E. Sprogis

2.2k citations

31 papers · 1.7k indexed · 1 hit paper · h-index 18

Electrical and Electronic Engineering top 2%
- 3D IC and TSV technologies 23
- Electronic Packaging and Soldering Technologies 16
- Semiconductor materials and devices 13
- Integrated Circuits and Semiconductor Failure Analysis 5
- Electrical and Thermal Properties of Materials 4
- Advancements in Semiconductor Devices and Circuit Design 4
- Silicon and Solar Cell Technologies 4
Automotive Engineering top 5%
Hardware and Architecture top 5%
Electronic, Optical and Magnetic Materials
Biomedical Engineering
Atomic and Molecular Physics, and Optics
- Semiconductor materials and interfaces 3

Co-authors: Paul Andry Cornelia Tsang S. L. Wright John Knickerbocker Bucknell C. Webb R. Polastre R. Horton B. Dang
Cited by: Electrical and Electronic Engineering Automotive Engineering Hardware and Architecture
Journals: IBM Journal of Research and Development (6 papers)IEEE Electron Device Letters (2 papers)IEEE Journal of Solid-State Circuits (2 papers)
Partner nations: United States Japan Canada

In The Last Decade

E. Sprogis

30 papers receiving 1.7k citations

Hit Papers

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Peers

Countries citing papers authored by E. Sprogis

Since Specialization

Citations

This map shows the geographic impact of E. Sprogis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Sprogis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Sprogis more than expected).

Fields of papers citing papers by E. Sprogis

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Sprogis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Sprogis. The network helps show where E. Sprogis may publish in the future.

