L.L. Mercado
- Electrical and Electronic Engineering top 10%
- Mechanics of Materials top 10%
- Mechanical Engineering
- Electronic, Optical and Magnetic Materials
- Biomedical Engineering
- Topics
- Electronic Packaging and Soldering Technologies (32 papers)3D IC and TSV technologies (17 papers)Integrated Circuits and Semiconductor Failure Analysis (8 papers)
- Cited by
- Electrical and Electronic EngineeringMechanics of MaterialsElectronic, Optical and Magnetic Materials
- Journals
- IEEE Transactions on Components and Packaging TechnologiesIEEE Transactions on Device and Materials ReliabilityIEEE Transactions on Advanced Packaging
- Partner nations
- United StatesGermanyTaiwan
In The Last Decade
L.L. Mercado
36 papers receiving 588 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 544
- Mechanics of Materials 166
- Mechanical Engineering 147
- Electronic, Optical and Magnetic Materials 111
- Biomedical Engineering 104
Countries citing papers authored by L.L. Mercado
This map shows the geographic impact of L.L. Mercado's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.L. Mercado with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.L. Mercado more than expected).
Fields of papers citing papers by L.L. Mercado
This network shows the impact of papers produced by L.L. Mercado. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.L. Mercado. The network helps show where L.L. Mercado may publish in the future.
Co-authorship network of co-authors of L.L. Mercado
This figure shows the co-authorship network connecting the top 25 collaborators of L.L. Mercado. A scholar is included among the top collaborators of L.L. Mercado based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.L. Mercado. L.L. Mercado is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 10 | |
| 2 | 16 | |
| 3 | 32 | |
| 4 | 26 | |
| 5 | 30 | |
| 6 | 39 | |
| 7 | 3 | |
| 8 | 14 | |
| 9 | 25 | |
| 10 | 69 | |
| 11 | 2 | |
| 12 | 4 | |
| 13 | 4 | |
| 14 | 11 | |
| 15 | 7 | |
| 16 | 3 | |
| 17 | 2 | |
| 18 | 8 | |
| 19 | 28 | |
| 20 | 14 |
About L.L. Mercado
L.L. Mercado is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, having authored 37 papers that have together received 618 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (17 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (544 citations), Mechanics of Materials (166 citations) and Electronic, Optical and Magnetic Materials (111 citations). L.L. Mercado has collaborated with scholars based in United States, Germany and Taiwan. Frequent co-authors include V. Sarihan, Cindy Goldberg, D. R. Frear, Scott Pozder, S.-M. Kuo, Yifan Guo, Lianjun Liu, Lei Liu, W. W. Gerberich and Alex A. Volinsky. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Device and Materials Reliability and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.