J. Michailos

531 total citations
16 papers, 343 citations indexed

About

J. Michailos is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, J. Michailos has authored 16 papers receiving a total of 343 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 3 papers in Aerospace Engineering and 3 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in J. Michailos's work include 3D IC and TSV technologies (8 papers), Semiconductor materials and devices (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). J. Michailos is often cited by papers focused on 3D IC and TSV technologies (8 papers), Semiconductor materials and devices (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). J. Michailos collaborates with scholars based in France, Switzerland and United States. J. Michailos's co-authors include M. Marty, S. Chéramy, Fabien Clermidy, Christian Bernard, Pascal Vivet, Yvain Thonnart, Denis Dutoit, Frédéric Pétrot, Tom Blomberg and M. Gros‐Jean and has published in prestigious journals such as Journal of The Electrochemical Society, Optics Express and IEEE Journal of Solid-State Circuits.

In The Last Decade

J. Michailos

16 papers receiving 332 citations

Peers

Countries citing papers authored by J. Michailos

Since Specialization

Citations

This map shows the geographic impact of J. Michailos's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Michailos with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Michailos more than expected).

Fields of papers citing papers by J. Michailos

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Michailos. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Michailos. The network helps show where J. Michailos may publish in the future.

Co-authorship network of co-authors of J. Michailos

This figure shows the co-authorship network connecting the top 25 collaborators of J. Michailos. A scholar is included among the top collaborators of J. Michailos based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Michailos. J. Michailos is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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16 of 16 papers shown

#	Title	Journal	Authors	Indexed citations
1	Challenges and capabilities of 3D integration in CMOS imaging sensors		J. Michailos et al.	5
2	A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links	IEEE Journal of Solid-State Circuits	Pascal Vivet, Yvain Thonnart et al.	25
3	8.1 a 4x4x2 homogeneous scalable 3d network-on-chip circuit with 326mflit/s 0.66pj/b robust and fault-tolerant asynchronous 3d links		Pascal Vivet, Yvain Thonnart et al.	19
4	ITAC: A complete 3D integration test platform	SPIRE - Sciences Po Institutional REpository	Didier Lattard, L. Arnaud et al.	6
5	Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations	IEEE Transactions on Components Packaging and Manufacturing Technology	Vincent Fiori, A. Farcy et al.	7
6	Thermal correlation between measurements and FEM simulations in 3D ICs		F. de Crécy, Vincent Fiori et al.	5
7	A 0.9 pJ/bit, 12.8 GByte/s WideIO memory interface in a 3D-IC NoC-based MPSoC		Denis Dutoit, Christian Bernard et al.	33
8	Thermal behavior of stack-based 3D ICs		F. de Crécy, Vincent Fiori et al.	4
9	Color filters including infrared cut-off integrated on CMOS image sensor	Optics Express	M. Marty, J. Michailos et al.	68
10	Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient	Journal of The Electrochemical Society	Tom Blomberg, E. Blanquet et al.	40
11	Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results		David Henry, Jean Charbonnier et al.	27
12	Fully Optimized Cu based process with dedicated cavity etch for 1.75&#x003BC;m and 1.45&#x003BC;m pixel pitch CMOS Image Sensors	HAL (Le Centre pour la Communication Scientifique Directe)	F. Roy, C. Cowache et al.	30
13	Integration of fluorine-doped silicon oxide in copper pilot line for 0.12-μm technology	Microelectronic Engineering	J. Michailos, K. Barla et al.	22
14	Deposition and Characterization of Ultrathin Ta₂O₅ Layers Deposited on Silicon From a Ta(OC₂H₅)₅ Precursor	MRS Proceedings	C. Chaneliere, Jean‐Luc Autran et al.	2
15	<title>Amorphous silicon x-ray image sensor</title>	Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE	J. Chabbal, J. Michailos et al.	45
16	Influence of helium dilution on physico-chemical and defect properties of PECVD silicon oxynitride films	Applied Surface Science	J. Michailos et al.	5

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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