L. Shi
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- Semiconductor materials and devices 6
- Radio Frequency Integrated Circuit Design 5
- Advancements in Semiconductor Devices and Circuit Design 5
- 3D IC and TSV technologies 4
- Electronic Packaging and Soldering Technologies 3
- Photonic and Optical Devices 2
- Microwave Engineering and Waveguides 2
- Advancements in PLL and VCO Technologies 2
L. Shi
13 papers receiving 489 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 487
- Automotive Engineering 32
- Biomedical Engineering 112
- Hardware and Architecture 11
- Atomic and Molecular Physics, and Optics 46
Countries citing papers authored by L. Shi
This map shows the geographic impact of L. Shi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L. Shi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L. Shi more than expected).
Fields of papers citing papers by L. Shi
This network shows the impact of papers produced by L. Shi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L. Shi. The network helps show where L. Shi may publish in the future.
Co-authorship network
The 25 scholars most cited alongside L. Shi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 5 | |
| 2 | 2010 | 3 | |
| 3 | 2008 | 139 | |
| 4 | Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding | 2006 | 5 |
| 5 | 2006 | 123 | |
| 6 | 2004 | 103 | |
| 7 | 2004 | 22 | |
| 8 | 2003 | 4 | |
| 9 | 2002 | 31 | |
| 10 | 2002 | 29 | |
| 11 | 2001 | 10 | |
| 12 | 2000 | 20 | |
| 13 | 1997 | 18 |
About L. Shi
L. Shi is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics and Biomedical Engineering, having authored 13 papers that have together received 512 indexed citations. Recurring topics across this work include Semiconductor materials and devices (6 papers), Radio Frequency Integrated Circuit Design (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (3 papers), Photonic and Optical Devices (2 papers), Microwave Engineering and Waveguides (2 papers) and Advancements in PLL and VCO Technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (487 citations), Automotive Engineering (32 citations), Biomedical Engineering (112 citations), Hardware and Architecture (11 citations) and Atomic and Molecular Physics, and Optics (46 citations). L. Shi has collaborated with scholars based in United States and China. Frequent co-authors include Steven J. Koester, K. Chan, J. A. Ott, M. Ieong, R. Yu, Kuan‐Neng Chen, Douglas Charles La Tulipe, Anthony Young, E. Sprogis and S. Purushothaman. Their work appears in journals such as Optics & Laser Technology, Journal of Electronic Materials, IEEE Electron Device Letters, IBM Journal of Research and Development and Electronics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.