E. Sprogis

2.2k total citations · 1 hit paper
31 papers, 1.7k citations indexed

About

E. Sprogis is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Automotive Engineering. According to data from OpenAlex, E. Sprogis has authored 31 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 4 papers in Atomic and Molecular Physics, and Optics and 3 papers in Automotive Engineering. Recurrent topics in E. Sprogis's work include 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (13 papers). E. Sprogis is often cited by papers focused on 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (13 papers). E. Sprogis collaborates with scholars based in United States, Japan and Canada. E. Sprogis's co-authors include Paul Andry, Cornelia Tsang, S. L. Wright, John Knickerbocker, Bucknell C. Webb, R. Polastre, R. Horton, B. Dang, C.S. Patel and Katsuyuki Sakuma and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IEEE Electron Device Letters and IBM Journal of Research and Development.

In The Last Decade

E. Sprogis

30 papers receiving 1.7k citations

Hit Papers

Three-dimensional silicon integration 2008 2026 2014 2020 2008 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Three-dimensional silicon integration
    2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
E. Sprogis United States 18 1.7k 267 246 153 152 31 1.7k
B. Dang United States 17 1.4k 0.8× 250 0.9× 230 0.9× 112 0.7× 114 0.8× 29 1.5k
R. Horton United States 17 1.5k 0.9× 225 0.8× 228 0.9× 161 1.1× 128 0.8× 31 1.6k
Cornelia Tsang United States 26 2.2k 1.3× 377 1.4× 360 1.5× 167 1.1× 166 1.1× 51 2.4k
Paul Andry United States 28 2.4k 1.5× 405 1.5× 382 1.6× 182 1.2× 210 1.4× 64 2.6k
Anna W. Topol United States 11 1.6k 0.9× 149 0.6× 208 0.8× 116 0.8× 105 0.7× 24 1.7k
R. Polastre United States 21 1.8k 1.1× 286 1.1× 339 1.4× 139 0.9× 158 1.0× 42 2.2k
Michele Stucchi Belgium 22 2.3k 1.4× 195 0.7× 241 1.0× 232 1.5× 365 2.4× 132 2.4k
Anne Jourdain Belgium 24 1.4k 0.9× 179 0.7× 451 1.8× 126 0.8× 86 0.6× 114 1.5k
S.J. Souri United States 10 1.4k 0.8× 89 0.3× 153 0.6× 65 0.4× 123 0.8× 13 1.4k
N. Sillon France 19 895 0.5× 179 0.7× 234 1.0× 59 0.4× 52 0.3× 71 968

Countries citing papers authored by E. Sprogis

Since Specialization
Citations

This map shows the geographic impact of E. Sprogis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Sprogis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Sprogis more than expected).

Fields of papers citing papers by E. Sprogis

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Sprogis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Sprogis. The network helps show where E. Sprogis may publish in the future.

Co-authorship network of co-authors of E. Sprogis

This figure shows the co-authorship network connecting the top 25 collaborators of E. Sprogis. A scholar is included among the top collaborators of E. Sprogis based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. Sprogis. E. Sprogis is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lee, Ko‐Tao, C. Bayram, Daniel Piedra, et al.. (2017). GaN Devices on a 200 mm Si Platform Targeting Heterogeneous Integration. IEEE Electron Device Letters. 38(8). 1094–1096. 21 indexed citations
2.
Dang, Bing, S. L. Wright, Paul Andry, et al.. (2009). 3D chip stack with integrated decoupling capacitors. 1–5. 11 indexed citations
3.
Interrante, M. J., Paul Andry, B. Dang, et al.. (2009). Reliable through silicon vias for 3D silicon applications. 63–66. 8 indexed citations
4.
Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development. 52(6). 611–622. 126 indexed citations
5.
Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). Die-to-Wafer 3D Integration Technology for High Yield and Throughput. 4 indexed citations
6.
Knickerbocker, John, Paul Andry, B. Dang, et al.. (2008). Three-dimensional silicon integration. IBM Journal of Research and Development. 52(6). 553–569. 396 indexed citations breakdown →
7.
Sakuma, Katsuyuki, Paul Andry, B. Dang, et al.. (2007). 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections. 627–632. 70 indexed citations
8.
Wright, S. L., R. Polastre, H. Gan, et al.. (2006). Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications. 633–640. 73 indexed citations
9.
Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. 43. 654–657. 15 indexed citations
10.
Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE Journal of Solid-State Circuits. 41(8). 1718–1725. 151 indexed citations
11.
Tsang, Cornelia, Paul Andry, E. Sprogis, et al.. (2006). CMOS-Compatible Through Silicon Vias for 3D Process Integration. MRS Proceedings. 970. 22 indexed citations
12.
Andry, Paul, Cornelia Tsang, E. Sprogis, et al.. (2006). A CMOS-compatible Process for Fabricating Electrical Through-vias in Silicon. 831–837. 70 indexed citations
13.
Knickerbocker, John, Paul Andry, L.P. Buchwalter, et al.. (2005). Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM Journal of Research and Development. 49(4.5). 725–753. 199 indexed citations
14.
Sprogis, E., et al.. (2005). Defect Diagnostic Matrix -a Defect Learning Vehicle For Submicron Technologies. 103–106. 7 indexed citations
15.
Patel, C.S., Cornelia Tsang, Christian Stefano Schuster, et al.. (2005). Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver. 2. 1318–1324. 29 indexed citations
16.
Sprogis, E.. (2002). A technique for measuring threshold mismatch in DRAM sense amplifier devices. 103–106. 4 indexed citations
17.
Paggi, Marco, et al.. (1990). Array diagnostic monitor-a DRAM technology development vehicle. 163–167. 6 indexed citations
18.
Sprogis, E.. (1989). An overlay vernier and process bias monitor measured by voltage contrast SEM. 129–131. 6 indexed citations
19.
Lu, Nicky, P.E. Cottrell, Winston J. Craig, et al.. (1986). A substrate-plate trench-capacitor (SPT) memory cell for dynamic RAM's. IEEE Journal of Solid-State Circuits. 21(5). 627–634. 46 indexed citations
20.
Lu, Nicky, P.E. Cottrell, Winston J. Craig, et al.. (1985). The SPT cell—A new substrate-plate trench cell for DRAMs. 771–772. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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