Kuan‐Neng Chen
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Automotive Engineering top 1%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Additive Manufacturing and 3D Printing Technologies 61
-
- 3D IC and TSV technologies 202
- Electronic Packaging and Soldering Technologies 163
- Semiconductor materials and devices 36
- Advanced Memory and Neural Computing 15
- Journals
- IEEE Electron Device Letters (25 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (15 papers)IEEE Transactions on Electron Devices (15 papers)IEEE Journal of the Electron Devices Society (10 papers)Journal of Nanoscience and Nanotechnology (9 papers)
- Partner nations
- TaiwanUnited StatesJapan
In The Last Decade
Kuan‐Neng Chen
236 papers receiving 4.1k citations
Peers
Comparison fields: 5 of 93
- Electrical and Electronic Engineering 3.9k
- Automotive Engineering 676
- Electronic, Optical and Magnetic Materials 1.0k
- Hardware and Architecture 111
- Biomedical Engineering 669
Countries citing papers authored by Kuan‐Neng Chen
This map shows the geographic impact of Kuan‐Neng Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kuan‐Neng Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kuan‐Neng Chen more than expected).
Fields of papers citing papers by Kuan‐Neng Chen
This network shows the impact of papers produced by Kuan‐Neng Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kuan‐Neng Chen. The network helps show where Kuan‐Neng Chen may publish in the future.
Co-authors
The 25 scholars most cited alongside Kuan‐Neng Chen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 0 | |
| 3 | 2025 | 0 | |
| 4 | 2025 | 1 | |
| 5 | 2024 | 0 | |
| 6 | 2024 | 0 | |
| 7 | 2024 | 2 | |
| 8 | 2024 | 1 | |
| 9 | 2024 | 2 | |
| 10 | 2024 | 1 | |
| 11 | 2023 | 21 | |
| 12 | 2023 | 13 | |
| 13 | 2022 | 1 | |
| 14 | 2021 | 1 | |
| 15 | 2019 | 23 | |
| 16 | 2019 | 3 | |
| 17 | 2018 | 11 | |
| 18 | 2015 | 79 | |
| 19 | 2015 | 191 | |
| 20 | 2010 | 4 |
About Kuan‐Neng Chen
Kuan‐Neng Chen is a scholar working on Automotive Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Polymers and Plastics and Biomedical Engineering, having authored 253 papers that have together received 4.3k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (202 papers), Electronic Packaging and Soldering Technologies (163 papers), Additive Manufacturing and 3D Printing Technologies (61 papers), Copper Interconnects and Reliability (48 papers), Semiconductor materials and devices (36 papers), Nanofabrication and Lithography Techniques (24 papers), Advanced Memory and Neural Computing (15 papers) and Synthesis and properties of polymers (14 papers). The work is most often cited by research in Electrical and Electronic Engineering (3.9k citations), Automotive Engineering (676 citations), Electronic, Optical and Magnetic Materials (1.0k citations), Hardware and Architecture (111 citations) and Biomedical Engineering (669 citations). Kuan‐Neng Chen has collaborated with scholars based in Taiwan, United States and Japan. Frequent co-authors include R. Reif, Andy Fan, Chuan Seng Tan, Cheng-Ta Ko, Hanwen Hu, K. N. Tu, Chih Chen, Asisa Kumar Panigrahy, L. Krusin‐Elbaum and Shamik Das. Their work appears in journals such as IEEE Electron Device Letters, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electron Devices, IEEE Journal of the Electron Devices Society and Journal of Nanoscience and Nanotechnology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.