Min-Bo Zhou
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Fiber Optic Sensors
- Photonic and Optical Devices
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 95
- 3D IC and TSV technologies 60
- Nanomaterials and Printing Technologies 12
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- Aluminum Alloys Composites Properties 20
- Advanced Welding Techniques Analysis 19
- Co-authors
- Xin‐Ping Zhang (85 shared papers)Chang-Bo Ke (32 shared papers)Jiaqiang Huang (10 shared papers)H. Qin (13 shared papers)Haijun Huang (9 shared papers)Xin-Ran Zhang (4 shared papers)Wangyun Li (6 shared papers)Xiao Ma (16 shared papers)
- Journals
- IEEE Transactions on Device and Materials Reliability (3 papers)Journal of Materials Science Materials in Electronics (3 papers)Microelectronics Reliability (3 papers)Journal of Electronic Materials (2 papers)Transactions of Nonferrous Metals Society of China (2 papers)
- Partner nations
- ChinaUnited StatesUnited Kingdom
In The Last Decade
Min-Bo Zhou
108 papers receiving 519 citations
Peers
Comparison fields: 5 of 38
- Electrical and Electronic Engineering 465
- Mechanical Engineering 211
- Bioengineering 18
- General Materials Science 9
- Electronic, Optical and Magnetic Materials 49
Countries citing papers authored by Min-Bo Zhou
This map shows the geographic impact of Min-Bo Zhou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min-Bo Zhou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min-Bo Zhou more than expected).
Fields of papers citing papers by Min-Bo Zhou
This network shows the impact of papers produced by Min-Bo Zhou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min-Bo Zhou. The network helps show where Min-Bo Zhou may publish in the future.
Co-authors
The 25 scholars most cited alongside Min-Bo Zhou, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 117 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 61 | |
| 2 | 2021 | 32 | |
| 3 | 2019 | 25 | |
| 4 | 2014 | 25 | |
| 5 | 2019 | 17 | |
| 6 | 2018 | 14 | |
| 7 | 2019 | 14 | |
| 8 | 2019 | 11 | |
| 9 | 2017 | 11 | |
| 10 | 2014 | 11 | |
| 11 | 2011 | 11 | |
| 12 | 2018 | 9 | |
| 13 | 2016 | 9 | |
| 14 | 2012 | 9 | |
| 15 | 2020 | 8 | |
| 16 | 2017 | 8 | |
| 17 | 2022 | 8 | |
| 18 | 2022 | 8 | |
| 19 | 2021 | 7 | |
| 20 | 2016 | 7 |
About Min-Bo Zhou
Min-Bo Zhou is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 117 papers that have together received 532 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (60 papers), Aluminum Alloys Composites Properties (20 papers), Advanced Welding Techniques Analysis (19 papers), Copper Interconnects and Reliability (17 papers), Aluminum Alloy Microstructure Properties (16 papers), Nanomaterials and Printing Technologies (12 papers) and Advanced Sensor and Energy Harvesting Materials (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (465 citations), Mechanical Engineering (211 citations), Bioengineering (18 citations), General Materials Science (9 citations) and Electronic, Optical and Magnetic Materials (49 citations). Min-Bo Zhou has collaborated with scholars based in China, United States and United Kingdom. Frequent co-authors include Xin‐Ping Zhang, Chang-Bo Ke, Jiaqiang Huang, H. Qin, Haijun Huang, Xin-Ran Zhang, Wangyun Li, Xiao Ma, Xinping Zhang and Xiaofeng Fan. Their work appears in journals such as IEEE Transactions on Device and Materials Reliability, Journal of Materials Science Materials in Electronics, Microelectronics Reliability, Journal of Electronic Materials and Transactions of Nonferrous Metals Society of China.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.