Guojun Hu

472 total citations
35 papers, 369 citations indexed

About

Guojun Hu is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Guojun Hu has authored 35 papers receiving a total of 369 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 10 papers in Mechanical Engineering. Recurrent topics in Guojun Hu's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (12 papers) and Mechanical Behavior of Composites (8 papers). Guojun Hu is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (12 papers) and Mechanical Behavior of Composites (8 papers). Guojun Hu collaborates with scholars based in China, Singapore and Switzerland. Guojun Hu's co-authors include Jing-en Luan, A.A.O. Tay, Xavier Baraton, Demin Jia, Yuanfang Luo, Shilong Chen, Lan Liu, Hong Gao, Roberto Rossi and Feng Fang and has published in prestigious journals such as Chemical Communications, Composites Science and Technology and Journal of Organometallic Chemistry.

In The Last Decade

Guojun Hu

34 papers receiving 352 citations

Peers

Countries citing papers authored by Guojun Hu

Since Specialization

Citations

This map shows the geographic impact of Guojun Hu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Guojun Hu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Guojun Hu more than expected).

Fields of papers citing papers by Guojun Hu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Guojun Hu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Guojun Hu. The network helps show where Guojun Hu may publish in the future.

Co-authorship network of co-authors of Guojun Hu

This figure shows the co-authorship network connecting the top 25 collaborators of Guojun Hu. A scholar is included among the top collaborators of Guojun Hu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Guojun Hu. Guojun Hu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Modification of g-C3N4’s optical and dielectric properties by doping with Ag-TiO2 nanocomposites 2025 ·Materials Letters ·(unknown), (unknown), H. Ren, (unknown), (unknown), Guojun Hu, (unknown)	2
2	Enhanced methylene blue degradation by graphene oxide-encapsulated nano zero-valent iron composites: Optimization, mechanistic insights, and environmental implications 2024 ·Materials Science in Semiconductor Processing ·Hongyang Ren, (unknown), Yuan Chen, (unknown), (unknown), (unknown), (unknown), Guojun Hu, (unknown)	4
3	Synthesis of amine-bridged bis(phenolate) rare-earth metal alkoxides and their catalytic performance for the polymerization of trimethylene carbonate and L‑lactide 2023 ·Journal of Organometallic Chemistry ·Guojun Hu, (unknown), Yanwei Wang, Dan Yuan, Yong Zhang, Yingming Yao	3
4	Random copolymerization of trimethylene carbonate with l-lactide initiated by amine-bridged bis(phenolate) neodymium alkoxides 2023 ·Chemical Communications ·Guojun Hu, Yanwei Wang, Yaorong Wang, Xuehua Zhu, Dan Yuan, Yingming Yao	4
5	Thermal treatment improvement and energy harvesting capability promotion of a rotating piezoelectric aggregated CNT-reinforced beam-like structure resorting to an auxetic lamina 2023 ·Structures ·(unknown), Feng Fang, Guojun Hu, Hadi Arvin	6
6	The investigation of unbalanced vibration in flexible motorized spindle-rotor system 2016 ·Machining Science and Technology ·(unknown), Guojun Hu	6
7	Chip Package Interactions: Package effects on copper pillar bump induced BEoL delaminations & associated numerical developments 2015 ·(unknown), Guojun Hu, Vincent Fiori, (unknown), (unknown), C. Tavernier	4
8	Noncovalently functionalized pristine graphene/metal nanoparticle hybrid for conductive composites 2014 ·Composites Science and Technology ·(unknown), Shilong Chen, Yuanfang Luo, Demin Jia, Hong Gao, Guojun Hu, Lan Liu	32
9	Study on the properties of conductive adhesives in various curing manners for MCM applications 2014 ·Journal of Adhesion Science and Technology ·Hong Gao, Guojun Hu, Jinwen Zhou, Jiajia Zou, (unknown)	3
10	Edge-functionalized graphene as reinforcement of epoxy-based conductive composite for electrical interconnects 2013 ·Composites Science and Technology ·(unknown), Shilong Chen, Yuanfang Luo, Demin Jia, Hong Gao, Guojun Hu, Lan Liu	40
11	In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive 2013 ·International Journal of Adhesion and Adhesives ·Shilong Chen, (unknown), Yuanfang Luo, Demin Jia, Hong Gao, Guojun Hu, Lan Liu	19
12	Comparison of copper, silver and gold wire bonding on interconnect metallization 2012 ·Guojun Hu	18
13	Thermoelastic properties of printed circuit boards: Effect of copper trace 2009 ·European Microelectronics and Packaging Conference ·Guojun Hu, (unknown), Jing-en Luan, (unknown), Xavier Baraton	11
14	Challenges for extra large embedded wafer level ball grid array development 2009 ·Jing-en Luan, Yonggang Jin, K.L. Goh, (unknown), Guojun Hu, (unknown), Xavier Baraton	12
15	Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? 2009 ·National University of Singapore ·Guojun Hu, Jing-en Luan, Xavier Baraton, A.A.O. Tay	8
16	Cure Shrinkage Analysis of Green Epoxy Molding Compound with Application to Warpage Analysis in a Plastic IC Package 2007 ·Guojun Hu, (unknown), (unknown)	7
17	The Effect of Moisture on the Critical Defect Size For Delamination Failure at the Pad/Encapsulant Interface of Plastic IC Packages Undergoing Solder Reflow 2006 ·National University of Singapore ·A.A.O. Tay, (unknown), Guojun Hu	6
18	FEA Simulation and In-situ Warpage Monitoring of Laminated Package Molded with Green EMC Using Shadow Morie System 2006 ·(unknown), (unknown), (unknown), Guojun Hu, (unknown), (unknown)	6
19	A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow 2005 ·Guojun Hu, A.A.O. Tay	6
20	Synthesis and characterization of ultrafine powders of SiCSi3N4 1994 ·Materials Science and Engineering B ·Yuqing Xu, Guojun Hu, (unknown)	1

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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