Pandi C. Marimuthu
- Electrical and Electronic Engineering
- Automotive Engineering
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Co-authors
- Seung Wook YoonYaojian LinXavier BaratonAndreas BahrYonggang JinPatrick TangWon Kyoung ChoiYC Kim
- Topics
- Electronic Packaging and Soldering Technologies (19 papers)3D IC and TSV technologies (19 papers)Additive Manufacturing and 3D Printing Technologies (8 papers)
- Cited by
- Electrical and Electronic EngineeringAutomotive EngineeringElectronic, Optical and Magnetic Materials
- Journals
- European Microelectronics and Packaging ConferenceAdditional Conferences (Device Packaging HiTEC HiTEN & CICMT)IMAPSource Proceedings
In The Last Decade
Pandi C. Marimuthu
18 papers receiving 245 citations
Peers
Comparison fields: 5 of 22
- Electrical and Electronic Engineering 283
- Automotive Engineering 49
- Biomedical Engineering 45
- Electronic, Optical and Magnetic Materials 35
- Mechanical Engineering 19
Countries citing papers authored by Pandi C. Marimuthu
This map shows the geographic impact of Pandi C. Marimuthu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pandi C. Marimuthu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pandi C. Marimuthu more than expected).
Fields of papers citing papers by Pandi C. Marimuthu
This network shows the impact of papers produced by Pandi C. Marimuthu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Pandi C. Marimuthu. The network helps show where Pandi C. Marimuthu may publish in the future.
Co-authorship network of co-authors of Pandi C. Marimuthu
This figure shows the co-authorship network connecting the top 25 collaborators of Pandi C. Marimuthu. A scholar is included among the top collaborators of Pandi C. Marimuthu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Pandi C. Marimuthu. Pandi C. Marimuthu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 4 | |
| 2 | 42 | |
| 3 | 32 | |
| 4 | 1 | |
| 5 | 4 | |
| 6 | 6 | |
| 7 | 3D TSV mid-end processes and assembly/packaging technology | 6 |
| 8 | Development and characterization of 300mm large panel eWLB (embedded wafer level BGA) | 3 |
| 9 | 23 | |
| 10 | 4 | |
| 11 | 9 | |
| 12 | 4 | |
| 13 | 7 | |
| 14 | 9 | |
| 15 | 56 | |
| 16 | 21 | |
| 17 | 1 | |
| 18 | 27 | |
| 19 | 22 | |
| 20 | 14 |
About Pandi C. Marimuthu
Pandi C. Marimuthu is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Hardware and Architecture, having authored 20 papers that have together received 295 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (19 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (283 citations), Automotive Engineering (49 citations) and Electronic, Optical and Magnetic Materials (35 citations). Pandi C. Marimuthu has collaborated with scholars based in Singapore and Germany. Frequent co-authors include Seung Wook Yoon, Yaojian Lin, Xavier Baraton, Andreas Bahr, Yonggang Jin, Patrick Tang, Won Kyoung Choi, YC Kim and Urmi Ray. Their work appears in journals such as European Microelectronics and Packaging Conference, Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.