C. Chappaz
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- Copper Interconnects and Reliability 10
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- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 9
- Semiconductor materials and devices 3
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- Advanced Sensor and Energy Harvesting Materials 2
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- Tactile and Sensory Interactions 3
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- Geophysics and Sensor Technology 2
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- Microstructure and mechanical properties 1
- Co-authors
- S. MoreauLorena AnghelThomas FrankL. ArnaudF. LorutPhilip R. LeDucAurélie ThuaireL. Di Cioccio
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringAutomotive Engineering
- Journals
- IEEE Journal of Solid-State Circuits (1 paper)Mechatronics (1 paper)Journal of Micromechanics and Microengineering (1 paper)
- Partner nations
- FranceSwitzerlandIndia
In The Last Decade
C. Chappaz
16 papers receiving 296 citations
Peers
Comparison fields: 5 of 24
- Electronic, Optical and Magnetic Materials 99
- Electrical and Electronic Engineering 275
- Automotive Engineering 37
- Hardware and Architecture 10
- Biomedical Engineering 43
Countries citing papers authored by C. Chappaz
This map shows the geographic impact of C. Chappaz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Chappaz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Chappaz more than expected).
Fields of papers citing papers by C. Chappaz
This network shows the impact of papers produced by C. Chappaz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Chappaz. The network helps show where C. Chappaz may publish in the future.
Co-authorship network
The 25 scholars most cited alongside C. Chappaz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 0 | |
| 2 | 2016 | 6 | |
| 3 | 2016 | 11 | |
| 4 | 2015 | 3 | |
| 5 | 2014 | 6 | |
| 6 | 2012 | 2 | |
| 7 | 2012 | 1 | |
| 8 | 2012 | 5 | |
| 9 | 2012 | 85 | |
| 10 | 2011 | 24 | |
| 11 | 2011 | 65 | |
| 12 | 2011 | 68 | |
| 13 | 2010 | 1 | |
| 14 | 2010 | 10 | |
| 15 | 2008 | 6 | |
| 16 | Modeling of Electromigration Induced Failure Mechanism in Semiconductor Devices | 2007 | 5 |
| 17 | 2007 | 3 |
About C. Chappaz
C. Chappaz is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Cognitive Neuroscience, having authored 17 papers that have together received 301 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (10 papers), Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (9 papers), Tactile and Sensory Interactions (3 papers), Semiconductor materials and devices (3 papers), Geophysics and Sensor Technology (2 papers), Advanced Sensor and Energy Harvesting Materials (2 papers) and Microstructure and mechanical properties (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (99 citations), Electrical and Electronic Engineering (275 citations) and Automotive Engineering (37 citations). C. Chappaz has collaborated with scholars based in France, Switzerland and India. Frequent co-authors include S. Moreau, Lorena Anghel, Thomas Frank, L. Arnaud, F. Lorut, Philip R. LeDuc, Aurélie Thuaire, L. Di Cioccio, R. Taïbi and L. Clavelier. Their work appears in journals such as IEEE Journal of Solid-State Circuits, Mechatronics, Journal of Micromechanics and Microengineering, Journal of The Electrochemical Society and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.