Scott Pozder

819 total citations
25 papers, 607 citations indexed

About

Scott Pozder is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Scott Pozder has authored 25 papers receiving a total of 607 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 5 papers in Automotive Engineering and 4 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Scott Pozder's work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (14 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). Scott Pozder is often cited by papers focused on 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (14 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). Scott Pozder collaborates with scholars based in United States, France and Austria. Scott Pozder's co-authors include Ankur Jain, Ritwik Chatterjee, Robert E. Jones, Robert E. Jones, Zhihong Huang, Syed M. Alam, Cindy Goldberg, L.L. Mercado, Ioannis Savidis and Chuan Seng Tan and has published in prestigious journals such as Applied Physics Letters, RSC Advances and Journal of Electronic Materials.

In The Last Decade

Scott Pozder

25 papers receiving 578 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Scott Pozder United States 14 580 102 71 54 52 25 607
Kwang-Yoo Byun South Korea 8 711 1.2× 61 0.6× 64 0.9× 38 0.7× 37 0.7× 18 736
S. Chéramy France 14 490 0.8× 104 1.0× 41 0.6× 40 0.7× 21 0.4× 61 522
Min-Suk Suh South Korea 9 684 1.2× 43 0.4× 47 0.7× 66 1.2× 47 0.9× 20 709
Joeri De Vos Belgium 17 797 1.4× 107 1.0× 109 1.5× 75 1.4× 74 1.4× 98 861
M. J. Interrante United States 6 463 0.8× 77 0.8× 52 0.7× 24 0.4× 32 0.6× 7 487
P. Coudrain France 12 423 0.7× 36 0.4× 62 0.9× 74 1.4× 48 0.9× 46 487
W.C. Chiou Taiwan 11 467 0.8× 50 0.5× 49 0.7× 30 0.6× 17 0.3× 22 517
L.W. Schaper United States 15 563 1.0× 43 0.4× 108 1.5× 62 1.1× 110 2.1× 64 669
Guruprasad Katti Belgium 13 1.0k 1.8× 90 0.9× 67 0.9× 39 0.7× 34 0.7× 27 1.1k
Robert Wieland Germany 12 440 0.8× 92 0.9× 25 0.4× 38 0.7× 30 0.6× 32 483

Countries citing papers authored by Scott Pozder

Since Specialization
Citations

This map shows the geographic impact of Scott Pozder's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Scott Pozder with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Scott Pozder more than expected).

Fields of papers citing papers by Scott Pozder

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Scott Pozder. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Scott Pozder. The network helps show where Scott Pozder may publish in the future.

Co-authorship network of co-authors of Scott Pozder

This figure shows the co-authorship network connecting the top 25 collaborators of Scott Pozder. A scholar is included among the top collaborators of Scott Pozder based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Scott Pozder. Scott Pozder is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Rabie, Mohamed A., et al.. (2018). BEoL Layout Design Considerations to Mitigate CPI Risk. 5. 64–66. 1 indexed citations
2.
Pozder, Scott, et al.. (2018). Utilizing Thermo-Mechanical CPI Simulation to Define a 7nm Package Envelope. 1–6. 1 indexed citations
3.
Fowler, Burt, Yao‐Feng Chang, Fei Zhou, et al.. (2015). Electroforming and resistive switching in silicon dioxide resistive memory devices. RSC Advances. 5(27). 21215–21236. 58 indexed citations
4.
Marconnet, Amy, Munekazu Motoyama, Michael T. Barako, et al.. (2012). Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films. 75. 15–19. 2 indexed citations
5.
Jain, Ankur, S. M. Alam, Scott Pozder, & Robert E. Jones. (2011). Thermal–electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints. IET Computers & Digital Techniques. 5(3). 169–178. 14 indexed citations
6.
Pozder, Scott, Ankur Jain, Robert Jones, et al.. (2009). Reliability Considerations in 3D Stacked Strata Systems. AIP conference proceedings. 213–223. 1 indexed citations
7.
Alam, Syed M., Robert E. Jones, Scott Pozder, et al.. (2009). Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 18(3). 450–460. 17 indexed citations
8.
Alam, Syed M., Robert E. Jones, Scott Pozder, & Ankur Jain. (2009). Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology. 569–575. 15 indexed citations
9.
Jain, Ankur, Robert E. Jones, Ritwik Chatterjee, & Scott Pozder. (2009). Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits. IEEE Transactions on Components and Packaging Technologies. 33(1). 56–63. 137 indexed citations
10.
Savidis, Ioannis, Syed M. Alam, Ankur Jain, et al.. (2009). Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits. Microelectronics Journal. 41(1). 9–16. 65 indexed citations
11.
12.
Huang, Zhihong, Ritwik Chatterjee, Patrick Justison, et al.. (2008). Electromigration of Cu-Sn-Cu micropads in 3D interconnect. 12–17. 27 indexed citations
13.
Pozder, Scott, et al.. (2007). Progress of 3D Integration Technologies and 3D Interconnects. 213–215. 48 indexed citations
14.
Jones, Robert E., Ritwik Chatterjee, & Scott Pozder. (2007). Technology and Application of 3D Interconnect. 710. 1–4. 3 indexed citations
15.
Su, Peng, et al.. (2006). Mechanical integrity evaluation of low-k device with bump shear. Journal of Electronic Materials. 35(5). 1025–1031. 1 indexed citations
16.
Goldberg, Cindy, Vincent Fiori, Robert Fox, et al.. (2005). Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types. 3–5. 13 indexed citations
17.
Tan, Chuan Seng, et al.. (2005). Observation of interfacial void formation in bonded copper layers. Applied Physics Letters. 87(20). 35 indexed citations
18.
Pozder, Scott, Jian‐Qiang Lu, Stefan Zollner, et al.. (2004). Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform. 102–104. 14 indexed citations
19.
Mercado, L.L., et al.. (2003). Analysis of flip-chip packaging challenges on copper/low-k interconnects. IEEE Transactions on Device and Materials Reliability. 3(4). 111–118. 69 indexed citations
20.
Chen, Weiming, et al.. (1996). Study of Cobalt Salicide Fabrication on Sub-Quarter Micron Polysilicon Lines. MRS Proceedings. 429. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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