H.Y. Li
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced MEMS and NEMS Technologies
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Copper Interconnects and Reliability 10
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- 3D IC and TSV technologies 19
- Electronic Packaging and Soldering Technologies 13
- Semiconductor materials and devices 11
- Advanced MEMS and NEMS Technologies 4
- Photonic and Optical Devices 3
- Integrated Circuits and Semiconductor Failure Analysis 3
H.Y. Li
32 papers receiving 314 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 304
- Automotive Engineering 44
- Electronic, Optical and Magnetic Materials 35
- Biomedical Engineering 77
- Hardware and Architecture 7
Countries citing papers authored by H.Y. Li
This map shows the geographic impact of H.Y. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H.Y. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H.Y. Li more than expected).
Fields of papers citing papers by H.Y. Li
This network shows the impact of papers produced by H.Y. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H.Y. Li. The network helps show where H.Y. Li may publish in the future.
Co-authorship network
The 25 scholars most cited alongside H.Y. Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 2 | |
| 2 | 2025 | 0 | |
| 3 | 2025 | 0 | |
| 4 | 2024 | 1 | |
| 5 | 2024 | 1 | |
| 6 | 2019 | 30 | |
| 7 | 2013 | 1 | |
| 8 | 2012 | 3 | |
| 9 | 2012 | 9 | |
| 10 | 2012 | 50 | |
| 11 | 2011 | 4 | |
| 12 | 2010 | 3 | |
| 13 | 2008 | 11 | |
| 14 | 2008 | 7 | |
| 15 | 2008 | 7 | |
| 16 | 2008 | 5 | |
| 17 | 2006 | 17 | |
| 18 | 2006 | 13 | |
| 19 | 2005 | 4 | |
| 20 | 2004 | 9 |
About H.Y. Li
H.Y. Li is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Automotive Engineering, Ocean Engineering and Bioengineering, having authored 35 papers that have together received 328 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (13 papers), Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (10 papers), Advanced MEMS and NEMS Technologies (4 papers), Photonic and Optical Devices (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Hydrocarbon exploration and reservoir analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (304 citations), Automotive Engineering (44 citations), Electronic, Optical and Magnetic Materials (35 citations), Biomedical Engineering (77 citations) and Hardware and Architecture (7 citations). H.Y. Li has collaborated with scholars based in Singapore, China and United States. Frequent co-authors include Xiaowu Zhang, Fa Xing, Shan Gao, E.B. Liao, Guo Li, N. Balasubramanian, V. Kripesh, John H. Lau, Hongmiao Ji and M. Kawano. Their work appears in journals such as Thin Solid Films, IEEE Electron Device Letters, SPE Journal, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.