W.F.A. Besling

901 citations

27 papers · 687 indexed · h-index 10

Electrical and Electronic Engineering top 10%
Materials Chemistry
Electronic, Optical and Magnetic Materials top 10%
Mechanics of Materials top 10%
Biomedical Engineering

Co-authors: Wilfried Vandervorst Thierry Conard Stefan De Gendt Marc Heyns M. Tuominen Jan Willem Maes Edward Young J. Pétry
Topics: Semiconductor materials and devices (21 papers)Copper Interconnects and Reliability (19 papers)Metal and Thin Film Mechanics (7 papers)
Cited by: Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Materials Chemistry
Journals: Journal of Applied Physics Applied Surface Science Thin Solid Films
Partner nations: France Belgium Netherlands

In The Last Decade

W.F.A. Besling

27 papers receiving 667 citations

Peers

Countries citing papers authored by W.F.A. Besling

Since Specialization

Citations

This map shows the geographic impact of W.F.A. Besling's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W.F.A. Besling with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W.F.A. Besling more than expected).

Fields of papers citing papers by W.F.A. Besling

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by W.F.A. Besling. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W.F.A. Besling. The network helps show where W.F.A. Besling may publish in the future.

Co-authorship network of co-authors of W.F.A. Besling

This figure shows the co-authorship network connecting the top 25 collaborators of W.F.A. Besling. A scholar is included among the top collaborators of W.F.A. Besling based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with W.F.A. Besling. W.F.A. Besling is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Fluidized-bed atomic layer deposition reactor for the synthesis of core-shell nanoparticles 2014 ·Review of Scientific Instruments ·(unknown),Joost Middelkoop,W.F.A. Besling,(unknown),Roel van de Krol	21
2	Dielectric Material Options for Integrated Capacitors 2014 ·ECS Journal of Solid State Science and Technology ·G. Ruhl,(unknown),Mindaugas Lukosius,Christian Wenger,(unknown),Tom Blomberg,Suvi Haukka,P. K. Baumann,W.F.A. Besling,Aarnoud L. Roest,(unknown),S. Lhostis,(unknown),F. Roozeboom,E. Langereis,W. M. M. Kessels,A. Zauner,S. Rushworth	8
3	Challenges for Interconnect of Future CMOS Generations : Implementation of Emerging Processes and Alternative Architectures 2006 ·ECS Meeting Abstracts ·V. Arnal,L.G. Gosset,W.F.A. Besling,A. Farcy,L.L. Chapelon,(unknown),(unknown),(unknown),(unknown),C. Guedj,(unknown),(unknown)	1
4	Integration of multi-level self-aligned CoWP barrier compatible with high performance BEOL 2006 ·(unknown),A. Margain,(unknown),(unknown),J.C. Dupuy,(unknown),L.G. Gosset,W.F.A. Besling,(unknown),P. Brun,(unknown),M. Mellier,(unknown),(unknown)	2
5	Correlation between electromigration and Cu-contact angle after de-wetting 2006 ·Microelectronic Engineering ·(unknown),(unknown),Thierry Mourier,W.F.A. Besling,(unknown),J. Torrès	10
6	Copper alloy seed integration for reliability improvement 2005 ·Microelectronic Engineering ·W.F.A. Besling,X. Federspiel,(unknown),(unknown)	7
7	Integration of ALD TaN barriers in porous low-k interconnect for the 45 nm node and beyond; solution to relax electron scattering effect 2005 ·W.F.A. Besling,(unknown),(unknown),C. Guedj,M. Broekaart,L.L. Chapelon,A. Farcy,L. Arnaud,J. Torres	2
8	Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics 2005 ·R.J.O.M. Hoofman,(unknown),(unknown),R. Daamen,(unknown),V. Arnal,(unknown),L.G. Gosset,A. Humbert,W.F.A. Besling,Cindy Goldberg,Robert Fox,(unknown),C. Guedj,(unknown),V. Jousseaume,L. Arnaud,(unknown),J. Torrès,G. Passemard	8
