Shari Farrens

413 total citations
27 papers, 310 citations indexed

About

Shari Farrens is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Shari Farrens has authored 27 papers receiving a total of 310 indexed citations (citations by other indexed papers that have themselves been cited), including 27 papers in Electrical and Electronic Engineering, 10 papers in Automotive Engineering and 8 papers in Biomedical Engineering. Recurrent topics in Shari Farrens's work include 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (17 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Shari Farrens is often cited by papers focused on 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (17 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Shari Farrens collaborates with scholars based in United States, Austria and Japan. Shari Farrens's co-authors include B. Roberds, James Dekker, Charles E. Hunt, R.W. Bower, T. Glinsner, Viorel Drăgoi, Paul Lindner, H. Shinohara, James Xie and T. Suzuki and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Electronic Materials and ECS Transactions.

In The Last Decade

Shari Farrens

24 papers receiving 290 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Shari Farrens United States 10 266 102 42 24 21 27 310
Tony Rogers United Kingdom 6 249 0.9× 116 1.1× 13 0.3× 40 1.7× 26 1.2× 14 293
T. Sato Japan 9 305 1.1× 111 1.1× 40 1.0× 74 3.1× 41 2.0× 18 367
N. Bresson France 11 341 1.3× 47 0.5× 37 0.9× 47 2.0× 36 1.7× 36 365
E.B. Liao Singapore 14 465 1.7× 157 1.5× 80 1.9× 34 1.4× 41 2.0× 35 530
Kenya Kikuchi Japan 3 318 1.2× 70 0.7× 37 0.9× 73 3.0× 39 1.9× 3 346
Rozalia Beica United States 8 305 1.1× 60 0.6× 38 0.9× 27 1.1× 21 1.0× 25 321
Loïc Sanchez France 11 280 1.1× 68 0.7× 21 0.5× 75 3.1× 46 2.2× 24 303
Samuel Suhard Belgium 12 268 1.0× 95 0.9× 55 1.3× 9 0.4× 42 2.0× 48 355
Roy Knechtel Germany 7 227 0.9× 91 0.9× 21 0.5× 23 1.0× 23 1.1× 34 277
Jang‐Hi Im United States 9 419 1.6× 106 1.0× 49 1.2× 40 1.7× 25 1.2× 16 448

Countries citing papers authored by Shari Farrens

Since Specialization
Citations

This map shows the geographic impact of Shari Farrens's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shari Farrens with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shari Farrens more than expected).

Fields of papers citing papers by Shari Farrens

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shari Farrens. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shari Farrens. The network helps show where Shari Farrens may publish in the future.

Co-authorship network of co-authors of Shari Farrens

This figure shows the co-authorship network connecting the top 25 collaborators of Shari Farrens. A scholar is included among the top collaborators of Shari Farrens based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shari Farrens. Shari Farrens is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Farrens, Shari, et al.. (2010). Metal Surface Preparation for Wafer Bonding with Point of Use Wet Chemistries. ECS Transactions. 33(4). 17–26. 6 indexed citations
2.
Farrens, Shari, et al.. (2010). AuSi Eutectic System: A Study in Hermetic MEMS Wafer Level Packaging. ECS Meeting Abstracts. MA2010-02(27). 1718–1718.
3.
Farrens, Shari, et al.. (2010). Thin Wafer Handling Challenges and Emerging Solutions. ECS Transactions. 27(1). 801–806. 9 indexed citations
4.
Farrens, Shari, et al.. (2010). Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging. ECS Transactions. 33(4). 93–101. 16 indexed citations
5.
Farrens, Shari. (2008). Wafer and Die Bonding Technologies for 3D Integration. 11 indexed citations
6.
Farrens, Shari. (2006). Vertical Integration: A Confederacy of Alignment, Bonding, and Materials Technologies. MRS Proceedings. 970. 2 indexed citations
7.
Farrens, Shari, et al.. (2006). Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies. ECS Transactions. 3(6). 175–180. 2 indexed citations
8.
Mizuno, Jun, Shari Farrens, Viorel Drăgoi, et al.. (2006). CYCLO-OLEFIN POLYMER DIRECT BONDING USING LOW TEMPERATURE PLASMA ACTIVATION BONDING. 346–352. 6 indexed citations
9.
Glinsner, T., et al.. (2006). New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications. Journal of Physics Conference Series. 34. 65–71. 17 indexed citations
10.
Drăgoi, Viorel, et al.. (2005). Low temperature wafer bonding for microsystems applications. 1. 199–202. 2 indexed citations
11.
Mizuno, J., Hiroyasu Ishida, Shari Farrens, et al.. (2005). Cyclo-Olefin polymer direct bonding using low temperature plasma activation bonding. 2. 1346–1349. 22 indexed citations
12.
Drăgoi, Viorel, Shari Farrens, & Paul Lindner. (2005). <title>Plasma activated wafer bonding for MEMS</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5836. 179–187. 6 indexed citations
13.
Farrens, Shari, et al.. (2003). Beginning-to-end wafer bonding for advanced optical systems. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5177. 31–31. 2 indexed citations
14.
Drăgoi, Viorel, Paul Lindner, T. Glinsner, Markus Wimplinger, & Shari Farrens. (2003). Advanced Anodic Bonding Processes For MEMS Applications. MRS Proceedings. 782. 5 indexed citations
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17.
Roberds, B. & Shari Farrens. (1996). An Atomic Force Microscopy Study on the Roughness of Silicon Wafers Correlated with Direct Wafer Bonding. Journal of The Electrochemical Society. 143(7). 2365–2371. 12 indexed citations
18.
Farrens, Shari, et al.. (1995). Chemical Free Room Temperature Wafer To Wafer Direct Bonding. Journal of The Electrochemical Society. 142(11). 3949–3955. 118 indexed citations
19.
Folta, James A., Charles E. Hunt, & Shari Farrens. (1994). Low‐Temperature Wafer Bonding of Surfaces Using a Reactive Sputtered Oxide. Journal of The Electrochemical Society. 141(8). 2157–2160. 9 indexed citations
20.
Hunt, Charles E., et al.. (1994). The Effects of Process‐Induced Defects on the Chemical Selectivity of Highly Doped Boron Etch Stops in Silicon. Journal of The Electrochemical Society. 141(1). 178–184. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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