last Decade

Andrew J. McKerrow

39 papers receiving 609 citations

Peers

Countries citing papers authored by Andrew J. McKerrow

Since Specialization

Citations

This map shows the geographic impact of Andrew J. McKerrow's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andrew J. McKerrow with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andrew J. McKerrow more than expected).

Fields of papers citing papers by Andrew J. McKerrow

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Andrew J. McKerrow. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andrew J. McKerrow. The network helps show where Andrew J. McKerrow may publish in the future.

Co-authorship network of co-authors of Andrew J. McKerrow

This figure shows the co-authorship network connecting the top 25 collaborators of Andrew J. McKerrow. A scholar is included among the top collaborators of Andrew J. McKerrow based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Andrew J. McKerrow. Andrew J. McKerrow is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Direct seed electroplating of copper on ruthenium liners 2011 ·Rohan Akolkar, Tejaswi Indukuri, (unknown), (unknown), Jonathan Reid, Andrew J. McKerrow, (unknown)	5
2	Low resistance wiring and 2Xnm void free fill with CVD Ruthenium liner and DirectSeed<sup>TM</sup> copper 2010 ·(unknown), (unknown), (unknown), (unknown), (unknown), (unknown), (unknown), Andrew J. McKerrow, C.-C. Yang	3
3	Moisture Adsorption in Plasma-Damaged Porous Low-k Dielectrics 2008 ·MRS Proceedings ·Ekaterina Vinogradova, Casey Smith, (unknown), Andrew J. McKerrow, R.F. Reidy	2
4	Full-Bit Functional, High-Density 8 Mbit One Transistor–One Capacitor Ferroelectric Random Access Memory Embedded within a Low-Power 130 nm Logic Process 2007 ·Japanese Journal of Applied Physics ·Krishna Udayakumar, T. S. Moise, Scott R. Summerfelt, (unknown), K. Remack, (unknown), Ali Shahbaz Haider, Yaw S. Obeng, (unknown), J. Antonio Travieso-Rodríguez, (unknown), Andrew J. McKerrow, (unknown), (unknown), Glen R. Fox	11
5	The effect of elastic modulus on channel crack propagation in organosilicate glass films 2006 ·Thin Solid Films ·Ting Y. Tsui, A. J. Griffin, (unknown), (unknown), Andrew J. McKerrow, Joost J. Vlassak	8
6	Fracture Property Improvements of a Nanoporous Thin Film via Post Deposition UV Curing 2006 ·MRS Proceedings ·(unknown), Ting Y. Tsui, Andrew J. McKerrow, (unknown)	1
7	Fracture Property Improvements of a Nanoporous Thin Film Via Post Deposition Bond Modifications 2005 ·MRS Proceedings ·(unknown), Ting Y. Tsui, Andrew J. McKerrow, (unknown)	2
8	Effects of elastic modulus on the fracture behavior of low-dielectric constant films 2005 ·Ting Y. Tsui, A. J. Griffin, (unknown), (unknown), Andrew J. McKerrow, R. Kraft	3
9	Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect 2004 ·Ting Y. Tsui, (unknown), R. Willecke, E. M. Zielinski, Tae‐il Kim, (unknown), J. W. McPherson, (unknown), Andrew J. McKerrow	2
10	Effects of silicon carbide composition on dielectric barrier Voltage Ramp and TDDB reliability performance 2004 ·Ting Y. Tsui, R. Willecke, Andrew J. McKerrow	3
11	Subcritical Delamination of Dielectric and Metal Films from Low-k Organosilicate Glass (OSG) Thin Films in Buffered pH Solutions 2003 ·MRS Proceedings ·Neil Y. C. Lin, Joost J. Vlassak, Ting Y. Tsui, Andrew J. McKerrow	9
12	Environmental Effects on Subcritical Delamination of Dielectric and Metal Films from Organosilicate Glass (OSG) Thin Films 2003 ·MRS Proceedings ·Neil Y. C. Lin, Joost J. Vlassak, Ting Y. Tsui, Andrew J. McKerrow	13
13	On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique 2000 ·Journal of Applied Physics ·Jie-Hua Zhao, (unknown), Paul S. Ho, Andrew J. McKerrow, (unknown)	30
14	Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films 1999 ·Journal of Applied Physics ·Jie-Hua Zhao, (unknown), Paul S. Ho, Andrew J. McKerrow, (unknown)	115
15	Quantitative investigations of the aggregation behaviour of hydrophobic anilino squaraine dyes through UV/vis spectroscopy and dynamic light scattering 1999 ·Canadian Journal of Chemistry ·James T. C. Wojtyk, Andrew J. McKerrow, Peter M. Kazmaier, Erwin Buncel	34
16	Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films 1999 ·Applied Physics Letters ·Jie-Hua Zhao, (unknown), (unknown), Ennis T. Ogawa, Paul S. Ho, (unknown), Andrew J. McKerrow, (unknown)	42
17	The effect of crosslinking on thermal and mechanical properties of perfluorocyclobutane aromatic ether polymers 1998 ·Journal of Polymer Science Part B Polymer Physics ·(unknown), Paul S. Ho, Andrew J. McKerrow	13
18	Overview Of Process Integration Issues For Low K Dielectrics 1998 ·MRS Proceedings ·Robert Havemann, Manoj Kumar Jain, R. S. List, (unknown), (unknown), C. Jin, Meng‐Chou Chang, E. M. Zielinski, (unknown), (unknown), Stephen W. Russell, (unknown), Andrew J. McKerrow, (unknown)	16
19	Thermomechanical Properties of Hydrogen Silsesquioxanes 1997 ·MRS Proceedings ·(unknown), Jiajun Zhao, Andrew J. McKerrow, E. Todd Ryan, (unknown), Paul S. Ho	3
20	Materials Issues and Characterization of Low-k Dielectric Materials 1997 ·MRS Bulletin ·E. Todd Ryan, Andrew J. McKerrow, Jihperng Leu, Paul S. Ho	41

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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