J.J. Brun

637 total citations
21 papers, 424 citations indexed

About

J.J. Brun is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, J.J. Brun has authored 21 papers receiving a total of 424 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 5 papers in Automotive Engineering and 3 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in J.J. Brun's work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). J.J. Brun is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). J.J. Brun collaborates with scholars based in France, United States and Austria. J.J. Brun's co-authors include Lauric Cécillon, Mickaël Hedde, Bernard Barthès, Antoine Stevens, Damien Ertlen, Cécile Gomez, Valérie Genot, N. Sillon, David Henry and A. Jouve and has published in prestigious journals such as The Science of The Total Environment, European Journal of Soil Science and Journal of Raman Spectroscopy.

In The Last Decade

J.J. Brun

21 papers receiving 402 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J.J. Brun France	10	196	155	98	93	63	21	424
Shengyao Jia China	11	192 1.0×	106 0.7×	66 0.7×	22 0.2×	6 0.1×	46	482
Naseer Ahmad Pakistan	12	55 0.3×	38 0.2×	13 0.1×	100 1.1×	11 0.2×	46	418
S.B. Tennakoon United Kingdom	17	642 3.3×	38 0.2×	7 0.1×	77 0.8×	35 0.6×	73	899
K.B. Samo Malaysia	12	64 0.3×	20 0.1×	115 1.2×	17 0.2×	14 0.2×	39	361
Yongzong Lu China	12	39 0.2×	26 0.2×	8 0.1×	14 0.2×	11 0.2×	32	355
Alexia Gobrecht France	7	7 0.0×	238 1.5×	137 1.4×	50 0.5×	3 0.0×	14	418
Zhaomei Qiu China	12	20 0.1×	25 0.2×	13 0.1×	18 0.2×	5 0.1×	30	318
Yingxu Song China	10	23 0.1×	29 0.2×	28 0.3×	18 0.2×	5 0.1×	18	339
Xinyu Dong China	9	8 0.0×	173 1.1×	21 0.2×	16 0.2×	11 0.2×	18	310
Xuqing Wang China	13	10 0.1×	18 0.1×	17 0.2×	122 1.3×	10 0.2×	31	507

Countries citing papers authored by J.J. Brun

Since Specialization

Citations

This map shows the geographic impact of J.J. Brun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.J. Brun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.J. Brun more than expected).

Fields of papers citing papers by J.J. Brun

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.J. Brun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.J. Brun. The network helps show where J.J. Brun may publish in the future.

Co-authorship network of co-authors of J.J. Brun

This figure shows the co-authorship network connecting the top 25 collaborators of J.J. Brun. A scholar is included among the top collaborators of J.J. Brun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.J. Brun. J.J. Brun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Brun, J.J., et al.. (2020). Very low parasitic inductance double side cooling power modules based on ceramic substrates and GaN devices. SPIRE - Sciences Po Institutional REpository. 1402–1407. 8 indexed citations

Brun, J.J., et al.. (2019). Millimeter scale thin film batteries for integrated high energy density storage. SPIRE - Sciences Po Institutional REpository. 26.1.1–26.1.4. 18 indexed citations

Rouchon, D., et al.. (2019). Ex situ and operando study of LiCoO₂ thin films by Raman spectroscopy: Thermal and electrochemical properties. Journal of Raman Spectroscopy. 50(10). 1594–1601. 18 indexed citations

Brun, J.J., et al.. (2012). Characterization of a highly sensitive silicon based three-axial piezoresistive force sensor. 2 indexed citations

Souriau, Jean-Charles, et al.. (2011). System-on-Wafer: 2-D and 3-D Technologies for Heterogeneous Systems. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(6). 813–824. 12 indexed citations

Brun, J.J., et al.. (2009). Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics. European Microelectronics and Packaging Conference. 1–5. 8 indexed citations

Charbonnier, Jean, S. Chéramy, David Henry, et al.. (2009). Integration of a temporary carrier in a TSV process flow. 99. 865–871. 48 indexed citations

Cécillon, Lauric, Bernard Barthès, Cécile Gomez, et al.. (2009). Assessment and monitoring of soil quality using near‐infrared reflectance spectroscopy (NIRS). European Journal of Soil Science. 60(5). 770–784. 184 indexed citations

Sillon, N., et al.. (2009). New trends in wafer level packaging. empc 2009. 211–213. 5 indexed citations

10.

Brun, J.J., et al.. (2009). 3D via belt technology. 1670–1675. 3 indexed citations

11.

Cécillon, Lauric, Nathalie Cassagne, Sonia Czarnes, et al.. (2008). Predicting soil quality indices with near infrared analysis in a wildfire chronosequence. The Science of The Total Environment. 407(3). 1200–1205. 32 indexed citations

12.

Souriau, Jean-Charles, et al.. (2008). Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype. 1334–1339. 1 indexed citations

13.

Jouve, A., et al.. (2008). Facilitating Ultrathin Wafer Handling for TSV Processing. 99. 45–50. 36 indexed citations

14.

Mathewson, A., et al.. (2008). Test structures for the evaluation of 3D chip interconnection schemes. 4. 117–122. 1 indexed citations

15.

Mathewson, A., et al.. (2007). Detailed Characterisation of Ni Microinsert Technology For Flip Chip Die on Wafer Attachment. 4. 616–621. 12 indexed citations

16.

Mathewson, A., et al.. (2007). Reliability Aspects of Microinsert Based Interconnection Technologies. 4. 227–232. 2 indexed citations

17.

Mathewson, A., et al.. (2006). Microstructured Interconnections for High Security Systems. 126–132. 11 indexed citations

18.

Brun, J.J., et al.. (2005). Localized Micro-Inserts Connection for Smart Card Secure Micro Packaging. 1–5. 3 indexed citations

19.

Souriau, Jean-Charles, et al.. (2004). Development on wafer level anisotropic conductive film for flip-chip interconnection. 1. 155–158. 15 indexed citations

20.

Jabiol, Bernard, A. Brêthes, Jean‐François Ponge, F. Toutain, & J.J. Brun. (1995). Humus in all its forms.. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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