Stan Tsai

581 total citations
23 papers, 219 citations indexed

About

Stan Tsai is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Stan Tsai has authored 23 papers receiving a total of 219 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 14 papers in Biomedical Engineering and 7 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Stan Tsai's work include Advanced Surface Polishing Techniques (14 papers), Copper Interconnects and Reliability (7 papers) and Semiconductor materials and devices (6 papers). Stan Tsai is often cited by papers focused on Advanced Surface Polishing Techniques (14 papers), Copper Interconnects and Reliability (7 papers) and Semiconductor materials and devices (6 papers). Stan Tsai collaborates with scholars based in United States, Germany and United Kingdom. Stan Tsai's co-authors include Tianbao Du, C.W. Storment, Nicholas J. Mourlas, G.T.A. Kovacs, Thomas Kim, John Heck, Samantha H. Tan, Liang Chen, Shijian Li and Lizhong Sun and has published in prestigious journals such as Journal of The Electrochemical Society, Sensors and Actuators A Physical and Ironmaking & Steelmaking Processes Products and Applications.

In The Last Decade

Stan Tsai

21 papers receiving 206 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Stan Tsai United States 9 148 142 57 49 33 23 219
R. Patlolla United States 9 229 1.5× 151 1.1× 85 1.5× 49 1.0× 55 1.7× 16 302
J. Y. Wu Taiwan 11 311 2.1× 120 0.8× 92 1.6× 30 0.6× 44 1.3× 51 354
Wahyuaji Narottama Putra Indonesia 7 233 1.6× 59 0.4× 59 1.0× 103 2.1× 25 0.8× 33 308
Gjermund Kittilsland Norway 10 210 1.4× 116 0.8× 26 0.5× 48 1.0× 44 1.3× 20 275
J. Neirynck United States 6 82 0.6× 81 0.6× 32 0.6× 34 0.7× 21 0.6× 10 123
Liuhong Ma China 10 257 1.7× 130 0.9× 26 0.5× 20 0.4× 80 2.4× 50 304
H. Yin United States 11 197 1.3× 99 0.7× 48 0.8× 68 1.4× 46 1.4× 25 290
Ricardo Cotrin Teixeira Brazil 7 140 0.9× 69 0.5× 53 0.9× 18 0.4× 21 0.6× 40 177
Y. Le Friec France 9 216 1.5× 59 0.4× 105 1.8× 16 0.3× 24 0.7× 30 246
Takeo Matsuki Japan 12 419 2.8× 77 0.5× 225 3.9× 44 0.9× 77 2.3× 85 576

Countries citing papers authored by Stan Tsai

Since Specialization
Citations

This map shows the geographic impact of Stan Tsai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Stan Tsai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Stan Tsai more than expected).

Fields of papers citing papers by Stan Tsai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Stan Tsai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Stan Tsai. The network helps show where Stan Tsai may publish in the future.

Co-authorship network of co-authors of Stan Tsai

This figure shows the co-authorship network connecting the top 25 collaborators of Stan Tsai. A scholar is included among the top collaborators of Stan Tsai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Stan Tsai. Stan Tsai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, John H., et al.. (2018). New CMP processes development and challenges for 7nm and beyond. 4. 1–5. 3 indexed citations
2.
Varghese, Alex C., P. Montanini, Spyridon Skordas, et al.. (2018). Gas cluster ion beam processing for improved self aligned contact yield at 7 nm node FinFET: MJ: MOL and junction interfaces. 208–210. 1 indexed citations
3.
Zhang, John H., Stan Tsai, C. Surisetty, et al.. (2017). CMP Challenges for Advanced Technology Nodes beyond Si. MRS Advances. 2(51). 2891–2902. 1 indexed citations
4.
Tsai, Stan, H. P. Amanapu, Ruilong Xie, et al.. (2017). CMP: Consideration of Stop-on Selectivity in Advanced Node Semiconductor Manufacturing Technology. ECS Transactions. 77(4). 169–177. 3 indexed citations
5.
Cheng, Kangguo, C. Surisetty, Raja Muthinti, et al.. (2016). Air spacer for 10nm FinFET CMOS and beyond. 17.1.1–17.1.4. 20 indexed citations
6.
Chandrasekaran, Balaji, et al.. (2012). CMP Process Control for Advanced CMOS Device Integration. ECS Transactions. 44(1). 543–552. 14 indexed citations
7.
Tsai, Stan, et al.. (2012). Removal Mechanism of Tungsten CMP Process: Effect of Slurry Abrasive Concentration and Process Temperature. ECS Transactions. 41(43). 103–111. 5 indexed citations
8.
Sivakumar, D., et al.. (2010). Real-time Control System for Improved CMP Pad Profiles. MRS Proceedings. 1249. 2 indexed citations
9.
Sivakumar, D., et al.. (2010). Method for improved CMP pad conditioning performance. 149–153. 5 indexed citations
10.
11.
Jia, Renhe, et al.. (2006). Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization. ECS Transactions. 1(11). 125–133. 6 indexed citations
12.
Du, Tianbao, et al.. (2006). Cu Planarization in Electrochemical Mechanical Planarization. Journal of The Electrochemical Society. 153(6). C377–C377. 39 indexed citations
13.
14.
Hwang, Wen-Shyang, et al.. (2003). Effects of process conditions on mixing between molten iron and slag in smelting reduction vessel via water model study. Ironmaking & Steelmaking Processes Products and Applications. 30(3). 195–202. 9 indexed citations
15.
Tsai, Stan, et al.. (2003). Copper CMP at low shear force for low-k compatibility. 102–104.
16.
Li, Ping, et al.. (2003). Copper CMP integration and time dependent pattern effect. 164–166. 10 indexed citations
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18.
19.
Mourlas, Nicholas J., C.W. Storment, Stan Tsai, et al.. (1998). PECVD silicon carbide as a chemically resistant material for micromachined transducers. Sensors and Actuators A Physical. 70(1-2). 48–55. 42 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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