E Perfecto

558 total citations
48 papers, 257 citations indexed

About

E Perfecto is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, E Perfecto has authored 48 papers receiving a total of 257 indexed citations (citations by other indexed papers that have themselves been cited), including 47 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanical Engineering. Recurrent topics in E Perfecto's work include 3D IC and TSV technologies (40 papers), Electronic Packaging and Soldering Technologies (37 papers) and Copper Interconnects and Reliability (12 papers). E Perfecto is often cited by papers focused on 3D IC and TSV technologies (40 papers), Electronic Packaging and Soldering Technologies (37 papers) and Copper Interconnects and Reliability (12 papers). E Perfecto collaborates with scholars based in United States, Canada and Japan. E Perfecto's co-authors include K. Prasad, Jae-Woong Nah, Anupam Giri, G. Edward White, E. J. Cotts, Minhua Lu, Katsuyuki Sakuma, Julien Sylvestre, Babak Arfaei and M. McAllister and has published in prestigious journals such as IBM Journal of Research and Development, IEEE Transactions on Advanced Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology Part B.

In The Last Decade

E Perfecto

40 papers receiving 239 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
E Perfecto United States 10 222 60 27 24 20 48 257
Chih-Pin Hung Taiwan 11 268 1.2× 44 0.7× 32 1.2× 7 0.3× 25 1.3× 50 291
V. Bader Germany 11 280 1.3× 59 1.0× 27 1.0× 18 0.8× 42 2.1× 34 327
Chong Ser Choong Singapore 10 340 1.5× 36 0.6× 48 1.8× 10 0.4× 64 3.2× 47 375
R. Kahle Germany 13 312 1.4× 50 0.8× 36 1.3× 13 0.5× 63 3.1× 35 372
Jie Xue United States 9 284 1.3× 84 1.4× 20 0.7× 4 0.2× 24 1.2× 37 308
Kazushige Toriyama Japan 10 321 1.4× 96 1.6× 42 1.6× 6 0.3× 40 2.0× 32 335
Vempati Srinivasa Rao Singapore 10 288 1.3× 59 1.0× 72 2.7× 6 0.3× 30 1.5× 42 330
Sayuri Kohara Japan 9 279 1.3× 53 0.9× 31 1.1× 6 0.3× 64 3.2× 52 310
C. T. Wang Taiwan 10 338 1.5× 19 0.3× 37 1.4× 14 0.6× 62 3.1× 13 379
Jiefeng Xu United States 14 328 1.5× 117 1.9× 32 1.2× 8 0.3× 36 1.8× 24 382

Countries citing papers authored by E Perfecto

Since Specialization
Citations

This map shows the geographic impact of E Perfecto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E Perfecto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E Perfecto more than expected).

Fields of papers citing papers by E Perfecto

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E Perfecto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E Perfecto. The network helps show where E Perfecto may publish in the future.

Co-authorship network of co-authors of E Perfecto

This figure shows the co-authorship network connecting the top 25 collaborators of E Perfecto. A scholar is included among the top collaborators of E Perfecto based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E Perfecto. E Perfecto is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Sakuma, Katsuyuki, Xiaohu Liu, John Knickerbocker, et al.. (2016). Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections. 21. 329–335. 3 indexed citations
2.
3.
Nah, Jae-Woong, Jeffrey D. Gelorme, Paul Lauro, et al.. (2014). Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility. 1308–1313. 21 indexed citations
4.
Perfecto, E, et al.. (2014). Automated inspection and metrology for 2.5D and 3D/TSV process assurance. 1606–1609. 1 indexed citations
5.
Arvin, Charles, et al.. (2014). Optimization of Lead Free Plating for Flip Chip Applications. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(DPC). 1553–1602.
6.
Nah, Jae-Woong, Michael Gaynes, E Perfecto, & Claudius Feger. (2012). Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates. 1233–1238. 9 indexed citations
7.
Arvin, Charles, et al.. (2012). Solder Void Formation in Lead Free Solder. ECS Meeting Abstracts. MA2012-01(27). 1033–1033. 1 indexed citations
8.
Arfaei, Babak, et al.. (2012). The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry. 703–709. 14 indexed citations
9.
Perfecto, E, et al.. (2008). C4NP technology: Manufacturability, yields and reliability. 20. 1641–1647. 13 indexed citations
10.
11.
Shih, Da‐Yuan, B. Dang, Minhua Lu, et al.. (2008). C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications. 1–7. 3 indexed citations
12.
Perfecto, E, et al.. (2007). Development and Implementation of C4NP Technology for 300 mm Wafers. 9. 878–884. 5 indexed citations
13.
Yu, R., R. Polastre, L. Shi, et al.. (2006). Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding. Symposium on VLSI Technology. 170–171. 5 indexed citations
14.
15.
White, G. Edward, et al.. (2005). Large Format Fabrication a Practical Approach to Low Cost MCM-D. 86–93.
16.
Shih, Da‐Yuan, C. Narayan, John E. Lewis, et al.. (2003). Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures. 1002–1014. 2 indexed citations
17.
Perfecto, E, et al.. (2000). MCM-D/C packaging solution for IBM latest S/390 servers. IEEE Transactions on Advanced Packaging. 23(3). 515–520. 3 indexed citations
18.
Perfecto, E, et al.. (1999). Evolution of engineering change and repair technology in high performance multichip modules at IBM. IEEE Transactions on Advanced Packaging. 22(2). 129–135. 4 indexed citations
19.
Perfecto, E, et al.. (1995). Improving Wireability on Non-Planar Structures for the Next MCM-D Generation. 2575. 209. 1 indexed citations
20.
White, G. Edward, et al.. (1995). Large format fabrication-a practical approach to low cost MCM-D. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 18(1). 37–41. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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