T. Sparks

617 total citations
25 papers, 312 citations indexed

About

T. Sparks is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, T. Sparks has authored 25 papers receiving a total of 312 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. Recurrent topics in T. Sparks's work include Semiconductor materials and devices (12 papers), Copper Interconnects and Reliability (8 papers) and Plasma Diagnostics and Applications (8 papers). T. Sparks is often cited by papers focused on Semiconductor materials and devices (12 papers), Copper Interconnects and Reliability (8 papers) and Plasma Diagnostics and Applications (8 papers). T. Sparks collaborates with scholars based in United States, Russia and France. T. Sparks's co-authors include Victor Vartanian, R. Reif, Shahid Rauf, Peter L. G. Ventzek, Ritwik Chatterjee, Victoria Andino-Pavlovsky, В. В. Смирнов, Da Zhang, M. Petras and M. Miller and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Japanese Journal of Applied Physics.

In The Last Decade

T. Sparks

22 papers receiving 298 citations

Peers

T. Sparks

EEE

EOMM

J. W. Lee United States

O.V. Braginsky Russia

T.L. McDevitt United States

Hiroko Tashiro Japan

Yu. N. Pyrkov Russia

S. G. Demos United States

R. P. Devaty United States

A I Zotovich Russia

R. Korenstein United States

E. Bouquerel France

J. W. Lee United States

T. Sparks

258 ×0.9

EEE

79 ×1.0

67 ×0.9

52 ×0.8

EOMM

46 ×1.4

Citations per year, relative to T. Sparks T. Sparks (= 1×) peers J. W. Lee

Countries citing papers authored by T. Sparks

Since Specialization

Citations

This map shows the geographic impact of T. Sparks's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Sparks with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Sparks more than expected).

Fields of papers citing papers by T. Sparks

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T. Sparks. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Sparks. The network helps show where T. Sparks may publish in the future.

Co-authorship network of co-authors of T. Sparks

This figure shows the co-authorship network connecting the top 25 collaborators of T. Sparks. A scholar is included among the top collaborators of T. Sparks based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T. Sparks. T. Sparks is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Rauf, Shahid, et al.. (2007). A molecular dynamics investigation of fluorocarbon based layer-by-layer etching of silicon and SiO2. Journal of Applied Physics. 101(3). 77 indexed citations

Sparks, T., et al.. (2006). Salinity Investment Framework, Phase II. UWA Profiles and Research Repository (University of Western Australia). 5 indexed citations

Monfray, S., D. Chanemougame, S. Borel, et al.. (2005). SON (silicon-on-nothing) technological CMOS platform: highly performant devices and SRAM cells. 635–638. 17 indexed citations

Gall, M., D. Jawarani, D. Menke, et al.. (2003). A comparison of via overetch variations between conventional Al-W and dual-inlaid copper integrations. 106–108. 1 indexed citations

Martin, Jeremy I., Fanghao Huang, Linlin Zhao, et al.. (2003). Integration of SiCN as a low κ etch stop and Cu passivation in a high performance Cu/low κ interconnect. 42–44. 9 indexed citations

Zürcher, P., Peir-Yung Chu, Rashaunda Henderson, et al.. (2002). Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies. 153–156. 41 indexed citations

Venkatesan, S., et al.. (2002). A 0.20 μm CMOS technology with copper-filled contact and local interconnect. 22–23. 3 indexed citations

Reuss, Robert H., et al.. (2002). Introduction of BiCMOS into a production CMOS facility. 33. 69–71. 3 indexed citations

Chatterjee, Ritwik, et al.. (2002). The Use of Unsaturated Fluorocarbons for Dielectric Etch Applications. Journal of The Electrochemical Society. 149(4). G276–G276. 33 indexed citations

10.

Reuss, Robert H., et al.. (2002). Introduction of BiCMOS into a production CMOS facility. 58–60. 1 indexed citations

11.

Chatterjee, Ritwik, et al.. (2001). The Evaluation of Hexafluorobenzene as an Environmentally Benign Dielectric Etch Chemistry. Journal of The Electrochemical Society. 148(12). G721–G721. 11 indexed citations

12.

Chatterjee, Ritwik, et al.. (2001). Characterization of iodoheptafluoropropane as a dielectric etchant. II. Wafer surface analysis. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 19(4). 1293–1305. 1 indexed citations

13.

Chatterjee, Ritwik, et al.. (2001). Characterization of iodoheptafluoropropane as a dielectric etchant. I. Process performance evaluation. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 19(4). 1269–1292. 3 indexed citations

14.

Chatterjee, Ritwik, et al.. (2001). Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool. Journal of The Electrochemical Society. 148(3). G141–G141. 15 indexed citations

15.

Chatterjee, Ritwik, et al.. (2001). Characterization of iodoheptafluoropropane as a dielectric etchant. III. Effluent analysis. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 19(4). 1306–1318. 5 indexed citations

16.

Chatterjee, Ritwik, et al.. (2000). High density plasma oxide etching using nitrogen trifluoride and acetylene. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 18(6). 2749–2758. 8 indexed citations

17.

Chatterjee, Ritwik, et al.. (2000). Evaluation of Pentafluoroethane and 1,1-Difluoroethane for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool. Japanese Journal of Applied Physics. 39(7S). 4666–4666. 9 indexed citations

18.

Sparks, T., et al.. (1980). A base-metal conductor system for silicon solar cells. Photovoltaic Specialists Conference. 793–799.

19.

Sparks, T., et al.. (1980). A reactive plasma process for forming metal grid patterns in solar cell antireflection coatings. Photovoltaic Specialists Conference. 783–786.

20.

Sparks, T., et al.. (1978). The Pd2Si - /Pd/ - Ni - solder plated metallization system for silicon solar cells. Photovoltaic Specialists Conference. 597–602. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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