E Perfecto
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
Papers in ⓘ
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- 3D IC and TSV technologies 40
- Electronic Packaging and Soldering Technologies 37
- Integrated Circuits and Semiconductor Failure Analysis 6
- Semiconductor materials and devices 5
- VLSI and FPGA Design Techniques 4
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- Copper Interconnects and Reliability 12
- Co-authors
- K. Prasad (3 shared papers)Jae-Woong Nah (3 shared papers)Anupam Giri (3 shared papers)E. J. Cotts (5 shared papers)Minhua Lu (5 shared papers)G. Edward White (5 shared papers)Babak Arfaei (4 shared papers)Katsuyuki Sakuma (3 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)IBM Journal of Research and Development (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (4 papers)IEEE Transactions on Components Hybrids and Manufacturing Technology (1 paper)Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) (1 paper)
- Partner nations
- United StatesCanadaJapan
In The Last Decade
E Perfecto
40 papers receiving 239 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 222
- Hardware and Architecture 18
- Polymers and Plastics 24
- Mechanical Engineering 60
- Electronic, Optical and Magnetic Materials 27
Countries citing papers authored by E Perfecto
This map shows the geographic impact of E Perfecto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E Perfecto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E Perfecto more than expected).
Fields of papers citing papers by E Perfecto
This network shows the impact of papers produced by E Perfecto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E Perfecto. The network helps show where E Perfecto may publish in the future.
Co-authors
The 25 scholars most cited alongside E Perfecto, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 48 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1994 | 25 | |
| 2 | 2014 | 21 | |
| 3 | 1994 | 18 | |
| 4 | 2012 | 15 | |
| 5 | 1998 | 15 | |
| 6 | 2012 | 14 | |
| 7 | 2008 | 13 | |
| 8 | 2008 | 13 | |
| 9 | 2008 | 11 | |
| 10 | 1995 | 9 | |
| 11 | 2012 | 9 | |
| 12 | 2006 | 9 | |
| 13 | 2007 | 9 | |
| 14 | 2014 | 7 | |
| 15 | Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding | 2006 | 5 |
| 16 | 2007 | 5 | |
| 17 | 1999 | 4 | |
| 18 | 2014 | 4 | |
| 19 | 2002 | 4 | |
| 20 | 1998 | 4 |
About E Perfecto
E Perfecto is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering, Automotive Engineering and Hardware and Architecture, having authored 48 papers that have together received 257 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (40 papers), Electronic Packaging and Soldering Technologies (37 papers), Copper Interconnects and Reliability (12 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Semiconductor materials and devices (5 papers), VLSI and FPGA Design Techniques (4 papers) and Advanced Welding Techniques Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (222 citations), Hardware and Architecture (18 citations), Polymers and Plastics (24 citations), Mechanical Engineering (60 citations) and Electronic, Optical and Magnetic Materials (27 citations). E Perfecto has collaborated with scholars based in United States, Canada and Japan. Frequent co-authors include K. Prasad, Jae-Woong Nah, Anupam Giri, E. J. Cotts, Minhua Lu, G. Edward White, Babak Arfaei, Katsuyuki Sakuma, Julien Sylvestre and G. Arjavalingam. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, IEEE Transactions on Components Hybrids and Manufacturing Technology and Additional Conferences (Device Packaging HiTEC HiTEN & CICMT).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.