S. Purushothaman

2.7k total citations · 1 hit paper
44 papers, 2.2k citations indexed

About

S. Purushothaman is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, S. Purushothaman has authored 44 papers receiving a total of 2.2k indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 10 papers in Mechanics of Materials. Recurrent topics in S. Purushothaman's work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (16 papers) and Semiconductor materials and devices (14 papers). S. Purushothaman is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (16 papers) and Semiconductor materials and devices (14 papers). S. Purushothaman collaborates with scholars based in United States, India and France. S. Purushothaman's co-authors include Christos Dimitrakopoulos, Agnese Callegari, John Kymissis, Ioannis Kymissis, S. K. Kang, J. A. Lacey, J. Lüning, James L. Speidell, J. Stöhr and M. G. Samant and has published in prestigious journals such as Science, Advanced Materials and Journal of Applied Physics.

In The Last Decade

S. Purushothaman

42 papers receiving 2.1k citations

Hit Papers

Low-Voltage Organic Transistors on Plastic Comprising Hig... 1999 2026 2008 2017 1999 200 400 600

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S. Purushothaman United States 14 1.8k 395 392 389 367 44 2.2k
Makoto Hikita Japan 29 1.1k 0.6× 383 1.0× 550 1.4× 621 1.6× 293 0.8× 115 2.8k
Yasushiro Nishioka Japan 28 2.3k 1.3× 243 0.6× 456 1.2× 358 0.9× 806 2.2× 197 2.7k
T. Kraft Finland 21 516 0.3× 225 0.6× 352 0.9× 419 1.1× 379 1.0× 44 1.3k
Hyunchul Sohn South Korea 22 1.2k 0.7× 178 0.5× 158 0.4× 639 1.6× 923 2.5× 140 1.9k
Chun‐Wei Pao Taiwan 25 959 0.5× 353 0.9× 241 0.6× 145 0.4× 1.2k 3.2× 76 2.0k
Torsten Rabe Germany 25 1.4k 0.8× 268 0.7× 305 0.8× 147 0.4× 730 2.0× 92 1.8k
Jani Kivioja Finland 14 949 0.5× 155 0.4× 714 1.8× 290 0.7× 547 1.5× 26 1.5k
Matthew H. Ervin United States 21 1.7k 1.0× 177 0.4× 442 1.1× 627 1.6× 662 1.8× 81 2.3k
Satoshi Yamamoto Japan 21 577 0.3× 163 0.4× 200 0.5× 294 0.8× 556 1.5× 97 1.5k
А. Н. Алешин Russia 24 1.4k 0.8× 1.3k 3.2× 639 1.6× 290 0.7× 737 2.0× 159 2.3k

Countries citing papers authored by S. Purushothaman

Since Specialization
Citations

This map shows the geographic impact of S. Purushothaman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Purushothaman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Purushothaman more than expected).

Fields of papers citing papers by S. Purushothaman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Purushothaman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Purushothaman. The network helps show where S. Purushothaman may publish in the future.

Co-authorship network of co-authors of S. Purushothaman

This figure shows the co-authorship network connecting the top 25 collaborators of S. Purushothaman. A scholar is included among the top collaborators of S. Purushothaman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Purushothaman. S. Purushothaman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Purushothaman, S., K. Jeyasubramanian, & G.S. Hikku. (2021). In-situ fabrication of sulphur decorated elongated cuboctahedron shaped Mn3O4 as high-performance active charge storage material for supercapacitor application. Surface and Coatings Technology. 426. 127782–127782. 4 indexed citations
2.
Bruce, Robert L., Sebastian Engelmann, S. Purushothaman, et al.. (2013). Investigation of plasma etch damage to porous oxycarbosilane ultra low-kdielectric. Journal of Physics D Applied Physics. 46(26). 265303–265303. 13 indexed citations
3.
Lin, Qinghuang, Alshakim Nelson, Luisa Bozano, et al.. (2011). Extending photo-patternable low-κ concept to 193nm lithography and e-beam lithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7972. 79721A–79721A. 3 indexed citations
4.
Frot, T., Willi Volksen, Teddie Magbitang, et al.. (2011). Post Porosity Plasma Protection a new approach to integrate k ≤ 2.2 porous ULK materials. 1–3. 9 indexed citations
5.
Lin, Qinghuang, Alshakim Nelson, P. J. Brock, et al.. (2010). Multilevel integration of patternable low-κ material into advanced Cu BEOL. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7639. 76390J–76390J. 2 indexed citations
6.
Yu, R., R. Polastre, L. Shi, et al.. (2006). Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding. Symposium on VLSI Technology. 170–171. 5 indexed citations
7.
Dimitrakopoulos, Christos, S. Purushothaman, John Kymissis, et al.. (2003). Organic transistors with low operating voltage and high mobility. 265. 116–119. 1 indexed citations
8.
Jackson, K.P., E.B. Flint, Amy Moll, et al.. (2003). Packaging for a 1 Gb/s OEIC fiber-optic data link. 374–377.
9.
Kang, S. K., Teresita Graham, S. Purushothaman, J.M. Roldan, & Ravi F. Saraf. (2002). New high conductivity lead (Pb)-free conducting adhesives. 177–181. 6 indexed citations
10.
Kang, S. K., et al.. (2002). Interfacial reactions with lead (Pb)-free solders. 1197–1202. 2 indexed citations
11.
Shih, Da‐Yuan, Paul Lauro, J. Paraszczak, et al.. (2002). Adhesion test standardization for multichip module packages. 16. 884–888. 3 indexed citations
12.
Narayan, C. & S. Purushothaman. (2002). Thin film transfer process for low cost MCM's. 15. 373–380.
13.
Kang, S. K., Stephen L. Buchwalter, N. LaBianca, et al.. (2001). Development of conductive adhesive materials for via fill applications. IEEE Transactions on Components and Packaging Technologies. 24(3). 431–435. 14 indexed citations
14.
Kang, Sung K. & S. Purushothaman. (1999). Development of conducting adhesive materials for microelectronic applications. Journal of Electronic Materials. 28(11). 1314–1318. 50 indexed citations
15.
Dimitrakopoulos, Christos, et al.. (1999). Low-Voltage Organic Transistors on Plastic Comprising High-Dielectric Constant Gate Insulators. Science. 283(5403). 822–824. 745 indexed citations breakdown →
16.
Callegari, Agnese, Katherina Babich, S. Purushothaman, et al.. (1998). Lithographic evaluation of a DUV carbon attenuated phase shift mask. Microelectronic Engineering. 41-42. 107–110. 4 indexed citations
17.
Callegari, Agnese, et al.. (1994). Adhesion durability of tantalum BPDA-PDA polyimide interfaces. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 12(1). 185–191. 16 indexed citations
18.
Furman, B. K., et al.. (1993). Factors Affecting Metal/Polymer Interface Durability in Microelectronics Packaging: Chemistry and Water Uptake. MRS Proceedings. 323. 4 indexed citations
19.
Lahiri, S. K., P. A. Moskowitz, Michael J. Natan, et al.. (1982). Packaging Technology for Josephson Integrated Circuits. IEEE Transactions on Components Hybrids and Manufacturing Technology. 5(2). 271–280. 6 indexed citations
20.
Purushothaman, S., et al.. (1978). Kinetics of environmental fatigue crack growth in nickel-copper alloy: Part I. In vacuum and oxygen. Metallurgical Transactions A. 9(8). 1101–1105. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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