9	Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact 2005 ·A. Farcy,O. Cueto,B. Blampey,V. Arnal,L.G. Gosset,W.F.A. Besling,(unknown),T. Lacrevaz,C. Bermond,B. Fléchet,(unknown),F. de Crécy,(unknown),J. Torres	2
10	Copper metallization for advanced interconnects: the electrochemical revolution 2004 ·Paul‐Henri Haumesser,(unknown),S. Maı̂trejean,Thierry Mourier,L.G. Gosset,W.F.A. Besling,G. Passemard,J. Torrès	3
11	Line resistance behaviour in narrow lines patterned by a TiN hard mask spacer for 45 nm node interconnects 2004 ·Microelectronic Engineering ·W.F.A. Besling,M. Broekaart,V. Arnal,J. Torrès	8
12	Island growth in the atomic layer deposition of zirconium oxide and aluminum oxide on hydrogen-terminated silicon: Growth mode modeling and transmission electron microscopy 2004 ·Journal of Applied Physics ·Riikka L. Puurunen,Wilfried Vandervorst,W.F.A. Besling,Olivier Richard,H. Bender,Thierry Conard,Chao Zhao,Annelies Delabie,Matty Caymax,Stefan De Gendt,Marc Heyns,M. Viitanen,M. de Ridder,Hidde H. Brongersma,Y. Tamminga,(unknown),(unknown),Marcel A. Verheijen,M. Kaiser,M. Tuominen	127
13	Atomic layer deposition of barriers for interconnect 2003 ·W.F.A. Besling,A. Satta,Jörg Schuhmacher,Thomas Abell,(unknown),(unknown),Gerald Beyer,(unknown),Karen Maex	4
14	Characterisation of ALCVD Al2O3–ZrO2 nanolaminates, link between electrical and structural properties 2002 ·Journal of Non-Crystalline Solids ·W.F.A. Besling,Edward Young,Thierry Conard,Chao Zhao,(unknown),Wilfried Vandervorst,Matty Caymax,Stefan De Gendt,Marc Heyns,Jan Willem Maes,M. Tuominen,Suvi Haukka	77
15	Precursor penetration and sealing for CVD SiCOH low k dielectric during atomic layer deposition of WCN barrier 2002 ·Thomas Abell,Denis Shamiryan,Jörg Schuhmacher,W.F.A. Besling,(unknown),Karen Maex	1
16	Diffusion Barrier Deposition on a Copper Surface by Atomic Layer Deposition 2002 ·Chemical Vapor Deposition ·Kai‐Erik Elers,(unknown),P. Soininen,(unknown),(unknown),Suvi Haukka,J. Juhanoja,W.F.A. Besling	79
17	Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects 2002 ·Microelectronic Engineering ·Gerald Beyer,A. Satta,Jörg Schuhmacher,Karen Maex,W.F.A. Besling,(unknown),(unknown),G. Tempel	37
18	Physical characterisation of high-k gate stacks deposited on HF-last surfaces 2002 ·H. Bender,Thierry Conard,Hiroshi Nohira,J. Pétry,Olivier Richard,Chao Zhao,Bert Brijs,W.F.A. Besling,Christophe Detavernier,Wilfried Vandervorst,Matty Caymax,Stefan De Gendt,(unknown),J. Kluth,Wei‐Bor Tsai,Jan Willem Maes	6
19	Characterization of TiN films deposited by atomic layer deposition 2002 ·W.F.A. Besling,A. Satta,Jörg Schuhmacher,Gerald Beyer,Karen Maex,(unknown),(unknown)	2
20	TOF-SIMS as a rapid diagnostic tool to monitor the growth mode of thin (high k) films 2002 ·Applied Surface Science ·Thierry Conard,Wilfried Vandervorst,J. Pétry,Chao Zhao,W.F.A. Besling,Hiroshi Nohira,Olivier Richard	15

About W.F.A. Besling

W.F.A. Besling is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Mechanics of Materials, having authored 27 papers that have together received 687 indexed citations. Recurring topics across this work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (19 papers) and Metal and Thin Film Mechanics (7 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (216 citations), Electrical and Electronic Engineering (551 citations) and Materials Chemistry (348 citations). W.F.A. Besling has collaborated with scholars based in France, Belgium and Netherlands. Frequent co-authors include Wilfried Vandervorst, Thierry Conard, Stefan De Gendt, Marc Heyns, M. Tuominen, Jan Willem Maes, Edward Young, J. Pétry, Hiroshi Nohira and Suvi Haukka. Their work appears in journals such as Journal of Applied Physics, Applied Surface Science and Thin Solid Films.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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