A. Upham

584 total citations
6 papers, 106 citations indexed

About

A. Upham is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, A. Upham has authored 6 papers receiving a total of 106 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 3 papers in Mechanics of Materials and 3 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in A. Upham's work include Semiconductor materials and devices (4 papers), Copper Interconnects and Reliability (3 papers) and Metal and Thin Film Mechanics (3 papers). A. Upham is often cited by papers focused on Semiconductor materials and devices (4 papers), Copper Interconnects and Reliability (3 papers) and Metal and Thin Film Mechanics (3 papers). A. Upham collaborates with scholars based in United States. A. Upham's co-authors include Alain E. Kaloyeros, Barry Arkles, Cindy Goldberg, Gregory M. Peterson, Ajit Paranjpe, D. Manger, J.J. Welser, J.D. Schaub, Qingyun Yang and Min Yang and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Electron Device Letters and Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena.

In The Last Decade

A. Upham

5 papers receiving 104 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
A. Upham United States	5	89	51	35	21	16	6	106
C. Richard France	7	137 1.5×	22 0.4×	31 0.9×	23 1.1×	13 0.8×	18	150
A.H. Montree Netherlands	7	235 2.6×	64 1.3×	29 0.8×	34 1.6×	37 2.3×	27	270
J. Mogab United States	8	209 2.3×	20 0.4×	18 0.5×	26 1.2×	19 1.2×	12	211
Rich Wise United States	5	184 2.1×	36 0.7×	21 0.6×	54 2.6×	25 1.6×	16	194
S.L. Shue Taiwan	7	116 1.3×	31 0.6×	79 2.3×	48 2.3×	26 1.6×	21	143
C. Penny United States	6	74 0.8×	16 0.3×	54 1.5×	19 0.9×	13 0.8×	9	104
Catherine Shearer United States	5	58 0.7×	11 0.2×	15 0.4×	34 1.6×	14 0.9×	13	94
Seiji Inumiya Japan	9	286 3.2×	26 0.5×	27 0.8×	42 2.0×	17 1.1×	47	302
Ihor Brunets Netherlands	7	105 1.2×	11 0.2×	12 0.3×	50 2.4×	22 1.4×	26	118
Jim Horwitz United States	2	30 0.3×	24 0.5×	12 0.3×	41 2.0×	15 0.9×	4	75

Countries citing papers authored by A. Upham

Since Specialization

Citations

This map shows the geographic impact of A. Upham's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Upham with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Upham more than expected).

Fields of papers citing papers by A. Upham

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. Upham. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Upham. The network helps show where A. Upham may publish in the future.

Co-authorship network of co-authors of A. Upham

This figure shows the co-authorship network connecting the top 25 collaborators of A. Upham. A scholar is included among the top collaborators of A. Upham based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with A. Upham. A. Upham is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

6 of 6 papers shown

1.

Skordas, Spyridon, Douglas Charles La Tulipe, Deepika Priyadarshini, et al.. (2012). Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration. 203–208. 6 indexed citations

2.

Yang, Min, D.L. Rogers, J.D. Schaub, et al.. (2002). A high-speed, high-sensitivity silicon lateral trench photodetector. IEEE Electron Device Letters. 23(7). 395–397. 35 indexed citations

3.

Eisenbraun, Eric, A. Upham, Raj Kishora Dash, et al.. (2000). Low temperature inorganic chemical vapor deposition of Ti–Si–N diffusion barrier liners for gigascale copper interconnect applications. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 18(4). 2011–2015. 17 indexed citations

4.

Goldberg, Cindy, A. Upham, Andreas Knorr, et al.. (1998). The Effects of Processing Parameters in the Low‐Temperature Chemical Vapor Deposition of Titanium Nitride from Tetraiodotitanium. Journal of The Electrochemical Society. 145(2). 676–683. 10 indexed citations

5.

Goldberg, Cindy, A. Upham, D. Manger, et al.. (1997). Barrier Properties of Titanium Nitride Films Grown by Low Temperature Chemical Vapor Deposition from Titanium Tetraiodide. Journal of The Electrochemical Society. 144(3). 1002–1008. 37 indexed citations

6.

Goldberg, Cindy, A. Upham, D. Manger, et al.. (1997). ChemInform Abstract: Barrier Properties of Titanium Nitride Films Grown by Low Temperature Chemical Vapor Deposition from Titanium Tetraiodide.. ChemInform. 28(26). 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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