Scott Pozder
- Electrical and Electronic Engineering top 10%
- Automotive Engineering top 10%
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Materials Chemistry
- Co-authors
- Ankur JainRitwik ChatterjeeRobert E. JonesZhihong HuangSyed M. AlamCindy GoldbergL.L. MercadoIoannis Savidis
- Topics
- 3D IC and TSV technologies (19 papers)Electronic Packaging and Soldering Technologies (14 papers)Additive Manufacturing and 3D Printing Technologies (5 papers)
- Partner nations
- United StatesAustriaItaly
In The Last Decade
Scott Pozder
25 papers receiving 578 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 580
- Automotive Engineering 102
- Electronic, Optical and Magnetic Materials 71
- Mechanical Engineering 54
- Materials Chemistry 52
Countries citing papers authored by Scott Pozder
This map shows the geographic impact of Scott Pozder's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Scott Pozder with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Scott Pozder more than expected).
Fields of papers citing papers by Scott Pozder
This network shows the impact of papers produced by Scott Pozder. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Scott Pozder. The network helps show where Scott Pozder may publish in the future.
Co-authorship network of co-authors of Scott Pozder
This figure shows the co-authorship network connecting the top 25 collaborators of Scott Pozder. A scholar is included among the top collaborators of Scott Pozder based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Scott Pozder. Scott Pozder is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 58 | |
| 4 | 2 | |
| 5 | 14 | |
| 6 | 1 | |
| 7 | 17 | |
| 8 | 15 | |
| 9 | 65 | |
| 10 | 4 | |
| 11 | 137 | |
| 12 | 18 | |
| 13 | 27 | |
| 14 | 48 | |
| 15 | 1 | |
| 16 | 13 | |
| 17 | 35 | |
| 18 | 14 | |
| 19 | 69 | |
| 20 | 7 |
About Scott Pozder
Scott Pozder is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 25 papers that have together received 607 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (14 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (580 citations), Automotive Engineering (102 citations) and Hardware and Architecture (36 citations). Scott Pozder has collaborated with scholars based in United States, Austria and Italy. Frequent co-authors include Ankur Jain, Ritwik Chatterjee, Robert E. Jones, Robert E. Jones, Zhihong Huang, Syed M. Alam, Cindy Goldberg, L.L. Mercado, Ioannis Savidis and Chuan Seng Tan. Their work appears in journals such as Applied Physics Letters, RSC Advances and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.