Tong Yan Tee
-
- Electronic Packaging and Soldering Technologies 68
- 3D IC and TSV technologies 56
- Electrostatic Discharge in Electronics 14
- Electromagnetic Compatibility and Noise Suppression 7
- Integrated Circuits and Semiconductor Failure Analysis 7
- Mechanics of Materials top 2%
- Mechanical Behavior of Composites 8
- Material Properties and Processing 7
- Mechanical Engineering top 10%
- Metal Forming Simulation Techniques 7
- Hardware and Architecture top 10%
- Partner nations
- SingaporeUnited StatesSwitzerland
In The Last Decade
Tong Yan Tee
70 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 1.5k
- Mechanics of Materials 529
- Mechanical Engineering 309
- Hardware and Architecture 35
- Electronic, Optical and Magnetic Materials 56
Countries citing papers authored by Tong Yan Tee
This map shows the geographic impact of Tong Yan Tee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tong Yan Tee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tong Yan Tee more than expected).
Fields of papers citing papers by Tong Yan Tee
This network shows the impact of papers produced by Tong Yan Tee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tong Yan Tee. The network helps show where Tong Yan Tee may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Tong Yan Tee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 8 | |
| 2 | 2011 | 1 | |
| 3 | 2010 | 9 | |
| 4 | 2009 | 16 | |
| 5 | 2009 | 5 | |
| 6 | 2007 | 33 | |
| 7 | 2006 | 1 | |
| 8 | 2005 | 1 | |
| 9 | 2005 | 57 | |
| 10 | 2005 | 5 | |
| 11 | 2005 | 17 | |
| 12 | 2005 | 3 | |
| 13 | 2004 | 37 | |
| 14 | 2004 | 35 | |
| 15 | 2004 | 5 | |
| 16 | 2004 | 98 | |
| 17 | 2004 | 162 | |
| 18 | 2003 | 4 | |
| 19 | 2003 | 39 | |
| 20 | 2002 | 12 |
About Tong Yan Tee
Tong Yan Tee is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, having authored 72 papers that have together received 1.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (68 papers), 3D IC and TSV technologies (56 papers), Electrostatic Discharge in Electronics (14 papers), Mechanical Behavior of Composites (8 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Material Properties and Processing (7 papers), Metal Forming Simulation Techniques (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.5k citations), Mechanics of Materials (529 citations) and Mechanical Engineering (309 citations). Tong Yan Tee has collaborated with scholars based in Singapore, United States and Switzerland. Frequent co-authors include Z.W. Zhong, Jing-en Luan, Hun Shen Ng, Chwee Teck Lim, E. Pek, D. Yap, Xavier Baraton, Jiang Zhou, Xuejun Fan and V.B.C. Tan.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.