Min-Bo Zhou

469 total citations
67 papers, 354 citations indexed

About

Min-Bo Zhou is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Min-Bo Zhou has authored 67 papers receiving a total of 354 indexed citations (citations by other indexed papers that have themselves been cited), including 61 papers in Electrical and Electronic Engineering, 28 papers in Mechanical Engineering and 12 papers in Biomedical Engineering. Recurrent topics in Min-Bo Zhou's work include Electronic Packaging and Soldering Technologies (52 papers), 3D IC and TSV technologies (35 papers) and Aluminum Alloys Composites Properties (13 papers). Min-Bo Zhou is often cited by papers focused on Electronic Packaging and Soldering Technologies (52 papers), 3D IC and TSV technologies (35 papers) and Aluminum Alloys Composites Properties (13 papers). Min-Bo Zhou collaborates with scholars based in China, United States and United Kingdom. Min-Bo Zhou's co-authors include Xin‐Ping Zhang, Chang-Bo Ke, Shuibao Liang, H. Qin, Xin-Ran Zhang, X.P. Zhang, Xiaofeng Fan, Zhongchao Wei, Q. Wang and Hongyun Meng and has published in prestigious journals such as Journal of Applied Physics, Optics Express and Journal of Applied Mechanics.

In The Last Decade

Min-Bo Zhou

60 papers receiving 341 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Min-Bo Zhou China 10 317 140 46 40 33 67 354
Chunjin Hang China 9 265 0.8× 207 1.5× 51 1.1× 19 0.5× 27 0.8× 22 317
Glenn Ross Finland 12 270 0.9× 121 0.9× 52 1.1× 103 2.6× 65 2.0× 41 366
T. Kirkpatrick United States 6 325 1.0× 167 1.2× 83 1.8× 57 1.4× 67 2.0× 9 381
Jan Kowal United Kingdom 7 219 0.7× 118 0.8× 37 0.8× 105 2.6× 41 1.2× 10 365
Keith Sweatman Australia 10 279 0.9× 230 1.6× 67 1.5× 39 1.0× 26 0.8× 26 362
Ryszard Kisiel Poland 11 404 1.3× 221 1.6× 42 0.9× 21 0.5× 30 0.9× 67 456
Jean-Marc Dedulle France 11 279 0.9× 104 0.7× 69 1.5× 23 0.6× 13 0.4× 23 341
Onnik Yaglioglu United States 10 195 0.6× 75 0.5× 120 2.6× 203 5.1× 34 1.0× 18 397
Ryohei Satoh Japan 10 320 1.0× 108 0.8× 74 1.6× 41 1.0× 44 1.3× 47 360
Cuong Huynh United States 10 278 0.9× 63 0.5× 35 0.8× 29 0.7× 13 0.4× 45 317

Countries citing papers authored by Min-Bo Zhou

Since Specialization
Citations

This map shows the geographic impact of Min-Bo Zhou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min-Bo Zhou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min-Bo Zhou more than expected).

Fields of papers citing papers by Min-Bo Zhou

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Min-Bo Zhou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min-Bo Zhou. The network helps show where Min-Bo Zhou may publish in the future.

Co-authorship network of co-authors of Min-Bo Zhou

This figure shows the co-authorship network connecting the top 25 collaborators of Min-Bo Zhou. A scholar is included among the top collaborators of Min-Bo Zhou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Min-Bo Zhou. Min-Bo Zhou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Xin‐Ping, et al.. (2024). Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria. IEEE Transactions on Device and Materials Reliability. 24(4). 498–506. 1 indexed citations
2.
3.
4.
5.
Huang, Haijun, et al.. (2022). Superb sinterability of the Cu paste consisting of bimodal size distribution Cu nanoparticles for low-temperature and pressureless sintering of large-area die attachment and the sintering mechanism. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2064–2070. 7 indexed citations
6.
Liang, Shuibao, Min-Bo Zhou, Chang-Bo Ke, Wei Cai, & X.P. Zhang. (2022). Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation. Microelectronics Reliability. 138. 114611–114611. 4 indexed citations
7.
8.
9.
Liang, Shuibao, et al.. (2019). Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress. Journal of materials research/Pratt's guide to venture capital sources. 34(16). 2775–2788. 11 indexed citations
10.
Ke, Chang-Bo, et al.. (2019). Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads. Journal of Materials Science Materials in Electronics. 30(16). 15184–15197. 16 indexed citations
11.
Meng, Hongyun, Xianjun Wang, Xiaofeng Fan, et al.. (2019). Graphene oxide-film-coated splitting ratio-adjustable Mach-Zehnder interferometer for relative humidity sensing. Optics Express. 27(6). 9232–9232. 25 indexed citations
12.
Liang, Shuibao, Chang-Bo Ke, Chunhua Wei, Min-Bo Zhou, & Xin‐Ping Zhang. (2019). Study of the Influence of Elastic Anisotropy of Cu on Thermo-Mechanical Behavior and Cu Protrusion of Through Silicon Vias Using Combined Phase Field and Finite Element Methods. IEEE Transactions on Device and Materials Reliability. 19(2). 322–332. 14 indexed citations
13.
14.
Liang, Shuibao, Chang-Bo Ke, Min-Bo Zhou, & Xin‐Ping Zhang. (2016). Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient. 953–957. 1 indexed citations
15.
Ma, Wenjing, Chang-Bo Ke, Min-Bo Zhou, Shuibao Liang, & Xin‐Ping Zhang. (2015). PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM. Acta Metallurgica Sinica. 51(7). 873–882. 5 indexed citations
16.
17.
18.
19.
Qin, H., Wangyun Li, Min-Bo Zhou, & X.P. Zhang. (2014). Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints. Microelectronics Reliability. 54(12). 2911–2921. 24 indexed citations
20.
Zhou, Min-Bo, et al.. (2000). Smooth Asymmetric Two-Dimensional Indentation of a Finite Elastic Beam. Journal of Applied Mechanics. 68(2). 357–360. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Chunjin Hang Breakdown of academic impact, for papers by Glenn Ross Breakdown of academic impact, for papers by T. Kirkpatrick Breakdown of academic impact, for papers by Jan Kowal Breakdown of academic impact, for papers by Keith Sweatman Breakdown of academic impact, for papers by Ryszard Kisiel Breakdown of academic impact, for papers by Jean-Marc Dedulle Breakdown of academic impact, for papers by Onnik Yaglioglu Breakdown of academic impact, for papers by Ryohei Satoh Breakdown of academic impact, for papers by Cuong Huynh
Rankless by CCL
2026