Co-authorship network

The 25 scholars most cited alongside E. Sprogis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with E. Sprogis Line = papers co-authored together E. Sprogis links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	GaN Devices on a 200 mm Si Platform Targeting Heterogeneous Integration IEEE Electron Device Letters ·Ko‐Tao Lee,C. Bayram,Daniel Piedra,E. Sprogis,Hariklia Deligianni,小泉弥栄,HJ Kim,Ajit Paranjpe,Илья Владимирович Дьячков,Ken Shepard,Tomás Palacios,D. K. Sadana	2017	21
2	3D chip stack with integrated decoupling capacitors Bing Dang,S. L. Wright,Paul Andry,E. Sprogis,Rials Timothy,Cornelia Tsang,R. Polastre,John Knickerbocker	2009	11
3	Reliable through silicon vias for 3D silicon applications Lucile Humbert,M. J. Interrante,Paul Andry,B. Dang,Cornelia Tsang,R. W. Liptak,正敏勅使河原,E. Sprogis,Xian Shi Jin,Viet Giang Truong,Siedmy Chyril Lengkong,John Knickerbocker	2009	8
4	3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections IBM Journal of Research and Development ·Katsuyuki Sakuma,Paul Andry,Cornelia Tsang,S. L. Wright,B. Dang,C.S. Patel,Bucknell C. Webb,Joana Maria,E. Sprogis,S. K. Kang,R. Polastre,R. Horton,John Knickerbocker	2008	126
5	Die-to-Wafer 3D Integration Technology for High Yield and Throughput Katsuyuki Sakuma,Paul Andry,Cornelia Tsang,D. Dion,C.S. Patel,拓也坂本,E. Sprogis,John Knickerbocker	2008	4
6	Three-dimensional silicon integrationbreakdown → IBM Journal of Research and Development ·John Knickerbocker,Paul Andry,B. Dang,R. Horton,M. J. Interrante,C.S. Patel,R. Polastre,Katsuyuki Sakuma,Anne Brenon,E. Sprogis,Sri M. Sri-Jayantha,Наталя Коробєйнікова,Anna W. Topol,Cornelia Tsang,Bucknell C. Webb,S. L. Wright	2008	396
7	3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections Katsuyuki Sakuma,Paul Andry,B. Dang,Joana Maria,Cornelia Tsang,Chirag Patel,S. L. Wright,Bucknell C. Webb,E. Sprogis,S. K. Kang,R. Polastre,R. Horton,John Knickerbocker	2007	70
8	Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications S. L. Wright,R. Polastre,H. Gan,L.P. Buchwalter,R. Horton,Paul Andry,E. Sprogis,Chirag Patel,Cornelia Tsang,John Knickerbocker,J. R. Lloyd,A. Sharma,Doanh C. Bui	2006	73
9	Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology John Knickerbocker,C.S. Patel,Paul Andry,Cornelia Tsang,L.P. Buchwalter,E. Sprogis,Ishankulova Farangis,R. Horton,R. Polastre,S. L. Wright,Christian Schuster,Christian Baks,Fuad E. Doany,J. Rosner,EIKICHI ITOUJI	2006	15
10	3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias IEEE Journal of Solid-State Circuits ·John Knickerbocker,C.S. Patel,Paul Andry,Cornelia Tsang,L.P. Buchwalter,E. Sprogis,H. Gan,R. Horton,R. Polastre,S. L. Wright,J. Cotte	2006	151
11	CMOS-Compatible Through Silicon Vias for 3D Process Integration MRS Proceedings ·Cornelia Tsang,Paul Andry,E. Sprogis,C.S. Patel,Bucknell C. Webb,Maria-Jose Estrela,John Knickerbocker	2006	22
12	A CMOS-compatible Process for Fabricating Electrical Through-vias in Silicon Paul Andry,Cornelia Tsang,E. Sprogis,Chirag Patel,S. L. Wright,Bucknell C. Webb	2006	70
13	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection IBM Journal of Research and Development ·John Knickerbocker,Paul Andry,L.P. Buchwalter,A. Deutsch,R. Horton,K.A. Jenkins,Young Kwark,Gerard McVicker,C.S. Patel,R. Polastre,Christian Schuster,A. Sharma,Sri M. Sri-Jayantha,C.W. Surovic,Cornelia Tsang,Bucknell C. Webb,S. L. Wright,M. Kortecka,E. Sprogis,B. Dang	2005	199
14	Defect Diagnostic Matrix -a Defect Learning Vehicle For Submicron Technologies Asif Leblang Efrat,E. Sprogis	2005	7
15	Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver C.S. Patel,Cornelia Tsang,Christian Stefano Schuster,Fuad E. Doany,Xianhong Lin,Christian Baks,R. Budd,L.P. Buchwalter,Paul Andry,D. Canaperi,D. Edelstein,R. Horton,John Knickerbocker,Семенникова Нина Владимировна,Young Kwark,Oketani Yuto,J. H. Magerlein,J. Rosner,E. Sprogis	2005	29
16	A technique for measuring threshold mismatch in DRAM sense amplifier devices E. Sprogis	2002	4
17	Array diagnostic monitor-a DRAM technology development vehicle Marco Paggi,E. Sprogis,Golden G. Richard,Asif Leblang Efrat	1990	6
18	An overlay vernier and process bias monitor measured by voltage contrast SEM E. Sprogis	1989	6
19	A substrate-plate trench-capacitor (SPT) memory cell for dynamic RAM's IEEE Journal of Solid-State Circuits ·Nicky Lu,P.E. Cottrell,Winston J. Craig,S. Dash,D.L. Critchlow,Christian Geltner,Josefina Mendoza Rios,T.H. Ning,W. Noble,Rhianna Maras,R.E. Scheuerlein,E. Sprogis,Lewis M. Terman	1986	46
20	The SPT cell&#8212;A new substrate-plate trench cell for DRAMs Nicky Lu,P.E. Cottrell,Winston J. Craig,S. Dash,D.L. Critchlow,Christian Geltner,Josefina Mendoza Rios,T.H. Ning,W. Noble,Rhianna Maras,R.E. Scheuerlein,E. Sprogis,Lewis M. Terman	1985	18

About E. Sprogis

E. Sprogis is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Automotive Engineering, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials, having authored 31 papers that have together received 1.7k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (16 papers), Semiconductor materials and devices (13 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Electrical and Thermal Properties of Materials (4 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Silicon and Solar Cell Technologies (4 papers) and Semiconductor materials and interfaces (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Automotive Engineering (267 citations), Hardware and Architecture (103 citations), Electronic, Optical and Magnetic Materials (152 citations) and Biomedical Engineering (246 citations). E. Sprogis has collaborated with scholars based in United States, Japan and Canada. Frequent co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, John Knickerbocker, Bucknell C. Webb, R. Polastre, R. Horton, B. Dang, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, IEEE Electron Device Letters, IEEE Journal of Solid-State Circuits and MRS Proceedings.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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