C. Chappaz

418 total citations
17 papers, 301 citations indexed

About

C. Chappaz is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, C. Chappaz has authored 17 papers receiving a total of 301 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 4 papers in Biomedical Engineering. Recurrent topics in C. Chappaz's work include Copper Interconnects and Reliability (10 papers), Electronic Packaging and Soldering Technologies (10 papers) and 3D IC and TSV technologies (9 papers). C. Chappaz is often cited by papers focused on Copper Interconnects and Reliability (10 papers), Electronic Packaging and Soldering Technologies (10 papers) and 3D IC and TSV technologies (9 papers). C. Chappaz collaborates with scholars based in France, Switzerland and India. C. Chappaz's co-authors include S. Moreau, Thomas Frank, L. Arnaud, Lorena Anghel, F. Lorut, Philip R. LeDuc, Aurélie Thuaire, L. Di Cioccio, R. Taïbi and Pierric Gueguen and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Journal of Solid-State Circuits and Journal of Micromechanics and Microengineering.

In The Last Decade

C. Chappaz

16 papers receiving 296 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C. Chappaz France	7	275	99	43	37	29	17	301
Adeel Bajwa United States	13	366 1.3×	41 0.4×	68 1.6×	24 0.6×	98 3.4×	26	415
S. Cian Ó Mathúna Ireland	11	408 1.5×	38 0.4×	79 1.8×	20 0.5×	65 2.2×	27	468
Keiji Tatani Taiwan	9	307 1.1×	67 0.7×	61 1.4×	26 0.7×	25 0.9×	12	334
Scott Pozder United States	14	580 2.1×	71 0.7×	51 1.2×	102 2.8×	54 1.9×	25	607
Asisa Kumar Panigrahi India	11	333 1.2×	96 1.0×	45 1.0×	99 2.7×	20 0.7×	23	384
Farhan A. Ghaffar Saudi Arabia	12	343 1.2×	50 0.5×	188 4.4×	16 0.4×	63 2.2×	48	499
H. Gan United States	8	583 2.1×	199 2.0×	51 1.2×	34 0.9×	120 4.1×	15	608
D. Bouchu France	11	267 1.0×	105 1.1×	39 0.9×	23 0.6×	17 0.6×	33	294
Pierric Gueguen France	11	355 1.3×	96 1.0×	58 1.3×	80 2.2×	30 1.0×	20	390

Countries citing papers authored by C. Chappaz

Since Specialization

Citations

This map shows the geographic impact of C. Chappaz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Chappaz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Chappaz more than expected).

Fields of papers citing papers by C. Chappaz

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Chappaz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Chappaz. The network helps show where C. Chappaz may publish in the future.

Co-authorship network of co-authors of C. Chappaz

This figure shows the co-authorship network connecting the top 25 collaborators of C. Chappaz. A scholar is included among the top collaborators of C. Chappaz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Chappaz. C. Chappaz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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17 of 17 papers shown

Saccoccio, M., Jan Berton, David Holleville, et al.. (2017). New optical technology for cold atom experiments. HAL (Le Centre pour la Communication Scientifique Directe). 48–48.

Casset, F., et al.. (2016). Characterization of a smartphone size haptic rendering system based on thin-film AlN actuators on glass substrates. Journal of Micromechanics and Microengineering. 26(8). 84007–84007. 6 indexed citations

Casset, F., et al.. (2016). 4-inch transparent plates based on thin-film AlN actuators for haptic applications. Mechatronics. 40. 264–269. 11 indexed citations

Farcy, A., Vincent Fiori, C. Chappaz, et al.. (2015). Stress management strategy to limit die curvature during silicon interposer integration. TS11.4.1–TS11.4.7. 3 indexed citations

Casset, F., et al.. (2014). Design, Fabrication and Characterization of a Tactile Display Based on AlN Transducers. Procedia Engineering. 87. 1310–1313. 6 indexed citations

Frank, Thomas, C. Chappaz, L. Arnaud, et al.. (2012). Electromigration degradation mechanism analysis of SnAgCu interconnects for eWLB package. SPIRE - Sciences Po Institutional REpository. 2E.5.1–2E.5.6. 5 indexed citations

Cioccio, L. Di, R. Taïbi, C. Chappaz, et al.. (2012). 200°C direct bonding copper interconnects : Electrical results and reliability. 1–4. 1 indexed citations

Frank, Thomas, et al.. (2012). Through silicon via impact on above BEoL Time Dependent Dielectric Breakdown. 41–44. 2 indexed citations

Frank, Thomas, S. Moreau, C. Chappaz, et al.. (2012). Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectronics Reliability. 53(1). 17–29. 85 indexed citations

10.

Taïbi, R., L. Di Cioccio, C. Chappaz, et al.. (2011). Investigation of stress induced voiding and electromigration phenomena on direct copper bonding interconnects for 3D integration. 6.5.1–6.5.4. 24 indexed citations

11.

Frank, Thomas, C. Chappaz, Philip R. LeDuc, et al.. (2011). Resistance increase due to electromigration induced depletion under TSV. SPIRE - Sciences Po Institutional REpository. 3F.4.1–3F.4.6. 65 indexed citations

12.

Cioccio, L. Di, Pierric Gueguen, R. Taïbi, et al.. (2011). An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization. Journal of The Electrochemical Society. 158(6). P81–P86. 68 indexed citations

13.

Chappaz, C., et al.. (2010). Lifetime extrapolation for Electromigration tests at wafer level with a dedicated device. 57. 887–889. 1 indexed citations

14.

Cioccio, L. Di, Pierric Gueguen, R. Taïbi, et al.. (2010). (Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization. ECS Transactions. 33(4). 3–16. 10 indexed citations

15.

Cacho, F., Vincent Fiori, Laurent Doyen, et al.. (2008). Electromigration induced failure mechanism: Multiphysics model and correlation with experiments. 253. 1–6. 6 indexed citations

16.

Cacho, F., C. Chappaz, C. Tavernier, & H. Jaouen. (2007). Modeling of Electromigration Induced Failure Mechanism in Semiconductor Devices. 5 indexed citations

17.

Badets, Franck, et al.. (2007). Development of Embedded Three-Dimensional 35-nF/mm$^{2}$ MIM Capacitor and BiCMOS Circuits Characterization. IEEE Journal of Solid-State Circuits. 42(9). 1842–1850. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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