Tong Yan Tee

2.1k total citations
72 papers, 1.6k citations indexed

About

Tong Yan Tee is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Tong Yan Tee has authored 72 papers receiving a total of 1.6k indexed citations (citations by other indexed papers that have themselves been cited), including 69 papers in Electrical and Electronic Engineering, 15 papers in Mechanics of Materials and 14 papers in Mechanical Engineering. Recurrent topics in Tong Yan Tee's work include Electronic Packaging and Soldering Technologies (68 papers), 3D IC and TSV technologies (56 papers) and Electrostatic Discharge in Electronics (14 papers). Tong Yan Tee is often cited by papers focused on Electronic Packaging and Soldering Technologies (68 papers), 3D IC and TSV technologies (56 papers) and Electrostatic Discharge in Electronics (14 papers). Tong Yan Tee collaborates with scholars based in Singapore, United States and Switzerland. Tong Yan Tee's co-authors include Z.W. Zhong, Jing-en Luan, Hun Shen Ng, Chwee Teck Lim, E. Pek, D. Yap, Xavier Baraton, Jiang Zhou, Xuejun Fan and V.B.C. Tan and has published in prestigious journals such as Proceedings of the IEEE, Thin Solid Films and Journal of Electronic Materials.

In The Last Decade

Tong Yan Tee

70 papers receiving 1.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tong Yan Tee Singapore 24 1.5k 529 309 94 67 72 1.6k
R. Dudek Germany 18 1.3k 0.8× 421 0.8× 507 1.6× 75 0.8× 117 1.7× 133 1.5k
Sven Rzepka Germany 15 906 0.6× 249 0.5× 319 1.0× 102 1.1× 50 0.7× 169 1.1k
Chang-Lin Yeh Taiwan 20 996 0.6× 305 0.6× 382 1.2× 203 2.2× 36 0.5× 67 1.1k
Robert Darveaux United States 18 1.9k 1.2× 462 0.9× 821 2.7× 136 1.4× 265 4.0× 50 2.1k
Reza Ghaffarian United States 15 634 0.4× 177 0.3× 203 0.7× 65 0.7× 63 0.9× 101 841
Darvin Edwards United States 15 781 0.5× 159 0.3× 424 1.4× 91 1.0× 77 1.1× 35 991
James M. Pitarresi United States 17 670 0.4× 331 0.6× 260 0.8× 31 0.3× 65 1.0× 55 872
Fa Xing Singapore 27 2.5k 1.6× 459 0.9× 1.1k 3.7× 140 1.5× 250 3.7× 153 2.8k
W. Engelmaier United States 11 577 0.4× 196 0.4× 289 0.9× 33 0.4× 56 0.8× 20 656
Vladimir Cherman Belgium 19 820 0.5× 47 0.1× 351 1.1× 101 1.1× 73 1.1× 107 1.1k

Countries citing papers authored by Tong Yan Tee

Since Specialization
Citations

This map shows the geographic impact of Tong Yan Tee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tong Yan Tee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tong Yan Tee more than expected).

Fields of papers citing papers by Tong Yan Tee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tong Yan Tee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tong Yan Tee. The network helps show where Tong Yan Tee may publish in the future.

Co-authorship network of co-authors of Tong Yan Tee

This figure shows the co-authorship network connecting the top 25 collaborators of Tong Yan Tee. A scholar is included among the top collaborators of Tong Yan Tee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tong Yan Tee. Tong Yan Tee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tee, Tong Yan, et al.. (2011). Electrical simulation and measurement of IPD with multilayer thin film technology for WLP. 1–6. 8 indexed citations
2.
3.
Tee, Tong Yan, Xuejun Fan, & Yi‐Shao Lai. (2010). Advances in Wafer Level Packaging (WLP). Microelectronics Reliability. 50(4). 479–480. 9 indexed citations
4.
Tee, Tong Yan, et al.. (2009). Design for board trace reliability of WLCSP under drop test. 1. 1–8. 16 indexed citations
5.
Tan, Long Bin, et al.. (2009). Rate-dependent properties of Sn-Ag-Cu based lead free solder joints. National University of Singapore. 48. 283–291. 5 indexed citations
6.
Luan, Jing-en, Tong Yan Tee, E. Pek, Chwee Teck Lim, & Z.W. Zhong. (2007). Dynamic responses and solder joint reliability under board level drop test. Microelectronics Reliability. 47(2-3). 450–460. 33 indexed citations
7.
8.
Tee, Tong Yan, et al.. (2005). Nonlinear elasto-plastic analysis of wire bond reliability for optical LQFP package. 718–722. 1 indexed citations
9.
Luan, Jing-en & Tong Yan Tee. (2005). Novel board level drop test simulation using implicit transient analysis with input-G method. 671–677. 57 indexed citations
10.
11.
Tee, Tong Yan, et al.. (2005). Numerical and experimental correlation of high temperature reliability of gold wire bonding to intermetallics (Au/Al) uniformity. Thin Solid Films. 504(1-2). 355–361. 17 indexed citations
12.
Tee, Tong Yan, Hun Shen Ng, Howard Jay Siegel, R. D. Bond, & Z.W. Zhong. (2005). Design analysis of touch chip for enhanced package and board level reliability. 743–747. 3 indexed citations
13.
14.
Tee, Tong Yan & Z.W. Zhong. (2004). Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. Microelectronics Reliability. 44(12). 1957–1965. 35 indexed citations
15.
Villa, Claudio Maria, et al.. (2004). SMT process robustness and board level solder joint reliability of C/sup 2/BGA. 1869–1874. 5 indexed citations
16.
Tee, Tong Yan, Hun Shen Ng, Chwee Teck Lim, E. Pek, & Z.W. Zhong. (2004). Board level drop test and simulation of TFBGA packages for telecommunication applications. 121–129. 98 indexed citations
17.
Tee, Tong Yan, Hun Shen Ng, Chwee Teck Lim, E. Pek, & Z.W. Zhong. (2004). Impact life prediction modeling of TFBGA packages under board level drop test. Microelectronics Reliability. 44(7). 1131–1142. 162 indexed citations
18.
Tee, Tong Yan, et al.. (2003). DESIGN FOR BOARD LEVEL RELIABILITY OF A MINIATURIZED MEMS PACKAGE: STACKED DIE TQFN. 4(2). 347–350. 4 indexed citations
19.
Tee, Tong Yan, et al.. (2003). Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectronics Reliability. 43(5). 741–749. 39 indexed citations
20.
Tee, Tong Yan, et al.. (2002). Board level solder joint reliability modeling of LFBGA package. 51–54. 12 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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